US4619741A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for preparing a non-conductive substrate for electroplating
Assignee: MacDermid Acumen Inc
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Filing: 1985-11-29
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Granted: 1986-10-28
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Expires: 2005-11-29
Abstract
Abstract A process for electroplating a conductive metal layer to the surface of a non-conductive material which comprises: (a) preparing a liquid dispersion of carbon black comprised of: (1) carbon black particles having an average particle diameter of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; and (3) liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non-conducting surfaces and is less than about 4% by weight of said liquid dispersion; (b) applying said liquid disperison to the surface of the non-conducting material; (c) separating substantially all of said liquid dispersing medium from said carbon black particles, whereby said particles are deposited on said non-conductive surface in a substantially continuous layer; and (d) electroplating a substantially continuous conductive metal layer over the deposited carbon black layer and said non-conductive surface.
Inventors
- 👤 Karl L. Minten
- 👤 Galina Pismennaya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 03:52
CPC Classifications
C; C25; C25D; C25D5/00; C25D5/54; C25D5/56; C25D5/48; C25D5/50; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/188; H05K3/40; H05K3/42; H05K3/423; H05K3/424; H05K2201/00; H05K2201/03; H05K2201/032; H05K2201/0323; H05K2203/00; H05K2203/12; H05K2203/122; H05K3/425; H05K3/427
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
152 words
A process for electroplating a conductive metal layer to the surface of a non-conductive material which comprises: (a) preparing a liquid dispersion of carbon black comprised of: (1) carbon black particles having an average particle diameter of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; and (3) liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non-conducting surfaces and is less than about 4% by weight of said liquid dispersion; (b) applying said liquid dispersion to the surface of the non-conducting material; (c) separating substantially all of said liquid dispersing medium from said carbon black particles, whereby said particles are deposited on said non-conductive surface in a substantially continuous layer; and (d) electroplating a substantially continuous conductive metal layer over the deposited carbon black layer and said non-conductive surface.
Claim 2
Dependent Claim
152 words
A process for electroplating a conductive metal layer to the surface of a non-conductive material which comprises: (a) preparing a liquid dispersion of carbon black comprised of: (1) carbon black particles having an average particle diameter of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; and (3) liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non-conducting surfaces and is less than about 4% by weight of said liquid dispersion; (b) applying said liquid dispersion to the surface of the non-conducting material; (c) separating substantially all of said liquid dispersing medium from said carbon black particles, whereby said particles are deposited on said non-conductive surface in a substantially continuous layer; and (d) electroplating a substantially continuous conductive metal layer over the deposited carbon black layer and said non-conductive surface.
Claim 3
Dependent Claim
36 words
The process of claim 1 wherein said liquid dispersion further comprises a sufficient amount of at least one alkaline hydroxide dto raise the pH of said liquid dispersion in the range from about 10 to 14.
Claim 4
Dependent Claim
23 words
The process of claim 2 wherein said alkaline hydroxide is selected from the group consisting of potassium hydroxide, sodium hydroxide, and ammonium hydroxide.
Claim 5
Dependent Claim
28 words
The process of claim 2 wherein said liquid dispersion further comprises an alkaline silicate, which is formed by the reaction of fumed silica particles and said alkaline hydroxide.
Claim 6
Dependent Claim
12 words
The process of claim 1 wherein said liquid dispersing medium is water.
Claim 7
Dependent Claim
18 words
The process of claim 1 wherein said liquid dispersion contains less than about 10% by weight solids constituents.
Claim 8
Dependent Claim
20 words
The process of claim 1 wherein said carbon black particles have an initial pH from about 2 to about 4.
Claim 9
Dependent Claim
14 words
The process of claim 1 wherein said surfactant is a phosphate ester anionic surfactant.
Claim 10
Dependent Claim
21 words
The process of claim 1 wherein said conductive metal is selected from the group consisting of copper, nickel, gold and silver.
Claim 11
Dependent Claim
11 words
The process of claim 9 wherein said conductive metal is copper.
Claim 12
Dependent Claim
22 words
The process of claim 1 wherein said applying step (b) is carried out by immersing the non-conductive material into said liquid dispersion.
Claim 13
Dependent Claim
18 words
The process of claim 1 wherein said separating step (c) is carried out by heating the deposited dispersion.
Claim 14
Dependent Claim
187 words
The process for electroplating the walls of through holes in a laminated printed wiring board comprised of at least one non-conducting layer laminated to at least two separate conductive metal layers, which comprises the steps: (a) applying said printed wiring board having said through holes in a bath of a liquid dispersion of carbon black comprised of: (1) carbon black particles having an average particle size of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; and (3) a liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non-conducting surfaces and is less than about 4% by weight of said liquid dispersion; (b) separating substantially all of the liquid dispersing medium from said dispersion, thereby depositing said carbon black particles in a substantially continuous layer on said non-conducting portions of said hole walls; and (c) electroplating a substantially continuous metal layer over the deposited carbon black layer on said non-conducting portions of hole walls, thereby electrically connecting said metal layers of said printed wiring board.
Claim 15
Dependent Claim
187 words
The process for electroplating the walls of through holes in a laminated printed wiring board comprised of at least one non-conducting layer laminated to at least two separate conductive metal layers, which comprises the steps: (a) applying said printed wiring board having said through holes in a bath of a liquid dispersion of carbon black comprised of: (1) carbon black particles having an average particle size of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; and (3) a liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non-conducting surfaces and is less than about 4% by weight of said liquid dispersion; (b) separating substantially all of the liquid dispersing medium from said dispersion, thereby depositing said carbon black particles in a substantially continuous layer on said non-conducting portions of said hole walls; and (c) electroplating a substantially continuous metal layer over the deposited carbon black layer on said non-conducting portions of hole walls, thereby electrically connecting said metal layers of said printed wiring board.
Claim 16
Dependent Claim
36 words
The process of claim 13 wherein said liquid dispersion further comprises a sufficient amount of at least one alkaline hydroxide to raise the pH of said liquid dispersion in the range from about 10 to 14.
Claim 17
Dependent Claim
28 words
The process of claim 14 wherein said liquid dispersion further comprises an alkaline silicate, which is formed by the reaction of fumed silica particles and said alkaline hydroxide.
Claim 18
Dependent Claim
18 words
The process of claim 15 wherein said liquid dispersion contains less than about 10% by weight solids constituents.
Claim 19
Dependent Claim
20 words
The process of claim 13 wherein said carbon black particles have an initial pH from about 2 to about 4.
Claim 20
Dependent Claim
14 words
The process of claim 13 wherein said surfactant is a phosphate ester anionic surfactant.
Claim 21
Dependent Claim
11 words
The process of claim 13 wherein said conductive metal is copper.
Claim 22
Dependent Claim
12 words
The process of claim 13 wherein said liquid dispersing medium is water.
Claim 23
Dependent Claim
33 words
The process of claim 13 wherein said process further comprises microetching said metal layers of said printed wiring board after step (b) and before step (c) to remove any deposited carbon black therefrom.
Claim 24
Dependent Claim
16 words
The process of claim 21 wherein said process further comprises a water rinse after said microetching.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1989-10-27 | 1990-04-28 | 1990-10-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-10-27 | 1994-04-28 | 1994-10-28 | $3760.00 | Window Closed / Lapsed |
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