US5744859A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Texas Instruments Inc
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Filing: 1996-02-07
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Granted: 1998-04-28
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Expires: 2016-02-07
Abstract
Abstract A semiconductor device assembled as a compact tape carrier package (TCP) for tape-automated bonding(TAB). An IC chip 3 has a connection surface provided with bump electrodes 15. A flexible base film 7, carrying leads 8 and having a device hole 21 smaller than the semiconductor chip's connection surface, faces the IC chip's connection surface across a small prescribed gap 22. Inner leads 8a, 8a' extending from base film 7 through device hole 21 are bonded to bump electrodes 15 on IC chip 3. To maintain gap 22 during inner lead bonding and resin sealing the chip's connection face or the base film 7 is provided with spacer projections 35 or 55 of the same length as gap 22. During inner lead bonding the spacer projections prevent base film 7 from deforming so as to dislocate inner leads 8a, 8a' from their corresponding bump electrodes. During sealing the spacer projections enable sealing resin 13 to easily flow through gap 22 to evenly coat the chip's face and sides.
Inventors
- 👤 Takayuki Ouchida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 06:41
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H10W72/071; H10W72/077; H10W72/01; H10W72/012; H10W72/01251; H10W72/01255; H10W72/072; H10W72/07251; H10W72/20; H10W72/251; H10W72/252; H10W72/29; H10W72/50; H10W72/581; H10W72/851; H10W72/853; H10W72/90; H10W72/951; H10W74/00
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
137 words
A semiconductor assembly for TCP packaging, comprising: an IC chip containing a circuit and having a connection face provided with a plurality of bump electrodes coupled to the circuit; a flexible base film (i) having a device hole smaller than the IC chip's connection face and facing it at a predetermined sealing gap distance and (ii) attached to a plurality of conducting leads having unattached inner lead portions extendible through the device hole for bonding to corresponding bump electrodes of the IC chip; and a plurality of spacer projections, of a height equal to the sealing gap distance, disposed around the device hole between the base film and the chip's connection face for maintaining the gap distance when the inner lead portions are bonded to the bump electrodes and a sealant is poured in the device hole.
Claim 2
Dependent Claim
137 words
A semiconductor assembly for TCP packaging, comprising: an IC chip containing a circuit and having a connection face provided with a plurality of bump electrodes coupled to the circuit; a flexible base film (i) having a device hole smaller than the IC chip's connection face and facing it at a predetermined sealing gap distance and (ii) attached to a plurality of conducting leads having unattached inner lead portions extendible through the device hole for bonding to corresponding bump electrodes of the IC chip; and a plurality of spacer projections, of a height equal to the sealing gap distance, disposed around the device hole between the base film and the chip's connection face for maintaining the gap distance when the inner lead portions are bonded to the bump electrodes and a sealant is poured in the device hole.
Claim 3
Dependent Claim
19 words
The assembly of claim 1 wherein the spacer projections are formed on the connection face of the IC chip.
Claim 4
Dependent Claim
23 words
The assembly of claim 1 wherein the spacer projections are formed as dummy bump electrodes on the connection face of the IC chip.
Claim 5
Dependent Claim
23 words
The assembly of claim 1 wherein the spacer projections are formed as dummy bump electrodes on a passivation film of the semiconductor chip.
Claim 6
Dependent Claim
15 words
The assembly of claim 1 wherein the spacer projections are formed on the base film.
Claim 7
Dependent Claim
31 words
The assembly of claim 1 wherein the unattached inner lead portions have free ends, each extendible through the device hole for bonding to a corresponding bump electrode of the IC chip.
Claim 8
Dependent Claim
16 words
The assembly of claim 1 wherein the the unattached inner lead portions bridge the device hole.
Claim 9
Dependent Claim
141 words
A semiconductor device comprising: an IC chip containing a circuit and having a connection face provided with a plurality of bump electrodes coupled to the circuit; a flexible base film (i) having a device hole smaller than the IC chip's connection face and facing it at a predetermined gap distance and (ii) attached to a plurality of conducting leads having inner lead portions extending through the device hole and bonded to corresponding bump electrodes of the IC chip; a plurality of spacer projections, of a height equal to the gap distance, disposed around the device hole between the base film and the chip's connection face for maintaining the gap distance; and a sealant covering the inner lead portions, filling the device hole and the gap distance between the IC chip and flexible base film, and covering the IC chip's connection face.
Claim 10
Dependent Claim
141 words
A semiconductor device comprising: an IC chip containing a circuit and having a connection face provided with a plurality of bump electrodes coupled to the circuit; a flexible base film (i) having a device hole smaller than the IC chip's connection face and facing it at a predetermined gap distance and (ii) attached to a plurality of conducting leads having inner lead portions extending through the device hole and bonded to corresponding bump electrodes of the IC chip; a plurality of spacer projections, of a height equal to the gap distance, disposed around the device hole between the base film and the chip's connection face for maintaining the gap distance; and a sealant covering the inner lead portions, filling the device hole and the gap distance between the IC chip and flexible base film, and covering the IC chip's connection face.
Claim 11
Dependent Claim
31 words
The semiconductor device of claim 8 wherein the unattached inner lead portions have free ends extending through the device hole, each bonded to a corresponding bump electrode of the IC chip.
Claim 12
Dependent Claim
16 words
The semiconductor device of claim 8 wherein the the inner lead portions bridge the device hole.
Claim 13
Independent Claim
129 words
A method of assembling a TCP semiconductor device, comprising the steps of: providing an IC chip containing a circuit and having a connection face provided with a plurality of bump electrodes coupled to the circuit; providing a flexible base film (i) having a device hole smaller than the IC chip's connection face and facing it at a predetermined sealing gap distance and (ii) attached to a plurality of conducting leads having unattached inner lead portions; providing a plurality of spacer projections, of a height equal to the sealing gap distance, disposed around the device hole between the base film and the chip's connection face for maintaining the gap distance; pushing the inner lead portions through the device hole and bonding them to corresponding bump electrodes of the IC chip.
Claim 14
Independent Claim
129 words
A method of assembling a TCP semiconductor device, comprising the steps of: providing an IC chip containing a circuit and having a connection face provided with a plurality of bump electrodes coupled to the circuit; providing a flexible base film (i) having a device hole smaller than the IC chip's connection face and facing it at a predetermined sealing gap distance and (ii) attached to a plurality of conducting leads having unattached inner lead portions; providing a plurality of spacer projections, of a height equal to the sealing gap distance, disposed around the device hole between the base film and the chip's connection face for maintaining the gap distance; pushing the inner lead portions through the device hole and bonding them to corresponding bump electrodes of the IC chip.
Claim 15
Dependent Claim
47 words
The method of claim 11, further including the step of pouring a sealant over the inner lead portions to fill the device hole and the gap distance between the IC chip and flexible base film and cover the inner lead portions and the IC chip's connection face.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-04-27 | 2001-10-27 | 2002-04-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-04-27 | 2005-10-27 | 2006-04-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-04-27 | 2009-10-27 | 2010-04-28 | $7700.00 | Window Closed / Lapsed |