Patent US3380607A successfully refreshed from Google Patents.
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US5355019A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Devices with tape automated bonding
Assignee: Nokia Bell Labs
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Filing: 1992-03-04
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Granted: 1994-10-11
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Expires: 2012-03-04
Abstract
Abstract Disclosed is a method for fabricating devices, and the resulting products, using Tape Automated Bonding (TAB) technology. Via holes are formed through a flexible insulating layer, such as polyimide, and are plated through when conductive fingers are formed on one surface of the layer. The resulting structure is then bonded to a semiconductor chip by means of the conductive pads formed on the surface of the insulating layer opposite to the conductive fingers.
Inventors
- 👤 Harold E. Fuchs
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 14:00
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/614; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H10W70/01; H10W70/05; H10W70/095; H10W70/67; H10W70/688; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0344; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2203/00; H05K2203/04; H05K2203/0455; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0032; H05K3/22; H05K3/24; H05K3/243; H05K3/40; H05K3/42; H05K3/425; H05K3/426; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
103 words
A device comprising: a flexible insulating material having first and second major surfaces; a plurality of conductive fingers formed on the first major surface; an array of via holes formed through the insulating material extending from the first major surface to the second major surface; conductive material formed by a single electroplating step so that the material extends continuously from the conductive fingers, through the via holes, and terminates in a first array of bonding pads at the second major surface; and a semiconductor chip having a second array of bonding pads electrically and mechanically bonded to the first array of bonding pads.
Claim 2
Independent Claim
103 words
A device comprising: a flexible insulating material having first and second major surfaces; a plurality of conductive fingers formed on the first major surface; an array of via holes formed through the insulating material extending from the first major surface to the second major surface; conductive material formed by a single electroplating step so that the material extends continuously from the conductive fingers, through the via holes, and terminates in a first array of bonding pads at the second major surface; and a semiconductor chip having a second array of bonding pads electrically and mechanically bonded to the first array of bonding pads.
Claim 3
Dependent Claim
12 words
The device according to claim 1 wherein the insulating material comprises polyimide.
Claim 4
Dependent Claim
17 words
The device according to claim 1 wherein the conductive fingers and the plated conductive material comprise copper.
Claim 5
Dependent Claim
26 words
The device according to claim 3 further comprising a thin electroless plated layer on the first major surface and on the walls of the via holes.
Claim 6
Dependent Claim
26 words
The device according to claim 1 wherein the first array of bonding pads includes land areas formed on the second major surface surrounding the via holes.
Claim 7
Dependent Claim
35 words
The device according to claim 1 wherein the second array of bonding pads includes a first set on a periphery of the semiconductor chip surface and a second set positioned interior to said first set.
Claim 8
Dependent Claim
18 words
The device according to claim 1 wherein the diameter of the via holes is less than 100 microns.
Claim 9
Dependent Claim
15 words
The device according to claim 1 wherein the plated conductive material fills the via holes.
Claim 10
Dependent Claim
28 words
The device according to claim 1 wherein the second array of bonding pads is electrically and mechanically bonded to the first array of bonding pads by thermocompression bonding.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-10-10 | 1998-04-11 | 1998-10-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-10-10 | 2002-04-11 | 2002-10-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-10-10 | 2006-04-11 | 2006-10-11 | $7700.00 | Window Closed / Lapsed |