Adhesion of semiconductor element

Abstract

Abstract PURPOSE:To sharply reduce the quantity of gold used by a method wherein, when a semiconductor element is adhered to a frame, a gold ball is provided on the frame using a nail-head bonding device, the gold ball is beated out into flat form by performing a rolling or a heat-molting process, the element is placed and heated on the stretched out gold and it is adhered using a gold and silicon eutectic. CONSTITUTION:The end section of the gold bonding wire 2, protruding from the capillary chip 1 on the nail-head bonding device, is heated up with a hydrogen torch 3 and the gold ball 4 is formed. Then, the gold ball 4 is placed on the adhering position of the semiconductor element on the frame 5 and the ball 4 is fixed by performing thermopress welding using the capillary chip 1 or by supersonic welding. Then, the ball 4 is formed into falt shape by performing heat-moltening using a pressing stick 6 or a heater, an element 7 is provided at the flat gold and the frame 5 is adhered on the frame 5 using the gold and silicon eutectic which was generated by heating.

Inventors

• 👤 Takeshi Akiyama
• 👤 Makoto Fujita

Bibliographic Details