US4942140A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of packaging semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1989-06-09
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Granted: 1990-07-17
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Expires: 2009-06-09
Abstract
Abstract In a method of packaging a semiconductor device, the semiconductor device and a mounting body are positioned in such a manner that electrodes of the semiconductor device and leads of the mounting body are brought into slidable mechanical contact with each other, the electrodes being not bonded to the leads. Next, an insulating resin that shrinks on setting is supplied in such a manner that the contacted portions of the electrodes and the leads are covered. Subsequently, the resin is set while keeping the electrodes and the leads in contact with each other to bond the electrodes to the leads whereby the resin, when set, applies a compressive force between the electrodes and the leads.
Inventors
- 👤 Hideaki Ootsuki
- 👤 Mitsuyuki Takada
- 👤 Toru Kokogawa
- 👤 Hayato Takasago
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 12:57
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/111; H10W74/114; H10W74/15; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/853; H10W72/856; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
110 words
A method of packaging a semiconductor device comprising: positioning a semiconductor device and a mounting body with the electrodes of said semiconductor device and the leads of said mounting body in slidable mechanical contact with each other, said electrodes not being bonded to said leads; applying a settable electrically insulating resin that shrinks upon setting, covering the portions of said unbonded electrodes and leads that are in contact with each other; and setting said insulating resin while keeping said electrodes and said leads in contact with each other to fix said electrodes to said leads whereby said resin, when set, applies a compressive force between said electrodes and said leads.
Claim 2
Independent Claim
110 words
A method of packaging a semiconductor device comprising: positioning a semiconductor device and a mounting body with the electrodes of said semiconductor device and the leads of said mounting body in slidable mechanical contact with each other, said electrodes not being bonded to said leads; applying a settable electrically insulating resin that shrinks upon setting, covering the portions of said unbonded electrodes and leads that are in contact with each other; and setting said insulating resin while keeping said electrodes and said leads in contact with each other to fix said electrodes to said leads whereby said resin, when set, applies a compressive force between said electrodes and said leads.
Claim 3
Dependent Claim
18 words
A method of packaging a semiconductor device according to claim 1 wherein said mounting body is a substrate.
Claim 4
Dependent Claim
27 words
A method of packaging a semiconductor device according to claim 2 including pressing said electrodes and said leads against each other during setting of said insulating resin.
Claim 5
Dependent Claim
33 words
A method of packaging a semiconductor device according to claim 3 wherein the pressing of said electrodes and said leads includes pressing said semiconductor device toward said mounting body with a bar-shaped presser.
Claim 6
Dependent Claim
27 words
A method of packaging a semiconductor device according to claim 4 including covering the contacting portions of said presser and said semiconductor device with said insulating resin.
Claim 7
Dependent Claim
33 words
A method of packaging a semiconductor device according to claim 5 including severing a portion of said presser which is covered with said insulating resin after said setting step has been carried out.
Claim 8
Dependent Claim
31 words
A method of packaging a semiconductor device according to claim 4 including removing the portion of said presser not covered by said insulating resin after said setting step has been completed.
Claim 9
Dependent Claim
58 words
A method of packaging a semiconductor device according to claim 2 wherein said resin applying and setting steps are carried out while a flat plate having an area larger than that of the surface opposite to that of said semiconductor device on which said electrodes are formed is in contact with said opposing surface of said semiconductor device.
Claim 10
Dependent Claim
18 words
A method of packaging a semiconductor device according to claim 2 wherein said substrate is a glass substrate.
Claim 11
Dependent Claim
19 words
A method of packaging a semiconductor device according to claim 1 wherein said mounting body is a film carrier.
Claim 12
Dependent Claim
27 words
A method of packaging a semiconductor device according to claim 10 including pressing said electrodes and said leads against each other during setting of said insulating resin.
Claim 13
Dependent Claim
37 words
A method of packaging a semiconductor device according to claim 11 wherein said film carrier has an opening into which the forward ends of said leads protrude, including contacting said electrodes with said leads within said opening.
Claim 14
Dependent Claim
34 words
A method of packaging a semiconductor device according to claim 12 including pressing said electrodes and said leads together by pressing the forward ends of said leads toward said semiconductor device using a presser.
Claim 15
Dependent Claim
24 words
A method of packaging a semiconductor device according to claim 13 wherein said presser has a flat plate-like pressing portion at its forward end.
Claim 16
Dependent Claim
73 words
A method of packaging a semiconductor device according to claim 13 wherein said pressing of said electrodes and said leads is performed through a flat plate disposed between the forward ends of said leads and said presser, said insulating resin being coated on a surface of said flat plate which faces the forward ends of said leads, said resin applying step being carried out by pressing said flat plate toward said semiconductor device.
Claim 17
Dependent Claim
19 words
A method of packaging a semiconductor device according to claim 1 including supplying said insulating resin as a liquid.
Claim 18
Dependent Claim
25 words
A method of packaging a semiconductor device according to claim 1 wherein said insulating resin is thermoset and has a positive coefficient of thermal expansion.
Claim 19
Dependent Claim
20 words
A method of packaging a semiconductor device according to claim 1 wherein said insulating resin is a cold setting resin.
Claim 20
Dependent Claim
19 words
A method of packaging a semiconductor device according to claim 1 wherein said semiconductor device is a flip-chip IC.
Claim 21
Dependent Claim
18 words
A method of packaging a semiconductor device according to claim 2 wherein said substrate is a ceramic substrate.
Claim 22
Dependent Claim
19 words
A method of packaging a semiconductor device according to claim 2 wherein said substrate is a epoxy glass substrate.
Claim 23
Dependent Claim
45 words
A method of packaging a semiconductor device according to claim 1 including leaving a hollow portion between portions of said semiconductor device other than said electrodes and portions of said mounting body other than said leads not filled with said resin after said setting step.
Claim 24
Dependent Claim
37 words
A method of packaging a semiconductor device according to claim 1 including supplying said resin over the surface opposite to a surface of said semiconductor device on which said electrodes are formed in said resin applying step.
Claim 25
Dependent Claim
38 words
A method of packaging a semiconductor device according to claim 1 including not supplying said resin on the surface opposite to a surface of said semiconductor device on which said electrodes are formed in said resin applying step.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-07-16 | 1994-01-15 | 1994-07-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-07-16 | 1998-01-15 | 1998-07-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-07-16 | 2002-01-15 | 2002-07-17 | $7700.00 | Window Closed / Lapsed |