US5090119A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming an electrical contact bump
Assignee: Panasonic Holdings Corp
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Filing: 1990-10-30
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Granted: 1992-02-25
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Expires: 2010-10-30
Abstract
Abstract A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conducting adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.
Inventors
- 👤 Toshio Tsuda
- 👤 Yasuhiko Horio
- 👤 Yoshihiro Bessho
- 👤 Toru Ishida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 14:25
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/251; H10W72/252; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/90; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149; Y10T29/49151
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
184 words
A method of forming, on an electrode pad formed on a substrate, an electrical contact bump having a first raised portion attached to the electrode pad and a second raised portion having a shape of a loop formed on the first raised portion, said method comprising the steps of: fixedly attaching a ball formed at a free end of a conductive wire held by a capillary to the electrode pad by means of the capillary to form the first raised portion; looping the conductive wire above the first raised portion to form a looped portion of the conductive wire by means of the capillary, the looped portion having a fixed end connected to the first raised portion and a free end connected to a portion of the conductive wire extending from the capillary; fixedly attaching the free end of the looped portion of the conductive wire to the first raised portion by means of the capillary; and cutting the conductive wire extending from the capillary at the free end of the looped portion whereby the second raised portion is formed by the looped portion.
Claim 2
Independent Claim
184 words
A method of forming, on an electrode pad formed on a substrate, an electrical contact bump having a first raised portion attached to the electrode pad and a second raised portion having a shape of a loop formed on the first raised portion, said method comprising the steps of: fixedly attaching a ball formed at a free end of a conductive wire held by a capillary to the electrode pad by means of the capillary to form the first raised portion; looping the conductive wire above the first raised portion to form a looped portion of the conductive wire by means of the capillary, the looped portion having a fixed end connected to the first raised portion and a free end connected to a portion of the conductive wire extending from the capillary; fixedly attaching the free end of the looped portion of the conductive wire to the first raised portion by means of the capillary; and cutting the conductive wire extending from the capillary at the free end of the looped portion whereby the second raised portion is formed by the looped portion.
Claim 3
Dependent Claim
24 words
A method according to claim 1, wherein the conductive wire is of a material selected from the group consisting of gold, copper and aluminum.
Claim 4
Dependent Claim
30 words
A method according to claim 1, wherein the conductive wire comprises an alloy containing, as a main component, a material selected from the group consisting of gold, copper and aluminum.
Claim 5
Independent Claim
188 words
A method off forming, on an electrode pad formed on a substrate, an electrical contact bump having a first raised portion attached to the electrode pad and a second raised portion having a shape of a loop formed on the first raised portion, said method comprising the steps of: fixedly attaching a ball formed at a free end of a conductive wire held by a capillary to the electrode pad by means of the capillary to form the first raised portion; looping the conductive wire above the first raised portion to form a looped portion of the conductive wire by means of the capillary, the looped portion having a fixed end connected to the first raised portion and a free end connected to a portion of the conductive wire extending from the capillary; fixedly attaching the free end of the looped portion of the conductive wire to the electrode pad on which the first raised portion is fixedly attached by means of the capillary; and cutting the conductive wire at the free end of the looped portion whereby the second raised portion is formed by the looped portion.
Claim 6
Independent Claim
188 words
A method off forming, on an electrode pad formed on a substrate, an electrical contact bump having a first raised portion attached to the electrode pad and a second raised portion having a shape of a loop formed on the first raised portion, said method comprising the steps of: fixedly attaching a ball formed at a free end of a conductive wire held by a capillary to the electrode pad by means of the capillary to form the first raised portion; looping the conductive wire above the first raised portion to form a looped portion of the conductive wire by means of the capillary, the looped portion having a fixed end connected to the first raised portion and a free end connected to a portion of the conductive wire extending from the capillary; fixedly attaching the free end of the looped portion of the conductive wire to the electrode pad on which the first raised portion is fixedly attached by means of the capillary; and cutting the conductive wire at the free end of the looped portion whereby the second raised portion is formed by the looped portion.
Claim 7
Dependent Claim
24 words
A method according to claim 4, wherein the conductive wire is of a material selected from the group consisting of gold, copper and aluminum.
Claim 8
Dependent Claim
30 words
A method according to claim 4, wherein the conductive wire comprises an alloy containing, as a main component, a material selected from the group consisting of gold, copper and aluminum.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-02-24 | 1995-08-26 | 1996-02-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-02-24 | 1999-08-26 | 2000-02-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-02-24 | 2003-08-26 | 2004-02-25 | $7700.00 | Window Closed / Lapsed |