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US5484647A Expired / Lapsed US ⏱️ 0.0 years remaining

Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same

Assignee: Panasonic Holdings Corp
•
Filing: 1994-09-20
•
Granted: 1996-01-16
•
Expires: 2014-09-20
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Abstract

Abstract A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree-films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.

Inventors

  • 👤 Seiichi Nakatani
  • 👤 Akihito Hatakeyama
  • 👤 Kouji Kawakita
  • 👤 Hirishi Sogou
  • 👤 Tatsuo Ogawa
  • 👤 Tamao Kojima

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 11:21
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/462; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H01R12/523; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0116; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2203/00; H05K2203/01; H05K2203/0191; H05K2203/14; H05K2203/1461; H05K3/4623; H05K3/4644; H05K3/4652; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49165; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24802; Y10T428/24917; Y10T428/249921; Y10T428/249994; Y10T428/249995; Y10T428/249996; Y10T442/00; Y10T442/20; Y10T442/2475; Y10T442/60; Y10T442/674

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 83 words
A connecting member of a circuit substrate comprising an organic porous base material provided with tackfree films on both sides, wherein said connecting member of a circuit substrate has through-holes, and said through-holes are filled with conductive resin compound up to the outer surface of said tackfree films, wherein said through-holes filled with the conductive resin compound have a diameter of 50 μm to 1 mm and said through-holes filled with the conductive resin compound have a pitch of 50 μm or more.
Claim 2
Dependent Claim 83 words
A connecting member of a circuit substrate comprising an organic porous base material provided with tackfree films on both sides, wherein said connecting member of a circuit substrate has through-holes, and said through-holes are filled with conductive resin compound up to the outer surface of said tackfree films, wherein said through-holes filled with the conductive resin compound have a diameter of 50 μm to 1 mm and said through-holes filled with the conductive resin compound have a pitch of 50 μm or more.
Claim 3
Dependent Claim 35 words
The connecting member of a circuit substrate as in claim 1, wherein said organic porous base material is a composite material which comprises a nonwoven heat-resisting synthetic fiber fabric impregnated with an uncured thermosetting resin.
Claim 4
Dependent Claim 29 words
The connecting member of a circuit substrate as in claim 2, wherein said nonwoven heat-resisting synthetic fiber fabrics comprise aramid resin, while said uncured thermosetting resin is epoxy resin.
Claim 5
Dependent Claim 37 words
The connecting member of a circuit substrate as in claim 2, wherein said nonwoven heat-resisting synthetic fiber fabric comprises paper, and said uncured thermosetting resin is selected from the group consisting of phenol resin and epoxy resin.
Claim 6
Dependent Claim 43 words
The connecting member of a circuit substrate as in claim 1, wherein a conductive substance contained in said conductive resin compound is at least one metallic powder selected from the group consisting of silver, nickel, copper, silver alloy, nickel alloy, and copper alloy.
Claim 7
Dependent Claim 34 words
The connecting member of a circuit substrate as in claim 2, wherein a resin component contained in said conductive resin compound is the same as the thermosetting resin in said organic porous base material.
Claim 8
Dependent Claim 19 words
The connecting member of a circuit substrate as in claim 1, wherein said through-holes are formed by laser irradiation.
Claim 9
Dependent Claim 29 words
The connecting member of a circuit substrate as in claim 1, wherein said through-holes filled with the conductive resin compound have an electrical resistance of 0.05 to 5.0 mΩ.
Claim 10
Dependent Claim 24 words
The connecting member of a circuit substrate as in claim 1, wherein said porous base material has a porosity of from 2 to 35%.

References Cited (Backward Citations)

US5346750A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-01-15 1999-07-17 2000-01-16 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-01-15 2003-07-17 2004-01-16 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-01-15 2007-07-17 2008-01-16 $7700.00 Window Closed / Lapsed

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