Patent US3955578A successfully refreshed from Google Patents.
US5346750A
Expired / Lapsed
US
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Porous substrate and conductive ink filled vias for printed circuits
Assignee: Panasonic Holdings Corp
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Filing: 1993-05-06
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Granted: 1994-09-13
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Expires: 2013-05-06
Abstract
Abstract A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes (3) in a porous raw material (2) provided with cover films (1) and having compressive shrinkage, filling electro-conductive paste (4) into the through-holes (3), separating the cover films (1) from the porous raw material (2) filled with the electro-conductive paste (4) in its through-holes (3), applying metal foils (5) onto the surfaces of the porous raw material (2) from which the cover films (1) have been separated, and compressing the porous raw material (2) applied with the metal foils (5) through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.
Inventors
- 👤 Akihito Hatakeyama
- 👤 Hiroshi Sogo
- 👤 Tamao Kojima
- 👤 Yasuhiko Horio
- 👤 Masahide Tsukamoto
- 👤 Yasushi Fukumura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 00:07
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/462; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0116; H05K2201/02; H05K2201/0203; H05K2201/0263; H05K2201/0269; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2203/00; H05K2203/01; H05K2203/0191; H05K2203/14; H05K2203/1461; H05K3/22; H05K3/28; H05K3/4623; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49165; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/249921; Y10T428/249953; Y10T428/249994; Y10T428/249995; Y10T428/249996
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
74 words
An organic substrate used for printed circuits, which comprises a porous raw material, electro-conductive paste filled in through-holes formed in said porous raw material, and metal foils applied onto opposite surfaces of said porous raw material, said metal foils adhered to the opposite surfaces of said porous raw material being electrically connected to each other through the electro-conductive paste by compressing said porous raw material applied with said metal foils through heating and pressurization.
Claim 2
Dependent Claim
74 words
An organic substrate used for printed circuits, which comprises a porous raw material, electro-conductive paste filled in through-holes formed in said porous raw material, and metal foils applied onto opposite surfaces of said porous raw material, said metal foils adhered to the opposite surfaces of said porous raw material being electrically connected to each other through the electro-conductive paste by compressing said porous raw material applied with said metal foils through heating and pressurization.
Claim 3
Dependent Claim
31 words
An organic substrate as claimed in claim 1, wherein said porous raw material is one compressed through heating and pressurization at compressibility in the range of 10 to 60% by thickness.
Claim 4
Dependent Claim
25 words
An organic substrate as claimed in claim 1, wherein said porous raw material is one preliminarily compressed before filling the electro-conductive paste into said through-holes.
Claim 5
Dependent Claim
32 words
An organic substrate as claimed in claim 1, wherein said porous raw material is composed of an organic material, and has a porosity in the range of 10 to 60% by volume.
Claim 6
Dependent Claim
31 words
An organic substrate as claimed in claim 1, wherein said porous raw material is of a composite material of a non-woven fabric made of aromatic polyamide fibers and a thermosetting resin.
Claim 7
Dependent Claim
34 words
An organic substrate as claimed in claim 1, wherein the electro-conductive substance in the electro-conductive paste is a single substance selected from the group consisting of silver, gold, silver palladium, copper and combinations thereof.
Claim 8
Dependent Claim
43 words
An organic substrate as claimed in claim 1, wherein the porous raw material is one heated and pressurized in a first step for increasing viscosity of the electro-conductive paste, and a second step for bonding the metal foils to said porous raw material.
Claim 9
Dependent Claim
29 words
An organic substrate as claimed in claim 1, wherein the electro-conductive paste has a gel point lower than a softening temperature of the resin constituting said porous raw material.
Claim 10
Dependent Claim
88 words
A multilayer circuit board which comprises at least a pair of circuit substrates each including circuit patterns formed on opposite surfaces of the organic substrate for the printed circuits as claimed in claim 1, and an intermediate connecting member including electro-conductive paste filled in through-holes formed in a porous raw material, said intermediate connecting member being held between said circuit substrates, whereby circuit patterns of said confronting circuit substrates being electrically connected to each other through the electro-conductive paste of said intermediate connecting member by heating and pressurization.
Claim 11
Dependent Claim
102 words
A multilayer circuit board which comprises circuit substrates each including circuit patterns formed on opposite surfaces of the organic substrate for the printed circuits as claimed in claim 1, an intermediate connecting member including electro-conductive paste filled in through-holes formed in a porous raw material, and stuck onto said circuit substrate, and metal foils applied on said intermediate connecting member, and formed with circuit patterns after compression through heating and pressurization, said circuit patterns of said circuit substrates and said circuit patterns of said intermediate connecting member being electrically connected to each other through the electro-conductive paste of said intermediate connecting member.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-09-12 | 1998-03-14 | 1998-09-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-09-12 | 2002-03-14 | 2002-09-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-09-12 | 2006-03-14 | 2006-09-13 | $7700.00 | Window Closed / Lapsed |