Semiconductor flipchip packaging having a perimeter wall

Claim 1

A semiconductor device comprising: a semiconductor chip having a first surface at which a pixel area is formed; a plurality of chip electrodes formed on said first surface of said chip around said pixel area; a transparent board provided so as to face said chip, said board having a first surface which faces said first surface of said chip; a plurality of board electrodes provided on said board so as to correspond to said chip electrodes; a plurality of bumps for connecting said chip electrodes to said board electrodes on a one-to-one basis, said bumps being made of a solder metal; wiring layers formed on said first surface of said board and connected to said chip electrodes through said bumps and board electrodes; and a wall member connecting said first surface of said chip to said first surface of said board, and arranged to be surrounded by said bumps and to continuously surround said pixel area so as to form an essentially closed space between said chip and said board, said wall member being made of a material which has a coefficient of thermal expansion the same as or similar to that of said solder metal of said bumps so as to contribute to the connection between said chip and said board and undertake stress caused by a thermal effect applied to said device, and which transfers heat generated in said pixel area to said board so as to increase a temperature of said first surface of said board and prevent dew condensation thereon in said closed space.