US5065228A
Expired / Lapsed
US
⏱️ 0.0 years remaining
G-TAB having particular through hole
Assignee: MacDermid Acumen Inc
•
Filing: 1989-04-04
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Granted: 1991-11-12
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Expires: 2009-04-04
Abstract
Abstract A thin, preferably flexible circuit having multiple conductive planes separated by a non-conductive layer is provided. Conductive vias electrically interconnect the conductive planes. The conductive vias comprise carbon coated blind vias which are made conductive by the electrolytic deposition of a metal on the carbon. The invention is particularly suited for G-TAB wherein a first metal plane is patterned into signal plane circuit traces and a second metal plane is patterned into ground plane traces.
Inventors
- 👤 Craig A. Foster
- 👤 Randolfo Galvez
- 👤 Kurt R. Raab
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 19:13
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/423; H05K3/424; H10W70/01; H10W70/05; H10W70/095; H10W70/611; H10W70/63; H10W70/635; H10W70/67; H10W70/688
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
116 words
A thin circuit, comprising: a first conductive plane patterned into a plurality of circuit traces, at least one of said circuit traces having a width of less than about 5 mils or separated by spaces of less than about 5 mils; a second conductive plane patterned into at least one circuit trace; a non-conductive layer disposed between said first and second conductive planes; at least one conductive through hole via electrically interconnecting said first and second conductive planes, said conductive through hole via having a diameter of less than about 5 mils comprising: a layer of carbon black affixed to the walls of an electrically non-conductive via; and a conductive metal bonded to said carbon black.
Claim 2
Dependent Claim
116 words
A thin circuit, comprising: a first conductive plane patterned into a plurality of circuit traces, at least one of said circuit traces having a width of less than about 5 mils or separated by spaces of less than about 5 mils; a second conductive plane patterned into at least one circuit trace; a non-conductive layer disposed between said first and second conductive planes; at least one conductive through hole via electrically interconnecting said first and second conductive planes, said conductive through hole via having a diameter of less than about 5 mils comprising: a layer of carbon black affixed to the walls of an electrically non-conductive via; and a conductive metal bonded to said carbon black.
Claim 3
Dependent Claim
21 words
The thin circuit claim 1 wherein the thickness of said non-conductive layer is from about 1.5 mils to about 5 mils.
Claim 4
Dependent Claim
27 words
The thin circuit of claim 2 wherein said conductive metal bonded to said carbon black is selected from the group consisting of copper, nickel, gold and silver.
Claim 5
Dependent Claim
30 words
The thin circuit of claim 3 wherein said non-conductive layer is flexible and said first conductive layer terminates at inner leads which extend in cantilever fashion into a personality window.
Claim 6
Dependent Claim
22 words
The thin circuit of claim 4 wherein said through hole has a diameter of from about 1 mil to about 2 mils.
Claim 7
Dependent Claim
30 words
The thin circuit of claim 5 wherein said conductive metal is copper with a thickness of from about 0.5 mils to about 1 mil and said non-conductive layer is polyimide.
Claim 8
Dependent Claim
125 words
A thin circuit, comprising: a first conductive plane formed into a plurality of circuit traces, at least some of said circuit traces having a width of less than about 5 mils or separated by spaces of less than about 5 mils; a second conductive plane formed into at least one circuit trace; a non-conductive layer disposed between said first and second conductive planes; at least one conductive blind via extending from said conductive plane to an interior surface of a circuit trace formed in said first conductive plane, said blind hole via having a diameter of 5 mils or less and comprising: a layer of carbon black affixed to the walls of an electrically non-conductive via; and a conductive metal bonded to said carbon black.
Claim 9
Dependent Claim
125 words
A thin circuit, comprising: a first conductive plane formed into a plurality of circuit traces, at least some of said circuit traces having a width of less than about 5 mils or separated by spaces of less than about 5 mils; a second conductive plane formed into at least one circuit trace; a non-conductive layer disposed between said first and second conductive planes; at least one conductive blind via extending from said conductive plane to an interior surface of a circuit trace formed in said first conductive plane, said blind hole via having a diameter of 5 mils or less and comprising: a layer of carbon black affixed to the walls of an electrically non-conductive via; and a conductive metal bonded to said carbon black.
Claim 10
Dependent Claim
21 words
The thin circuit of claim 7 wherein the thickness of non-conductive layer is from about 1.5 mils to about 5 mils.
Claim 11
Dependent Claim
27 words
The thin circuit of claim 8 wherein said conductive metal bonded to said carbon black is selected from the group consisting of copper, nickel, gold and silver.
Claim 12
Dependent Claim
23 words
The thin circuit of claim 9 wherein said blind hole via has a diameter of from about 3 mils to about 5 mils.
Claim 13
Dependent Claim
33 words
The thin circuit of claim 10 wherein said conductive metal is copper with a thickness in the range of from about 0.5 mils to about 1 mil and said non-conductive layer is polyimide.
References Cited (Backward Citations)
US4551746A
Cited
US4647508A
Cited
US4619741A
Cited
US4631117A
Cited
US4634631A
Cited
US4642160A
Cited
US4684560A
Cited
US4622107A
Cited
US4622108A
Cited
US4718993A
Cited
US4801999A
Cited
US4874477A
Cited
US4897164A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-11-11 | 1995-05-13 | 1995-11-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-11-11 | 1999-05-13 | 1999-11-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-11-11 | 2003-05-13 | 2003-11-12 | $7700.00 | Window Closed / Lapsed |