US4976808A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for removing a polyimide resin by dissolution
Assignee: Sumitomo Metal Mining Co Ltd
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Filing: 1990-04-11
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Granted: 1990-12-11
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Expires: 2010-04-11
Abstract
Abstract When a TAB tape is manufactured from a substrate which has been prepared by forming an electrolessly plated cooper layer on a polyimide resin, and heat treated at a temperature of 120° C. to 420° C., any unwanted portion of the resin is dissolved in a solution containing hydrazine hydrate after the copper layer has been patterned to form leads, and any unwanted portion thereof removed by etching, whereby the unwanted portions of the resin are substantially removed, but an organic substance is formed to remain as an undissolved film. This film is removed by treatment with one or two of a solution containing ammonium ions, a solution containing halogen ions and a solution which can dissolve copper.
Inventors
- 👤 Shuichi Ogasawara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 05:41
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/002; H10W99/00; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346; H05K1/0393; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2203/00; H05K2203/02; H05K2203/0285; H05K2203/05; H05K2203/0548; H05K2203/0554; H05K2203/07; H05K2203/0779; H05K2203/0786; H05K2203/12; H05K2203/122; H05K3/0055; H05K3/10; H05K3/18; H05K3/181; H05K3/38; H05K3/382; H05K3/383
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
143 words
In a process for manufacturing a tape for tape automated bonding from a substrate prepared by forming an electrolessly plated copper layer on a polyimide resin, and heat treated at a temperature of 120° C. to 420° C., said process including patterning said copper layer to form leads, etching any unwanted portion of said copper layer, and removing any unwanted portion of said resin by dissolution from said substrate, the improvement wherein said removing comprises: dissolving said unwanted portion of said resin in a solution containing hydrazine hydrate, whereby said resin portion is substantially removed, while an organic substance is formed to remain as an undissolved film; and removing said undissolved film by treating it with at least one, but at most two solutions selected from a solution containing ammonium ions, a solution containing halogen ions and a solution which can dissolve copper.
Claim 2
Dependent Claim
143 words
In a process for manufacturing a tape for tape automated bonding from a substrate prepared by forming an electrolessly plated copper layer on a polyimide resin, and heat treated at a temperature of 120° C. to 420° C., said process including patterning said copper layer to form leads, etching any unwanted portion of said copper layer, and removing any unwanted portion of said resin by dissolution from said substrate, the improvement wherein said removing comprises: dissolving said unwanted portion of said resin in a solution containing hydrazine hydrate, whereby said resin portion is substantially removed, while an organic substance is formed to remain as an undissolved film; and removing said undissolved film by treating it with at least one, but at most two solutions selected from a solution containing ammonium ions, a solution containing halogen ions and a solution which can dissolve copper.
Claim 3
Dependent Claim
27 words
A process as set forth in claim 1, wherein said solution containing ammonium ions is selected from aqueous ammonia and an aqueous solution of an ammonium salt.
Claim 4
Dependent Claim
33 words
A process as set forth in claim 1, wherein said solution containing halogen ions is selected from an aqueous solution of hydrogen halide and an aqueous solution of a salt containing a halogen.
Claim 5
Dependent Claim
69 words
A process as set forth in claim 1, wherein said solution which can dissolve copper is selected from an aqueous solution of cupric chloride, an aqueous solution of ferric chloride, an aqueous solution of ammonium persulfate, an aqueous solution of potassium persulfate, an aqueous solution of sodium persulfate, an aqueous solution of hydrogen peroxide, sulfuric acid and nitric acid, and a mixture of two of said solutions and acids.
Claim 6
Dependent Claim
28 words
A process as set forth in any one of claims 1 to 4, wherein ultrasonic agitation is given to said solution used for said removing of said film.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1993-12-10 | 1994-06-11 | 1994-12-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-12-10 | 1998-06-11 | 1998-12-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-12-10 | 2002-06-11 | 2002-12-11 | $7700.00 | Window Closed / Lapsed |