Method of mounting semiconductor element

Abstract

Abstract PURPOSE:To reduce the number of steps in mounting process and to prevent the reduction of yield due to deformation of leads, thus permitting the lower cost, by a method wherein a vertically movable receiving stand bearing a base plate and an element thereon is raised up, lead portions of a substrate are aligned with electrodes of the element, and a heating head is lowered to be brought into press-contact therewith. CONSTITUTION:A heating head 14 and a receiving stand 13 are disposed above and below a circuit substrate 10, respectively, to be movable in the vertical direction. An element 16 is placed on the receiving stand 13 via a base plate 15 with its electrodes 16a looking upward. The base plate 15 comprises two layers the upper one of which is formed of thermoplastic resin 15a and the lower one of which is formed on thermosetting resin 15b of low thermal conductivity. Then, the receiving stand 13 is raised up and lead portions 12 of the substrate 10 are alighed with the element electrodes 16a, respectively. Thereafter, the heating head 14 is lowered to be brought into press- contact therewith, so that the lead portions are bonded to the electrdes. During this bonding process, the upper layer 15a of the base plate is softened and melted in order to secure the element 16. Subsequently, the element is sealed by resin 17. Two processes of bonding and securing can be performed in one step, so that the number of processes is reduced and deformation of the leads is prevented.

Inventors

• 👤 Nobuo Ukon

Bibliographic Details