Wire bonding apparatus

Abstract

Abstract PURPOSE: To stably obtain a loop of a gold wire by a wire bonding apparatus by holding the gold wire at a clamp and lowering the wire while lowering a capillary from its uppermost limit to predetermined height in a step of transferring from a ball bonding to its stitch bonding step, and retaining it as it is until the stitch bonding step is completed. CONSTITUTION: After a ball is bonded to a gold wire 6, a capillary 2 is raised in height a, and then horizontally moved at a distance c. Then, a clamp 5 is closed, and the gold wire is lowered at a distance d in synchronization with the capillary 2. Then, only the capillary is further lowered to stitch bond it and returned to its original position. At this time the clamp 5 is opened, the gold wire is raised in synchronization with the capillary. Then, the clamp 5 is closed to then melt to cut the gold wire 6 by a torch. When the length L of the gold wire is so selected as to become L=a-d+c according to this configuration, a loop of height b of the gold wire is obtained, while when the height a is increased, it can prevent the gold wire from buckling and lowering the height of the loop to thereby stably form a loop of the gold wire. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Tatsuo Imaizumi

Bibliographic Details