Process for preparing the through hole walls of a printed wiring board for electroplating

Claim 2

A process for electroplating the walls of through holes in a laminated printed wiring board comprised of at least one non-conducting layer laminated to at least two separate conductive metal layers, which comprises the steps: (a) contacting said printed wiring board with an aqueous polyelectrolyte homopolymer conditioner solution having a charge density from about 0.2 to about 2.5 milliequivalents (positive charge) per gram of dissolved polymer and having a pH in range from about 3 to about 5, followed by; (b) contacting said printed wiring board with a dispersion of carbon black comprising: (1) carbon black particles having an average particle size of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; and (3) a liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non-conducting surfaces and is less than about 4% by weight of said liquid dispersion; then (c) separating substantially all of the liquid dispersing medium from said dispersion, thereby depositing said applied carbon black particles in a substantially continuous layer on said non-conducting portions of said hole walls; and (d) electroplating a substantially continuous metal layer over the deposited carbon black layer on said non-conducting portions of hole walls, thereby electrically connecting said metal layers of said printed wiring board.

Claim 3

The process of claim 1 wherein said contacting step (a) is carried out by immersing the printed wiring board in an aqueous bath containing said polyelectrolyte homopolymer conditioner.

Claim 4

The process of claim 2 wherein said polyelectrolyte homopolymer is selected from the group consisting of polyacrylamide homopolymers and polyamine homopolymers.

Claim 5

The process of claim 3 wherein the concentration of said polyelectrolyte homopolymer is from about 50 to about 600 parts per million parts by weight.

Claim 6

The process of claim 4 wherein said contacting step (a) occurs at room temperature for about 1 to 10 minutes.

Claim 7

The process of claim 1 wherein contacting step (a) is preceded by a contacting step with an aqueous cleaner solution.

Claim 8

The process of claim 6 wherein said aqueous cleaner solution comprises monoethanolamine, ethylene glycol and a nonionic surfactant.

Claim 9

The process of claim 1 wherein said carbon black particles have an initial pH from about 2 to about 4.

Claim 10

The process of claim 1 wherein said surfactant is a phosphate ester anionic surfactant.

Claim 11

The process of claim 1 wherein said liquid dispersing medium is water.

Claim 12

The process of claim 1 wherein said liquid dispersion further comprises a sufficient amount of at least one alkaline hydroxide to raise the pH of said liquid dispersion to about 9 to about 14.

Claim 13

The process of claim 11 wherein said alkaline hydroxide is selected from the group consisting of potassium hydroxide sodium hydroxide and ammonium hydroxide.

Claim 14

The process of claim 1 wherein said liquid dispersion contains less than about 10% by weight of solid constituents.

Claim 15

The process of claim 1 wherein said conductive metal is copper.

Claim 16

The process of claim 1 wherein said process further comprises microetching said metal layers of said printed wiring board after step (c) and before step (d) to remove any deposited carbon black therefrom.

Claim 17

The process of claim 15 wherein said process further comprises a water rinse after said microetching.

Claim 18

A process for electroplating the walls of through holes in a laminated printed wiring board comprised of at least one non-conducting layer laminated to at least two separate conductive metal layers, which comprises the steps: (a) contacting said printed wiring board with aqueous cleaner solution; (b) contacting said printed wiring board with a polyelectrolyte homopolymer conditioner solution having a charge density from about 0.2 to about 2.5 milliequivalents (positive charge) per gram of dissolved polymer and having a pH in range from about 3 to about 5; (c) contacting said printed wiring board with a liquid dispersion of carbon black comprising: (1) carbon black particles having an average particle size of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; (3) a sufficient amount of at least one alkaline hydroxide to raise the pH of said liquid dispersion to about 9.5 to about 12; and (4) a liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non-conducting surfaces and is less than about 4% by weight of said liquid dispersion; then (d) separating substantially all of the liquid dispersing medium from said applied dispersion, thereby depositing said carbon black particles in a substantially continuous layer on said non-conducting portions of said hole walls; and (e) microetching said metal layers of printed wiring board to remove any deposited carbon black therefrom; and (f) electroplating a substantially continuous metal layer over the deposited carbon black layer on said non-conducting portions of hole walls, thereby electrically connecting said metal layers of said printed wiring board.

Claim 19

A process for electroplating the walls of through holes in a laminated printed wiring board comprised of at least one non-conducting layer laminated to at least two separate conductive metal layers, which comprises the steps: (a) contacting said printed wiring board with aqueous cleaner solution; (b) contacting said printed wiring board with a polyelectrolyte homopolymer conditioner solution having a charge density from about 0.2 to about 2.5 milliequivalents (positive charge) per gram of dissolved polymer and having a pH in range from about 3 to about 5; (c) contacting said printed wiring board with a liquid dispersion of carbon black comprising: (1) carbon black particles having an average particle size of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; (3) a sufficient amount of at least one alkaline hydroxide to raise the pH of said liquid dispersion to about 9.5 to about 12; and (4) a liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non-conducting surfaces and is less than about 4% by weight of said liquid dispersion; then (d) separating substantially all of the liquid dispersing medium from said applied dispersion, thereby depositing said carbon black particles in a substantially continuous layer on said non-conducting portions of said hole walls; and (e) microetching said metal layers of printed wiring board to remove any deposited carbon black therefrom; and (f) electroplating a substantially continuous metal layer over the deposited carbon black layer on said non-conducting portions of hole walls, thereby electrically connecting said metal layers of said printed wiring board.

Claim 20

The process of claim 17 wherein said surfactant is a phosphate ester anionic surfactant, said alkaline hydroxide is potassium hydroxide and said liquid dispersing medium is water.