US6583040B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making a pillar in a laminated structure for a semiconductor chip assembly
Assignee: Bridge Semiconductor Corp
•
Filing: 2002-05-28
•
Granted: 2003-06-24
•
Expires: 2022-05-28
Abstract
Abstract A method of making a semiconductor chip assembly includes providing a semiconductor chip and a laminated structure, wherein the chip includes a conductive pad, the laminated structure includes a conductive trace, an insulative base and a metal base, the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base, removing a portion of the metal base that contacts the pillar, and forming a connection joint that contacts and electrically connects the conductive trace and the pad.
Inventors
- 👤 Charles W. C. Lin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 18:08
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/099; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W74/129; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4046; H10W72/00; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/019; H10W72/071; H10W72/073; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/90; H10W72/921; H10W72/922; H10W72/923; H10W72/941; H10W72/9415; H10W90/00
Claims Analysis
Total Claims: 218
Claim 1
Independent Claim
109 words
A method of making a semiconductor chip assembly, comprising: providing a semiconductor chip and a laminated structure, wherein the chip includes a conductive pad, the laminated structure includes a conductive trace, an insulative base and a metal base, the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base; removing a portion of the metal base that contacts the pillar; and forming a connection joint that contacts and electrically connects the conductive trace and the pad.
Claim 2
Independent Claim
109 words
A method of making a semiconductor chip assembly, comprising: providing a semiconductor chip and a laminated structure, wherein the chip includes a conductive pad, the laminated structure includes a conductive trace, an insulative base and a metal base, the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base; removing a portion of the metal base that contacts the pillar; and forming a connection joint that contacts and electrically connects the conductive trace and the pad.
Claim 3
Dependent Claim
27 words
The method of claim 1 , including mechanically attaching the chip to the conductive trace using an insulative adhesive before removing the portion of the metal base.
Claim 4
Dependent Claim
41 words
The method of claim 2 , including forming a through-hole that extends through the insulative base and the adhesive and exposes the conductive trace and the pad after removing the portion of the metal base and before forming the connection joint.
Claim 5
Dependent Claim
43 words
The method of claim 3 , wherein the adhesive contacts and is sandwiched between the conductive trace and the pad, and the conductive trace and the pad are electrically isolated from one another after forming the through-hole and before forming the connection joint.
Claim 6
Dependent Claim
21 words
The method of claim 1 , wherein the pillar extends into and contacts sidewalls of an opening in the routing line.
Claim 7
Dependent Claim
13 words
The method of claim 1 , wherein the pillar has straight vertical sidewalls.
Claim 8
Dependent Claim
14 words
The method of claim 1 , wherein the pillar is solder or conductive adhesive.
Claim 9
Dependent Claim
25 words
The method of claim 1 , wherein the routing line and the metal base are a first material and the pillar is a second material.
Claim 10
Dependent Claim
21 words
The method of claim 8 , wherein the first material is copper and the second material is solder or conductive adhesive.
Claim 11
Dependent Claim
17 words
The method of claim 1 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 12
Independent Claim
166 words
A method of making a semiconductor chip assembly, comprising: providing a semiconductor chip that includes a conductive pad; providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base; then disposing an insulative adhesive between the chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure such that the metal base is disposed on a side of the insulative base that faces away from the chip and the routing line is disposed on a side of the insulative base that faces towards the chip; then removing a portion of the metal base that contacts the pillar; and forming a connection joint that contacts and electrically connects the conductive trace and the pad.
Claim 13
Independent Claim
166 words
A method of making a semiconductor chip assembly, comprising: providing a semiconductor chip that includes a conductive pad; providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base; then disposing an insulative adhesive between the chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure such that the metal base is disposed on a side of the insulative base that faces away from the chip and the routing line is disposed on a side of the insulative base that faces towards the chip; then removing a portion of the metal base that contacts the pillar; and forming a connection joint that contacts and electrically connects the conductive trace and the pad.
Claim 14
Dependent Claim
41 words
The method of claim 11 , including forming a through-hole that extends through the insulative base and the adhesive and exposes the conductive trace and the pad after removing the portion of the metal base and before forming the connection joint.
Claim 15
Dependent Claim
45 words
The method of claim 11 , wherein the routing line overlaps the pad and extends within and outside a periphery of the chip, the pillar is disposed outside the periphery of the chip, and the pillar extends across the opposite sides of the insulative base.
Claim 16
Dependent Claim
51 words
The method of claim 11 , wherein forming the pillar includes: forming a via that extends through the insulative base and into the metal base; and then depositing an electrically conductive material into the via, wherein the electrically conductive material in the via contacts the insulative base and the metal base.
Claim 17
Dependent Claim
13 words
The method of claim 14 , wherein the electrically conductive material includes solder.
Claim 18
Dependent Claim
14 words
The method of claim 14 , wherein the electrically conductive material includes conductive adhesive.
Claim 19
Dependent Claim
18 words
The method of claim 11 , wherein removing the portion of the metal base exposes the insulative base.
Claim 20
Dependent Claim
31 words
The method of claim 11 , wherein removing the portion of the metal base exposes straight vertical sidewalls of the pillar that extend from the insulative base away from the chip.
Claim 21
Dependent Claim
36 words
The method of claim 11 , wherein the pillar is the only electrical conductor that is electrically connected to the pad and extends to the side of the insulative base that faces away from the chip.
Claim 22
Dependent Claim
17 words
The method of claim 11 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 23
Independent Claim
186 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base; then disposing an insulative adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base; removing a portion of the metal base that contacts the pillar; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 24
Independent Claim
186 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base; then disposing an insulative adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base; removing a portion of the metal base that contacts the pillar; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 25
Dependent Claim
51 words
The method of claim 21 , wherein forming the pillar includes: forming a via that extends through the insulative base and into the metal base; and then depositing an electrically conductive material into the via, wherein the electrically conductive material in the via contacts the insulative base and the metal base.
Claim 26
Dependent Claim
18 words
The method of claim 22 , wherein the via extends through the metal base and the routing line.
Claim 27
Dependent Claim
22 words
The method of claim 22 , wherein the via extends through the metal base and into but not through the routing line.
Claim 28
Dependent Claim
22 words
The method of claim 22 , wherein the via extends through the routing line and into but not through the metal base.
Claim 29
Dependent Claim
14 words
The method of claim 22 , wherein the electrically conductive material is solder paste.
Claim 30
Dependent Claim
14 words
The method of claim 22 , wherein the electrically conductive material is conductive adhesive.
Claim 31
Dependent Claim
41 words
The method of claim 21 , wherein the pillar is the only electrical conductor that is electrically connected to the pad and extends to the side of the insulative base that faces away from the chip after forming the connection joint.
Claim 32
Dependent Claim
32 words
The method of claim 21 , wherein removing the portion of the metal base includes applying a wet chemical etch that is selective of the metal base with respect to the pillar.
Claim 33
Dependent Claim
17 words
The method of claim 21 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 34
Independent Claim
216 words
A method of making a semiconductor chip assembly, comprising the following steps in the sequence set forth: providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base; disposing an insulative adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base; removing portions of the metal base that overlap the pad and contact the pillar; forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 35
Independent Claim
216 words
A method of making a semiconductor chip assembly, comprising the following steps in the sequence set forth: providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base; disposing an insulative adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base; removing portions of the metal base that overlap the pad and contact the pillar; forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 36
Dependent Claim
51 words
The method of claim 31 , wherein forming the pillar includes: forming a via that extends through the insulative base and into the metal base; and then depositing an electrically conductive material into the via, wherein the electrically conductive material in the via contacts the insulative base and the metal base.
Claim 37
Dependent Claim
18 words
The method of claim 32 , wherein the via extends through the metal base and the routing line.
Claim 38
Dependent Claim
22 words
The method of claim 32 , wherein the via extends through the metal base and into but not through the routing line.
Claim 39
Dependent Claim
22 words
The method of claim 32 , wherein the via extends through the routing line and into but not through the metal base.
Claim 40
Dependent Claim
14 words
The method of claim 32 , wherein the electrically conductive material is solder paste.
Claim 41
Dependent Claim
14 words
The method of claim 32 , wherein the electrically conductive material is conductive adhesive.
Claim 42
Dependent Claim
41 words
The method of claim 31 , wherein the pillar is the only electrical conductor that is electrically connected to the pad and extends to the side of the insulative base that faces away from the chip after forming the connection joint.
Claim 43
Dependent Claim
32 words
The method of claim 31 , wherein removing the portions of the metal base includes applying a wet chemical etch that is selective of the metal base with respect to the pillar.
Claim 44
Dependent Claim
17 words
The method of claim 31 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 45
Independent Claim
290 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer; depositing a non-solidified material into the via; hardening the non-solidified material to form a pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer; providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer; applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer; then mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line; removing a portion of the metal base that contacts the pillar, wherein the pillar extends beyond the insulative base in a direction away from the chip; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 46
Independent Claim
290 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer; depositing a non-solidified material into the via; hardening the non-solidified material to form a pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer; providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer; applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer; then mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line; removing a portion of the metal base that contacts the pillar, wherein the pillar extends beyond the insulative base in a direction away from the chip; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 47
Dependent Claim
13 words
The method of claim 41 , wherein forming the via includes mechanical drilling.
Claim 48
Dependent Claim
30 words
The method of claim 41 , wherein depositing the non-solidified material includes depositing solder paste that contacts the metal base, the insulative base and the metal layer in the via.
Claim 49
Dependent Claim
30 words
The method of claim 41 , wherein depositing the non-solidified material includes depositing conductive adhesive that contacts the metal base, the insulative base and the metal layer in the via.
Claim 50
Dependent Claim
35 words
The method of claim 41 , wherein providing the etch mask includes depositing a photoresist layer on the metal layer and selectively patterning the photoresist layer after forming the via and before forming the pillar.
Claim 51
Dependent Claim
44 words
The method of claim 41 , wherein removing the portion of the metal base includes applying a wet chemical etch that is highly selective of the metal base with respect to the insulative base and the pillar and removes all of the metal base.
Claim 52
Dependent Claim
14 words
The method of claim 41 , wherein the via extends through the metal base.
Claim 53
Dependent Claim
14 words
The method of claim 41 , wherein the via extends through the routing line.
Claim 54
Dependent Claim
18 words
The method of claim 41 , wherein the via extends through the metal base and the routing line.
Claim 55
Dependent Claim
17 words
The method of claim 41 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 56
Independent Claim
354 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer; depositing a non-solidified material into the via; hardening the non-solidified material to form a pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer; providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer; applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer; and then, in the sequence set forth, mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, the routing line overlaps the pad and extends within and outside a periphery of the chip, and the pillar contacts the routing line and is disposed outside the periphery of the chip; removing a first portion of the metal base that overlaps the pad and a second portion of the metal base that contacts the pillar, wherein the pillar extends beyond the insulative base in a direction away from the chip; forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 57
Independent Claim
354 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer; depositing a non-solidified material into the via; hardening the non-solidified material to form a pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer; providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer; applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer; and then, in the sequence set forth, mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, the routing line overlaps the pad and extends within and outside a periphery of the chip, and the pillar contacts the routing line and is disposed outside the periphery of the chip; removing a first portion of the metal base that overlaps the pad and a second portion of the metal base that contacts the pillar, wherein the pillar extends beyond the insulative base in a direction away from the chip; forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 58
Dependent Claim
13 words
The method of claim 51 , wherein forming the via includes mechanical drilling.
Claim 59
Dependent Claim
30 words
The method of claim 51 , wherein depositing the non-solidified material includes depositing solder paste that contacts the metal base, the insulative base and the metal layer in the via.
Claim 60
Dependent Claim
30 words
The method of claim 51 , wherein depositing the non-solidified material includes depositing conductive adhesive that contacts the metal base, the insulative base and the metal layer in the via.
Claim 61
Dependent Claim
35 words
The method of claim 51 , wherein providing the etch mask includes depositing a photoresist layer on the metal layer and selectively patterning the photoresist layer after forming the via and before forming the pillar.
Claim 62
Dependent Claim
47 words
The method of claim 51 , wherein removing the first and second portions of the metal base includes applying a wet chemical etch that is highly selective of the metal base with respect to the insulative base and the pillar and removes all of the metal base.
Claim 63
Dependent Claim
14 words
The method of claim 51 , wherein the via extends through the metal base.
Claim 64
Dependent Claim
14 words
The method of claim 51 , wherein the via extends through the routing line.
Claim 65
Dependent Claim
18 words
The method of claim 51 , wherein the via extends through the metal base and the routing line.
Claim 66
Dependent Claim
17 words
The method of claim 51 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 67
Independent Claim
214 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the insulative base and reaches the metal base and the metal layer; forming a routing line from a first portion of the metal layer by selectively removing a second portion of the metal layer; forming a pillar in the via, wherein the pillar extends through the insulative base and contacts the metal base, the insulative base and the metal layer in the via; then mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line; then removing a portion of the metal base that contacts the pillar; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 68
Independent Claim
214 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the insulative base and reaches the metal base and the metal layer; forming a routing line from a first portion of the metal layer by selectively removing a second portion of the metal layer; forming a pillar in the via, wherein the pillar extends through the insulative base and contacts the metal base, the insulative base and the metal layer in the via; then mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line; then removing a portion of the metal base that contacts the pillar; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 69
Dependent Claim
14 words
The method of claim 61 , wherein the via extends into the metal base.
Claim 70
Dependent Claim
14 words
The method of claim 61 , wherein the via extends through the metal base.
Claim 71
Dependent Claim
14 words
The method of claim 61 , wherein the via extends into the routing line.
Claim 72
Dependent Claim
14 words
The method of claim 61 , wherein the via extends through the routing line.
Claim 73
Dependent Claim
22 words
The method of claim 61 , wherein the via extends through the metal base and into but not through the routing line.
Claim 74
Dependent Claim
22 words
The method of claim 61 , wherein the via extends through the routing line and into but not through the metal base.
Claim 75
Dependent Claim
18 words
The method of claim 61 , wherein the via extends through the metal base and the routing line.
Claim 76
Dependent Claim
13 words
The method of claim 61 , wherein forming the via includes mechanical drilling.
Claim 77
Dependent Claim
13 words
The method of claim 61 , wherein forming the via includes mechanical punching.
Claim 78
Dependent Claim
13 words
The method of claim 61 , wherein forming the via includes laser drilling.
Claim 79
Dependent Claim
14 words
The method of claim 61 , wherein forming the via includes wet chemical etching.
Claim 80
Dependent Claim
39 words
The method of claim 61 , wherein forming the pillar includes depositing a non-solidified material into the via that contacts the metal base, the insulative base and the metal layer in the via and then hardening the non-solidified material.
Claim 81
Dependent Claim
38 words
The method of claim 61 , wherein forming the pillar includes depositing solder paste into the via that contacts the metal base, the insulative base and the metal layer in the via and then reflowing the solder paste.
Claim 82
Dependent Claim
38 words
The method of claim 61 , wherein forming the pillar includes depositing conductive adhesive into the via that contacts the metal base, the insulative base and the metal layer in the via and then curing the conductive adhesive.
Claim 83
Dependent Claim
39 words
The method of claim 61 , wherein removing the portion of the metal base includes applying a wet chemical etch that is selective of the metal base with respect to the pillar and removes all of the metal base.
Claim 84
Dependent Claim
37 words
The method of claim 61 , including forming an encapsulant on the chip, the insulative base and the routing line after attaching the chip to the laminated structure and before removing the portion of the metal base.
Claim 85
Dependent Claim
16 words
The method of claim 61 , wherein the steps are performed in the sequence set forth.
Claim 86
Dependent Claim
39 words
The method of claim 61 , wherein the metal base and the metal layer are copper, the pillar is solder or conductive adhesive, the insulative base is primarily polyimide or epoxy, and the adhesive is primarily polyimide or epoxy.
Claim 87
Dependent Claim
17 words
The method of claim 61 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 88
Independent Claim
236 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the metal base, the insulative base and the metal layer; forming a conductive trace that includes a routing line and a pillar, wherein the routing line and the pillar are different materials, the routing line is formed from an unetched portion of the metal layer, and the pillar contacts the metal base, the insulative base and the routing line in the via, extends across the opposite sides of the insulative base, and extends into the metal base and the routing line; then mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip; removing a portion of the metal base that contacts the pillar, wherein the pillar includes an exposed protruding portion that extends beyond the insulative base in a direction away from the chip; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 89
Independent Claim
236 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the metal base, the insulative base and the metal layer; forming a conductive trace that includes a routing line and a pillar, wherein the routing line and the pillar are different materials, the routing line is formed from an unetched portion of the metal layer, and the pillar contacts the metal base, the insulative base and the routing line in the via, extends across the opposite sides of the insulative base, and extends into the metal base and the routing line; then mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip; removing a portion of the metal base that contacts the pillar, wherein the pillar includes an exposed protruding portion that extends beyond the insulative base in a direction away from the chip; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 90
Dependent Claim
17 words
The method of claim 81 , wherein the pillar is disposed within a periphery of the chip.
Claim 91
Dependent Claim
17 words
The method of claim 81 , wherein the pillar is disposed outside a periphery of the chip.
Claim 92
Dependent Claim
11 words
The method of claim 81 , wherein the pillar is solder.
Claim 93
Dependent Claim
12 words
The method of claim 81 , wherein the pillar is conductive adhesive.
Claim 94
Dependent Claim
16 words
The method of claim 81 , wherein the metal base and the metal layer are copper.
Claim 95
Dependent Claim
11 words
The method of claim 86 , wherein the pillar is solder.
Claim 96
Dependent Claim
12 words
The method of claim 86 , wherein the pillar is conductive adhesive.
Claim 97
Dependent Claim
16 words
The method of claim 81 , wherein the steps are performed in the sequence set forth.
Claim 98
Dependent Claim
17 words
The method of claim 81 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 99
Independent Claim
305 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the metal base, the insulative base and the metal layer and has open opposing ends; providing a plug that seals the via at one end such that the via has a sealed end and an unsealed end; depositing an electrically conductive material into the via from the unsealed end while the plug provides the sealed end, wherein the electrically conductive material contacts the plug, the metal base, the insulative base and the metal layer in the via; removing the plug; forming a conductive trace that includes a routing line and a pillar, wherein the routing line is formed from an unetched portion of the metal layer, the pillar is formed from the electrically conductive material, and the pillar contacts the metal base, the insulative base and the routing line in the via, extends across the opposite sides of the insulative base, and extends into the metal base and the routing line; mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip; removing a portion of the metal base that contacts the pillar, wherein the pillar includes an exposed protruding portion that extends beyond the insulative base in a direction away from the chip; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 100
Independent Claim
305 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the metal base, the insulative base and the metal layer and has open opposing ends; providing a plug that seals the via at one end such that the via has a sealed end and an unsealed end; depositing an electrically conductive material into the via from the unsealed end while the plug provides the sealed end, wherein the electrically conductive material contacts the plug, the metal base, the insulative base and the metal layer in the via; removing the plug; forming a conductive trace that includes a routing line and a pillar, wherein the routing line is formed from an unetched portion of the metal layer, the pillar is formed from the electrically conductive material, and the pillar contacts the metal base, the insulative base and the routing line in the via, extends across the opposite sides of the insulative base, and extends into the metal base and the routing line; mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip; removing a portion of the metal base that contacts the pillar, wherein the pillar includes an exposed protruding portion that extends beyond the insulative base in a direction away from the chip; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 101
Dependent Claim
24 words
The method of claim 91 , wherein the sealed end is at the metal base and the unsealed end is at the metal layer.
Claim 102
Dependent Claim
24 words
The method of claim 91 , wherein the sealed end is at the metal layer and the unsealed end is at the metal base.
Claim 103
Dependent Claim
19 words
The method of claim 91 , wherein the electrically conductive material is solder paste and the pillar is solder.
Claim 104
Dependent Claim
22 words
The method of claim 91 , wherein the electrically conductive material is uncured conductive adhesive and the pillar is cured conductive adhesive.
Claim 105
Dependent Claim
16 words
The method of claim 91 , wherein the metal base and the metal layer are copper.
Claim 106
Dependent Claim
19 words
The method of claim 96 , wherein the electrically conductive material is solder paste and the pillar is solder.
Claim 107
Dependent Claim
22 words
The method of claim 96 , wherein the electrically conductive material is uncured conductive adhesive and the pillar is cured conductive adhesive.
Claim 108
Dependent Claim
15 words
The method of claim 91 , wherein steps are performed in the sequence set forth.
Claim 109
Dependent Claim
17 words
The method of claim 91 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 110
Independent Claim
180 words
A method of making a semiconductor chip assembly, comprising: providing a semiconductor chip and a laminated structure, wherein the chip includes a conductive pad, the laminated structure includes a conductive trace, other conductive traces, an insulative base and a metal base, the conductive trace includes a routing line and a pillar, the other conductive traces include other routing lines and other pillars, the metal base and the routing line are disposed on opposite sides of the insulative base, the metal base and the other routing lines are disposed on opposite sides of the insulative base, the pillar contacts the routing line and extends through the insulative base and into the metal base, the other pillars contact the other routing lines and extend through the insulative base and into the metal base, and the metal base electrically connects the conductive trace to the other conductive traces; then removing a portion of the metal base, thereby electrically isolating the conductive trace from the other conductive traces; and forming a connection joint that contacts and electrically connects the conductive trace and the pad.
Claim 111
Independent Claim
180 words
A method of making a semiconductor chip assembly, comprising: providing a semiconductor chip and a laminated structure, wherein the chip includes a conductive pad, the laminated structure includes a conductive trace, other conductive traces, an insulative base and a metal base, the conductive trace includes a routing line and a pillar, the other conductive traces include other routing lines and other pillars, the metal base and the routing line are disposed on opposite sides of the insulative base, the metal base and the other routing lines are disposed on opposite sides of the insulative base, the pillar contacts the routing line and extends through the insulative base and into the metal base, the other pillars contact the other routing lines and extend through the insulative base and into the metal base, and the metal base electrically connects the conductive trace to the other conductive traces; then removing a portion of the metal base, thereby electrically isolating the conductive trace from the other conductive traces; and forming a connection joint that contacts and electrically connects the conductive trace and the pad.
Claim 112
Dependent Claim
26 words
The method of claim 101 , including mechanically attaching the chip to the conductive trace using an adhesive before removing the portion of the metal base.
Claim 113
Dependent Claim
42 words
The method of claim 102 , including forming a through-hole that extends through the insulative base and the adhesive and exposes the conductive trace and the pad after mechanically attaching the chip to the conductive trace and before forming the connection joint.
Claim 114
Dependent Claim
43 words
The method of claim 103 , wherein the adhesive contacts and is sandwiched between the conductive trace and the pad, and the conductive trace and the pad are electrically isolated from one another after forming the through-hole and before forming the connection joint.
Claim 115
Dependent Claim
21 words
The method of claim 101 , wherein the pillar extends into and contacts sidewalls of an opening in the routing line.
Claim 116
Dependent Claim
13 words
The method of claim 101 , wherein the pillar has straight vertical sidewalls.
Claim 117
Dependent Claim
14 words
The method of claim 101 , wherein the pillar is solder or conductive adhesive.
Claim 118
Dependent Claim
25 words
The method of claim 101 , wherein the routing line and the metal base are a first material and the pillar is a second material.
Claim 119
Dependent Claim
21 words
The method of claim 108 , wherein the first material is copper and the second material is solder or conductive adhesive.
Claim 120
Dependent Claim
17 words
The method of claim 101 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 121
Independent Claim
175 words
A method of making a semiconductor chip assembly, comprising: providing a semiconductor chip that includes a conductive pad; providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base; then disposing an adhesive between the chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure such that the metal base is disposed on a side of the insulative base that faces away from the chip and the routing line is disposed on a side of the insulative base that faces towards the chip; then removing a portion of the metal base, thereby electrically isolating the pillar from other pillars that extend through the insulative base; and forming a connection joint that contacts and electrically connects the conductive trace and the pad.
Claim 122
Independent Claim
175 words
A method of making a semiconductor chip assembly, comprising: providing a semiconductor chip that includes a conductive pad; providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base; then disposing an adhesive between the chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure such that the metal base is disposed on a side of the insulative base that faces away from the chip and the routing line is disposed on a side of the insulative base that faces towards the chip; then removing a portion of the metal base, thereby electrically isolating the pillar from other pillars that extend through the insulative base; and forming a connection joint that contacts and electrically connects the conductive trace and the pad.
Claim 123
Dependent Claim
42 words
The method of claim 111 , including forming a through-hole that extends through the insulative base and the adhesive and exposes the conductive trace and the pad after mechanically attaching the chip to the laminated structure and before forming the connection joint.
Claim 124
Dependent Claim
45 words
The method of claim 111 , wherein the routing line overlaps the pad and extends within and outside a periphery of the chip, the pillar is disposed outside the periphery of the chip, and the pillar extends across the opposite sides of the insulative base.
Claim 125
Dependent Claim
51 words
The method of claim 111 , wherein forming the pillar includes: forming a via that extends through the insulative base and into the metal base; and then depositing an electrically conductive material into the via, wherein the electrically conductive material in the via contacts the insulative base and the metal base.
Claim 126
Dependent Claim
13 words
The method of claim 114 , wherein the electrically conductive material includes solder.
Claim 127
Dependent Claim
14 words
The method of claim 114 , wherein the electrically conductive material includes conductive adhesive.
Claim 128
Dependent Claim
18 words
The method of claim 111 , wherein removing the portion of the metal base exposes the insulative base.
Claim 129
Dependent Claim
31 words
The method of claim 111 , wherein removing the portion of the metal base exposes straight vertical sidewalls of the pillar that extend from the insulative base away from the chip.
Claim 130
Dependent Claim
47 words
The method of claim 111 , wherein the pillar is the only electrical conductor that is electrically connected to the pad and extends beyond the insulative base in a direction away from the chip after removing the portion of the metal base and forming the connection joint.
Claim 131
Dependent Claim
17 words
The method of claim 111 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 132
Independent Claim
200 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base; then disposing an adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base; then removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 133
Independent Claim
200 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base; then disposing an adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base; then removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 134
Dependent Claim
51 words
The method of claim 121 , wherein forming the pillar includes: forming a via that extends through the insulative base and into the metal base; and then depositing an electrically conductive material into the via, wherein the electrically conductive material in the via contacts the insulative base and the metal base.
Claim 135
Dependent Claim
18 words
The method of claim 122 , wherein the via extends through the metal base and the routing line.
Claim 136
Dependent Claim
22 words
The method of claim 122 , wherein the via extends through the metal base and into but not through the routing line.
Claim 137
Dependent Claim
22 words
The method of claim 122 , wherein the via extends through the routing line and into but not through the metal base.
Claim 138
Dependent Claim
14 words
The method of claim 122 , wherein the electrically conductive material is solder paste.
Claim 139
Dependent Claim
14 words
The method of claim 122 , wherein the electrically conductive material is conductive adhesive.
Claim 140
Dependent Claim
47 words
The method of claim 121 , wherein the pillar is the only electrical conductor that is electrically connected to the pad and extends beyond the insulative base in a direction away from the chip after removing the portion of the metal base and forming the connection joint.
Claim 141
Dependent Claim
32 words
The method of claim 121 , wherein removing the portion of the metal base includes applying a wet chemical etch that is selective of the metal base with respect to the pillar.
Claim 142
Dependent Claim
17 words
The method of claim 121 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 143
Independent Claim
202 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base; disposing an adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base; then removing portions of the metal base that contact the pillar and other pillars that extend through the insulative base, thereby electrically isolating the pillar from the other pillars; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 144
Independent Claim
202 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base; disposing an adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base; then removing portions of the metal base that contact the pillar and other pillars that extend through the insulative base, thereby electrically isolating the pillar from the other pillars; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 145
Dependent Claim
51 words
The method of claim 131 , wherein forming the pillar includes: forming a via that extends through the insulative base and into the metal base; and then depositing an electrically conductive material into the via, wherein the electrically conductive material in the via contacts the insulative base and the metal base.
Claim 146
Dependent Claim
18 words
The method of claim 132 , wherein the via extends through the metal base and the routing line.
Claim 147
Dependent Claim
22 words
The method of claim 132 , wherein the via extends through the metal base and into but not through the routing line.
Claim 148
Dependent Claim
22 words
The method of claim 132 , wherein the via extends through the routing line and into but not through the metal base.
Claim 149
Dependent Claim
14 words
The method of claim 132 , wherein the electrically conductive material is solder paste.
Claim 150
Dependent Claim
14 words
The method of claim 132 , wherein the electrically conductive material is conductive adhesive.
Claim 151
Dependent Claim
47 words
The method of claim 131 , wherein the pillar is the only electrical conductor that is electrically connected to the pad and extends beyond the insulative base in a direction away from the chip after removing the portions of the metal base and forming the connection joint.
Claim 152
Dependent Claim
32 words
The method of claim 131 , wherein removing the portions of the metal base includes applying a wet chemical etch that is selective of the metal base with respect to the pillar.
Claim 153
Dependent Claim
17 words
The method of claim 131 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 154
Independent Claim
304 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer; depositing a non-solidified material into the via; hardening the non-solidified material to form a pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer; providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer; applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer; then mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line; then removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base, wherein the pillar extends beyond the insulative base in a direction away from the chip; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 155
Independent Claim
304 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer; depositing a non-solidified material into the via; hardening the non-solidified material to form a pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer; providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer; applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer; then mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line; then removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base, wherein the pillar extends beyond the insulative base in a direction away from the chip; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 156
Dependent Claim
13 words
The method of claim 141 , wherein forming the via includes mechanical drilling.
Claim 157
Dependent Claim
30 words
The method of claim 141 , wherein depositing the non-solidified material includes depositing solder paste that contacts the metal base, the insulative base and the metal layer in the via.
Claim 158
Dependent Claim
30 words
The method of claim 141 , wherein depositing the non-solidified material includes depositing conductive adhesive that contacts the metal base, the insulative base and the metal layer in the via.
Claim 159
Dependent Claim
35 words
The method of claim 141 , wherein providing the etch mask includes depositing a photoresist layer on the metal layer and selectively patterning the photoresist layer after forming the via and before forming the pillar.
Claim 160
Dependent Claim
50 words
The method of claim 141 , wherein removing the portion of the metal base includes applying a wet chemical etch that is highly selective of the metal base with respect to the insulative base and the pillar and removes all remaining portions of the metal base that overlap the chip.
Claim 161
Dependent Claim
14 words
The method of claim 141 , wherein the via extends through the metal base.
Claim 162
Dependent Claim
14 words
The method of claim 141 , wherein the via extends through the routing line.
Claim 163
Dependent Claim
18 words
The method of claim 141 , wherein the via extends through the metal base and the routing line.
Claim 164
Dependent Claim
17 words
The method of claim 141 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 165
Independent Claim
363 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer; depositing a non-solidified material into the via; hardening the non-solidified material to form a pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer; providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer; applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer; then mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, the routing line overlaps the pad and extends within and outside a periphery of the chip, and the pillar contacts the routing line and is disposed outside the periphery of the chip; then removing a first portion of the metal base that contacts the pillar and a second portion of the metal base that contacts other pillars that extend through the insulative base, thereby electrically isolating the pillar from the other pillars, wherein the pillar extends beyond the insulative base in a direction away from the chip; forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 166
Independent Claim
363 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer; depositing a non-solidified material into the via; hardening the non-solidified material to form a pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer; providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer; applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer; then mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, the routing line overlaps the pad and extends within and outside a periphery of the chip, and the pillar contacts the routing line and is disposed outside the periphery of the chip; then removing a first portion of the metal base that contacts the pillar and a second portion of the metal base that contacts other pillars that extend through the insulative base, thereby electrically isolating the pillar from the other pillars, wherein the pillar extends beyond the insulative base in a direction away from the chip; forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 167
Dependent Claim
13 words
The method of claim 151 , wherein forming the via includes mechanical drilling.
Claim 168
Dependent Claim
30 words
The method of claim 151 , wherein depositing the non-solidified material includes depositing solder paste that contacts the metal base, the insulative base and the metal layer in the via.
Claim 169
Dependent Claim
30 words
The method of claim 151 , wherein depositing the non-solidified material includes depositing conductive adhesive that contacts the metal base, the insulative base and the metal layer in the via.
Claim 170
Dependent Claim
35 words
The method of claim 151 , wherein providing the etch mask includes depositing a photoresist layer on the metal layer and selectively patterning the photoresist layer after forming the via and before forming the pillar.
Claim 171
Dependent Claim
53 words
The method of claim 151 , wherein removing the first and second portions of the metal base includes applying a wet chemical etch that is highly selective of the metal base with respect to the insulative base and the pillar and removes all remaining portions of the metal base that overlap the chip.
Claim 172
Dependent Claim
14 words
The method of claim 151 , wherein the via extends through the metal base.
Claim 173
Dependent Claim
14 words
The method of claim 151 , wherein the via extends through the routing line.
Claim 174
Dependent Claim
18 words
The method of claim 151 , wherein the via extends through the metal base and the routing line.
Claim 175
Dependent Claim
17 words
The method of claim 151 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 176
Independent Claim
227 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the insulative base and reaches the metal base and the metal layer; forming a routing line from a first portion of the metal layer by selectively removing a second portion of the metal layer; forming a pillar in the via, wherein the pillar extends through the insulative base and contacts the metal base, the insulative base and the metal layer in the via; then mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line; then removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 177
Independent Claim
227 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the insulative base and reaches the metal base and the metal layer; forming a routing line from a first portion of the metal layer by selectively removing a second portion of the metal layer; forming a pillar in the via, wherein the pillar extends through the insulative base and contacts the metal base, the insulative base and the metal layer in the via; then mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line; then removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 178
Dependent Claim
14 words
The method of claim 161 , wherein the via extends into the metal base.
Claim 179
Dependent Claim
14 words
The method of claim 161 , wherein the via extends through the metal base.
Claim 180
Dependent Claim
14 words
The method of claim 161 , wherein the via extends into the routing line.
Claim 181
Dependent Claim
14 words
The method of claim 161 , wherein the via extends through the routing line.
Claim 182
Dependent Claim
22 words
The method of claim 161 , wherein the via extends through the metal base and into but not through the routing line.
Claim 183
Dependent Claim
22 words
The method of claim 161 , wherein the via extends through the routing line and into but not through the metal base.
Claim 184
Dependent Claim
18 words
The method of claim 161 , wherein the via extends through the metal base and the routing line.
Claim 185
Dependent Claim
13 words
The method of claim 161 , wherein forming the via includes mechanical drilling.
Claim 186
Dependent Claim
13 words
The method of claim 161 , wherein forming the via includes mechanical punching.
Claim 187
Dependent Claim
13 words
The method of claim 161 , wherein forming the via includes laser drilling.
Claim 188
Dependent Claim
14 words
The method of claim 161 , wherein forming the via includes wet chemical etching.
Claim 189
Dependent Claim
39 words
The method of claim 161 , wherein forming the pillar includes depositing a non-solidified material into the via that contacts the metal base, the insulative base and the metal layer in the via and then hardening the non-solidified material.
Claim 190
Dependent Claim
38 words
The method of claim 161 , wherein forming the pillar includes depositing solder paste into the via that contacts the metal base, the insulative base and the metal layer in the via and then reflowing the solder paste.
Claim 191
Dependent Claim
38 words
The method of claim 161 , wherein forming the pillar includes depositing conductive adhesive into the via that contacts the metal base, the insulative base and the metal layer in the via and then curing the conductive adhesive.
Claim 192
Dependent Claim
45 words
The method of claim 161 , wherein removing the portion of the metal base includes applying a wet chemical etch that is selective of the metal base with respect to the pillar and removes all remaining portions of the metal base that overlap the chip.
Claim 193
Dependent Claim
37 words
The method of claim 161 , including forming an encapsulant on the chip, the insulative base and the routing line after attaching the chip to the laminated structure and before removing the portion of the metal base.
Claim 194
Dependent Claim
16 words
The method of claim 161 , wherein the steps are performed in the sequence set forth.
Claim 195
Dependent Claim
39 words
The method of claim 161 , wherein the metal base and the metal layer are copper, the pillar is solder or conductive adhesive, the insulative base is primarily polyimide or epoxy, and the adhesive is primarily polyimide or epoxy.
Claim 196
Dependent Claim
17 words
The method of claim 161 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 197
Independent Claim
250 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the metal base, the insulative base and the metal layer; forming a conductive trace that includes a routing line and a pillar, wherein the routing line and the pillar are different materials, the routing line is formed from an unetched portion of the metal layer, and the pillar contacts the metal base, the insulative base and the routing line in the via, extends across the opposite sides of the insulative base, and extends into the metal base and the routing line; then mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip; then removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base, wherein the pillar includes an exposed protruding portion that extends beyond the insulative base in a direction away from the chip; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 198
Independent Claim
250 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the metal base, the insulative base and the metal layer; forming a conductive trace that includes a routing line and a pillar, wherein the routing line and the pillar are different materials, the routing line is formed from an unetched portion of the metal layer, and the pillar contacts the metal base, the insulative base and the routing line in the via, extends across the opposite sides of the insulative base, and extends into the metal base and the routing line; then mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip; then removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base, wherein the pillar includes an exposed protruding portion that extends beyond the insulative base in a direction away from the chip; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 199
Dependent Claim
17 words
The method of claim 181 , wherein the pillar is disposed within a periphery of the chip.
Claim 200
Dependent Claim
17 words
The method of claim 181 , wherein the pillar is disposed outside a periphery of the chip.
Claim 201
Dependent Claim
11 words
The method of claim 181 , wherein the pillar is solder.
Claim 202
Dependent Claim
12 words
The method of claim 181 , wherein the pillar is conductive adhesive.
Claim 203
Dependent Claim
16 words
The method of claim 181 , wherein the metal base and the metal layer are copper.
Claim 204
Dependent Claim
11 words
The method of claim 186 , wherein the pillar is solder.
Claim 205
Dependent Claim
12 words
The method of claim 186 , wherein the pillar is conductive adhesive.
Claim 206
Dependent Claim
16 words
The method of claim 181 , wherein the steps are performed in the sequence set forth.
Claim 207
Dependent Claim
17 words
The method of claim 181 , wherein the assembly is devoid of wire bonds and TAB leads.
Claim 208
Independent Claim
319 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the metal base, the insulative base and the metal layer and has open opposing ends; providing a plug that seals the via at one end such that the via has a sealed end and an unsealed end; depositing an electrically conductive material into the via from the unsealed end while the plug provides the sealed end, wherein the electrically conductive material contacts the plug, the metal base, the insulative base and the metal layer in the via; removing the plug; forming a conductive trace that includes a routing line and a pillar, wherein the routing line is formed from an unetched portion of the metal layer, the pillar is formed from the electrically conductive material, and the pillar contacts the metal base, the insulative base and the routing line in the via, extends across the opposite sides of the insulative base, and extends into the metal base and the routing line; mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip; then removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base, wherein the pillar includes an exposed protruding portion that extends beyond the insulative base in a direction away from the chip; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 209
Independent Claim
319 words
A method of making a semiconductor chip assembly, comprising: providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base; forming a via in the laminated structure that extends through the metal base, the insulative base and the metal layer and has open opposing ends; providing a plug that seals the via at one end such that the via has a sealed end and an unsealed end; depositing an electrically conductive material into the via from the unsealed end while the plug provides the sealed end, wherein the electrically conductive material contacts the plug, the metal base, the insulative base and the metal layer in the via; removing the plug; forming a conductive trace that includes a routing line and a pillar, wherein the routing line is formed from an unetched portion of the metal layer, the pillar is formed from the electrically conductive material, and the pillar contacts the metal base, the insulative base and the routing line in the via, extends across the opposite sides of the insulative base, and extends into the metal base and the routing line; mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip; then removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base, wherein the pillar includes an exposed protruding portion that extends beyond the insulative base in a direction away from the chip; and forming a connection joint that contacts and electrically connects the routing line and the pad.
Claim 210
Dependent Claim
24 words
The method of claim 191 , wherein the sealed end is at the metal base and the unsealed end is at the metal layer.
Claim 211
Dependent Claim
24 words
The method of claim 191 , wherein the sealed end is at the metal layer and the unsealed end is at the metal base.
Claim 212
Dependent Claim
19 words
The method of claim 191 , wherein the electrically conductive material is solder paste and the pillar is solder.
Claim 213
Dependent Claim
22 words
The method of claim 191 , wherein the electrically conductive material is uncured conductive adhesive and the pillar is cured conductive adhesive.
Claim 214
Dependent Claim
16 words
The method of claim 191 , wherein the metal base and the metal layer are copper.
Claim 215
Dependent Claim
19 words
The method of claim 196 , wherein the electrically conductive material is solder paste and the pillar is solder.
Claim 216
Dependent Claim
22 words
The method of claim 196 , wherein the electrically conductive material is uncured conductive adhesive and the pillar is cured conductive adhesive.
Claim 217
Dependent Claim
15 words
The method of claim 191 , wherein steps are performed in the sequence set forth.
Claim 218
Dependent Claim
17 words
The method of claim 191 , wherein the assembly is devoid of wire bonds and TAB leads.
References Cited (Backward Citations)
US4442967A
Cited
US4661192A
Cited
US4717066A
Cited
US4807021A
Cited
US4750666A
Cited
US4955523A
Cited
US4925083A
Cited
US4970571A
Cited
US5014111A
Cited
US5090119A
Cited
US4937653A
Cited
US4984358A
Cited
US5106461A
Cited
US5060843A
Cited
US5489804A
Cited
US5327010A
Cited
US5074947A
Cited
US5611140A
Cited
US5196371A
Cited
US5237130A
Cited
US5654584A
Cited
US5556810A
Cited
US5137845A
Cited
US5172851A
Cited
US5682061A
Cited
US5260234A
Cited
US5167992A
Cited
US5293067A
Cited
US5116463A
Cited
US5209817A
Cited
US5475236A
Cited
US5284796A
Cited
US5294038A
Cited
US5358621A
Cited
US5483421A
Cited
US5346750A
Cited
US5407864A
Cited
US5261593A
Cited
US5334804A
Cited
US6088236A
Cited
US5447886A
Cited
US5275330A
Cited
US5478007A
Cited
US5355283A
Cited
US5454161A
Cited
US5485949A
Cited
US5364004A
Cited
US5536973A
Cited
US5439162A
Cited
US5438477A
Cited
US5397921A
Cited
US5572069A
Cited
US5484647A
Cited
US5633204A
Cited
US5663598A
Cited
US5525065A
Cited
US5424245A
Cited
US5454928A
Cited
US5556814A
Cited
US5757081A
Cited
US5669545A
Cited
US5493096A
Cited
US5508229A
Cited
US5619791A
Cited
US5595943A
Cited
US5641113A
Cited
US6012224A
Cited
US5645628A
Cited
US5614114A
Cited
US5648686A
Cited
US5813115A
Cited
US5615477A
Cited
US5656858A
Cited
US5477933A
Cited
US5487218A
Cited
US5870289A
Cited
EP0718822A2
Cited
US5627406A
Cited
US5686353A
Cited
US6127204A
Cited
US5583073A
Cited
US5599744A
Cited
US5542601A
Cited
US5744859A
Cited
US5547740A
Cited
US5834844A
Cited
US5665652A
Cited
US5613296A
Cited
US5564181A
Cited
US5801447A
Cited
US5798285A
Cited
US5646067A
Cited
US5627405A
Cited
US5861666A
Cited
US5803340A
Cited
US5691041A
Cited
US5637920A
Cited
US5722162A
Cited
US6159770A
Cited
US5674785A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-06-23 | 2006-12-23 | 2007-06-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-06-23 | 2010-12-23 | 2011-06-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-06-23 | 2014-12-23 | 2015-06-24 | $7700.00 | Window Closed / Lapsed |