US5493096A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thin substrate micro-via interconnect
Assignee: Grumman Corp
•
Filing: 1994-05-10
•
Granted: 1996-02-20
•
Expires: 2014-05-10
Abstract
Abstract A method for forming conductive via interconnects utilizes the steps of: applying a sacrificial coating to at least one surface of a substrate; laser drilling the substrate through the sacrificial coating to form a via through-hole; applying a conductive coating to the via through-hole; and removing the sacrificial coating(s). Recasting and shattering thus occur in the sacrificial coating rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Inventors
- 👤 Wei H. Koh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 21:13
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0029; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2203/00; H05K2203/13; H05K2203/1377; H05K2203/1383; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4076
Claims Analysis
Total Claims: 75
Claim 1
Independent Claim
93 words
A method for forming a conductive via interconnect, the method comprising the steps of: a) applying a sacrificial coating, of a high melting temperature polymer, to at least one surface of a substrate; b) laser drilling the substrate through the sacrificial coating to form a via through-hole; c) applying a conductive coating to the via through-hole; and d) removing the at least one sacrificial coating(s); e) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Claim 2
Independent Claim
93 words
A method for forming a conductive via interconnect, the method comprising the steps of: a) applying a sacrificial coating, of a high melting temperature polymer, to at least one surface of a substrate; b) laser drilling the substrate through the sacrificial coating to form a via through-hole; c) applying a conductive coating to the via through-hole; and d) removing the at least one sacrificial coating(s); e) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Claim 3
Dependent Claim
34 words
The method as recited in claim 1 wherein the step of applying a sacrificial coating to at least one surface of the substrate comprises applying a sacrificial coating to two surfaces of the substrate.
Claim 4
Dependent Claim
19 words
The method as recited in claim 1 wherein the polymer has a melting temperature less than approximately 400° C.
Claim 5
Dependent Claim
41 words
The method as recited in claim 1 wherein the polymer has a melting temperature less than approximately 400° C. and further comprising the step of filling the via through-hole with a glass dielectric composition fireable between approximately 500° and 800° C.
Claim 6
Dependent Claim
37 words
The method as recited in claim 1 wherein the step of applying a sacrificial coating to at least one surface of a substrate comprises applying a sacrificial coating to at least one surface of a ceramic substrate.
Claim 7
Dependent Claim
32 words
The method as recited in claim 1 wherein the step of laser drilling the substrate comprises laser drilling the substrate with at least one of an eximer laser and a YAG laser.
Claim 8
Dependent Claim
45 words
The method as recited in claim 1 wherein the step of applying a sacrificial coating to at least one side of a substrate comprises applying a sacrificial coating to at least one side of a substrate having a thickness of greater than approximately 100 microns.
Claim 9
Dependent Claim
35 words
The method as recited in claim 1 wherein the step of laser drilling the substrate comprises laser drilling the substrate so as to form a through-hole having a diameter of less than approximately 50 microns.
Claim 10
Dependent Claim
36 words
The method as recited in claim 1 wherein the step of laser drilling the substrate comprises laser drilling the substrate so as to form a via through-hole having an aspect ratio of greater than approximately 2.
Claim 11
Dependent Claim
22 words
The method as recited in claim 1 wherein the step of applying a conductive coating to said via through-hole comprises screen printing.
Claim 12
Dependent Claim
21 words
The method as recited in claim 1 wherein the step of applying a conductive coating to said via through-hole comprises spraying.
Claim 13
Dependent Claim
34 words
The method as recited in claim 1 further comprising the steps of filling the via through-hole with an insulator after the step of applying a conductive coating to the via through-hole and then sintering.
Claim 14
Dependent Claim
33 words
The method as recited in claim 1 further comprising the step of filling the via through-hole with glass after the step of applying a conductive coating to the via through-hole and then sintering.
Claim 15
Dependent Claim
56 words
The method as recited in claim 1 wherein the step of applying a sacrificial coating comprises applying an organic sacrificial coating and further comprising the step of sintering the conductive coating applied to the via through-hole at a temperature above the decomposition point of the sacrificial coating so as to cause the sacrificial coating to decompose.
Claim 16
Dependent Claim
29 words
The method as recited in claim 14 further comprising the step of removing the decomposed sacrificial coating by dusting off residual ashes formed by sintering of the sacrificial coating.
Claim 17
Independent Claim
81 words
A method for forming a via through-hole, the method comprising the steps of: a) applying a sacrificial coating formed as a polymer to at least one surface of a substrate; b) laser drilling the substrate through the sacrificial coating to form a via through-hole; and c) removing the at least one sacrificial coating(s); d) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Claim 18
Independent Claim
81 words
A method for forming a via through-hole, the method comprising the steps of: a) applying a sacrificial coating formed as a polymer to at least one surface of a substrate; b) laser drilling the substrate through the sacrificial coating to form a via through-hole; and c) removing the at least one sacrificial coating(s); d) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Claim 19
Dependent Claim
34 words
The method as recited in claim 16 wherein the step of applying a sacrificial coating to at least one surface of the substrate comprises applying a sacrificial coating to two surfaces of the substrate.
Claim 20
Dependent Claim
19 words
The method as recited in claim 16 wherein the polymer has a melting temperature lower than approximately 400° C.
Claim 21
Dependent Claim
37 words
The method as recited in claim 16 wherein the step of applying a sacrificial coating to at least one surface of a substrate comprises applying a sacrificial coating to at least one surface of a ceramic substrate.
Claim 22
Dependent Claim
32 words
The method as recited in claim 17 wherein the step of laser drilling the substrate comprises laser drilling the substrate with at least one of an excimer laser and a YAG laser,
Claim 23
Dependent Claim
45 words
The method as recited in claim 16 wherein the step of applying a sacrificial coating to at least one side of a substrate comprises applying a sacrificial coating to at least one side of a substrate having a thickness of greater than approximately 100 microns.
Claim 24
Dependent Claim
35 words
The method as recited in claim 16 wherein the step of laser drilling the substrate comprises laser drilling the substrate so as to form a through-hole having a diameter of less than approximately 50 microns.
Claim 25
Dependent Claim
36 words
The method as recited in claim 16 wherein the step of laser drilling the substrate comprises laser drilling the substrate so as to form a via through-hole having an aspect ratio of greater than approximately 2.
Claim 26
Independent Claim
96 words
A method for forming a conductive via interconnect, the method comprising the steps of: a) applying a sacrificial coating to at least one surface of a substrate having a thickness of greater than approximately 100 microns; b) laser drilling the substrate through the sacrificial coating to form a via through-hole; c) applying a conductive coating to the via through-hole; and d) removing the at least one sacrificial coating(s); e) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Claim 27
Independent Claim
96 words
A method for forming a conductive via interconnect, the method comprising the steps of: a) applying a sacrificial coating to at least one surface of a substrate having a thickness of greater than approximately 100 microns; b) laser drilling the substrate through the sacrificial coating to form a via through-hole; c) applying a conductive coating to the via through-hole; and d) removing the at least one sacrificial coating(s); e) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Claim 28
Dependent Claim
34 words
The method as recited in claim 24 wherein the step of applying a sacrificial coating to at least one surface of the substrate comprises applying a sacrificial coating to two surfaces of the substrate.
Claim 29
Dependent Claim
22 words
The method as recited in claim 24 wherein the step of applying a sacrificial coating comprises applying a high melting temperature polymer.
Claim 30
Dependent Claim
19 words
The method as recited in claim 26 wherein the polymer has a melting temperature less than approximately 400° C.
Claim 31
Dependent Claim
41 words
The method as recited in claim 26 wherein the polymer has a melting temperature less than approximately 400° C. and further comprising the step of filling the via through-hole with a glass dielectric composition fireable between approximately 500° and 800° C.
Claim 32
Dependent Claim
37 words
The method as recited in claim 24 wherein the step of applying a sacrificial coating to at least one surface of a substrate comprises applying a sacrificial coating to at least one surface of a ceramic substrate.
Claim 33
Dependent Claim
32 words
The method as recited in claim 24 wherein the step of laser drilling the substrate comprises laser drilling the substrate with at least one of an excimer laser and a YAG laser.
Claim 34
Dependent Claim
35 words
The method as recited in claim 24 wherein the step of laser drilling the substrate comprises laser drilling the substrate so as to form a through-hole having a diameter of less than approximately 50 microns.
Claim 35
Dependent Claim
36 words
The method as recited in claim 24 wherein the step of laser drilling the substrate comprises laser drilling the substrate so as to form a via through-hole having an aspect ratio of greater than approximately 2.
Claim 36
Dependent Claim
22 words
The method as recited in claim 24 wherein the step of applying a conductive coating to said via through-hole comprises screen printing.
Claim 37
Dependent Claim
21 words
The method as recited in claim 24 wherein the step of applying a conductive coating to said via through-hole comprises spraying.
Claim 38
Dependent Claim
34 words
The method as recited in claim 24 further comprising the steps of filling the via through-hole with an insulator after the step of applying a conductive coating to the via through-hole and then sintering.
Claim 39
Dependent Claim
33 words
The method as recited in claim 24 further comprising the step of filling the via through-hole with glass after the step of applying a conductive coating to the via through-hole and then sintering.
Claim 40
Dependent Claim
56 words
The method as recited in claim 24 wherein the step of applying a sacrificial coating comprises applying an organic sacrificial coating and further comprising the step of sintering the conductive coating applied to the via through-hole at a temperature above the decomposition point of the sacrificial coating so as to cause the sacrificial coating to decompose.
Claim 41
Dependent Claim
29 words
The method as recited in claim 37 further comprising the step of removing the decomposed sacrificial coating by dusting off residual ashes formed by sintering of the sacrificial coating.
Claim 42
Independent Claim
118 words
A method for forming a conductive via interconnect, the method comprising the steps of: a) applying an organic sacrificial coating to at least one surface of a substrate; b) laser drilling the substrate through the sacrificial coating to form a via through-hole; c) applying a conductive coating to the via through-hole; d) sintering the conductive coating applied to the via through-hole at a temperature above the decomposition point of the sacrificial coating so as to cause the sacrificial coating to decompose; and e) removing the at least one sacrificial coating(s); f) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Claim 43
Independent Claim
118 words
A method for forming a conductive via interconnect, the method comprising the steps of: a) applying an organic sacrificial coating to at least one surface of a substrate; b) laser drilling the substrate through the sacrificial coating to form a via through-hole; c) applying a conductive coating to the via through-hole; d) sintering the conductive coating applied to the via through-hole at a temperature above the decomposition point of the sacrificial coating so as to cause the sacrificial coating to decompose; and e) removing the at least one sacrificial coating(s); f) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Claim 44
Dependent Claim
34 words
The method as recited in claim 39 wherein the step of applying the sacrificial coating to at least one surface of the substrate comprises applying a sacrificial coating to two surfaces of the substrate.
Claim 45
Dependent Claim
22 words
The method as recited in claim 39 wherein the step of applying the sacrificial coating comprises applying a high melting temperature polymer.
Claim 46
Dependent Claim
19 words
The method as recited in claim 41 wherein the polymer has a melting temperature less than approximately 400° C.
Claim 47
Dependent Claim
41 words
The method as recited in claim 41 wherein the polymer has a melting temperature less than approximately 400° C. and further comprising the step of filling the via through-hole with a glass dielectric composition fireable between approximately 500° and 800° C.
Claim 48
Dependent Claim
37 words
The method as recited in claim 39 wherein the step of applying the sacrificial coating to at least one surface of a substrate comprises applying a sacrificial coating to at least one surface of a ceramic substrate.
Claim 49
Dependent Claim
32 words
The method as recited in claim 39 wherein the step of laser drilling the substrate comprises laser drilling the substrate with at least one of an excimer laser and a YAG laser.
Claim 50
Dependent Claim
45 words
The method as recited in claim 39 wherein the step of applying a sacrificial coating to at least one side of a substrate comprises applying a sacrificial coating to at least one side of a substrate having a thickness of greater than approximately 100 microns.
Claim 51
Dependent Claim
35 words
The method as recited in claim 39 wherein the step of laser drilling the substrate comprises laser drilling the substrate so as to form a through-hole having a diameter of less than approximately 50 microns.
Claim 52
Dependent Claim
36 words
The method as recited in claim 39 wherein the step of laser drilling the substrate comprises laser drilling the substrate so as to form a via through-hole having an aspect ratio of greater than approximately 2.
Claim 53
Dependent Claim
22 words
The method as recited in claim 39 wherein the step of applying a conductive coating to said via through-hole comprises screen printing.
Claim 54
Dependent Claim
21 words
The method as recited in claim 39 wherein the step of applying a conductive coating to said via through-hole comprises spraying.
Claim 55
Dependent Claim
34 words
The method as recited in claim 39 further comprising the steps of filling the via through-hole with an insulator after the step of applying a conductive coating to the via through-hole and then sintering.
Claim 56
Dependent Claim
33 words
The method as recited in claim 39 further comprising the step of filling the via through-hole with glass after the step of applying a conductive coating to the via through-hole and then sintering.
Claim 57
Dependent Claim
29 words
The method as recited in claim 39 further comprising the step of removing the decomposed sacrificial coating by dusting off residual ashes formed by sintering of the sacrificial coating.
Claim 58
Independent Claim
81 words
A method for forming a via through-hole, the method comprising the steps of: a) applying a sacrificial coating formed as a polymide to at least one surface of a substrate; b) laser drilling the substrate through the sacrificial coating to form a via through-hole; and c) removing the at least one sacrificial coating(s); d) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Claim 59
Independent Claim
81 words
A method for forming a via through-hole, the method comprising the steps of: a) applying a sacrificial coating formed as a polymide to at least one surface of a substrate; b) laser drilling the substrate through the sacrificial coating to form a via through-hole; and c) removing the at least one sacrificial coating(s); d) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Claim 60
Dependent Claim
34 words
The method as recited in claim 54 wherein the step of applying a sacrificial coating to at least one surface of the substrate comprises applying a sacrificial coating to two surfaces of the substrate.
Claim 61
Dependent Claim
37 words
The method as recited in claim 54 wherein the step of applying a sacrificial coating to at least one surface of a substrate comprises applying a sacrificial coating to at least one surface of a ceramic substrate.
Claim 62
Dependent Claim
32 words
The method as recited in claim 54 wherein the step of laser drilling the substrate comprises laser drilling the substrate with at least one of an excimer laser and a YAG laser.
Claim 63
Dependent Claim
45 words
The method as recited in claim 54 wherein the step of applying a sacrificial coating to at least one surface of a substrate comprises applying a sacrificial coating to at least one surface of a substrate having a thickness of greater than approximately 100 microns.
Claim 64
Dependent Claim
35 words
The method as recited in claim 54 wherein the step of laser drilling the substrate comprises laser drilling the substrate so as to form a through-hole having a diameter of less than approximately 50 microns.
Claim 65
Dependent Claim
36 words
The method as recited in claim 54 wherein the step of laser drilling the substrate comprises laser drilling the substrate so as to form a via through-hole having an aspect ratio of greater than approximately 2.
Claim 66
Independent Claim
86 words
A method for forming a via through-hole, the method comprising the steps of: a) applying a sacrificial coating to at least one surface of a substrate having a thickness of approximately greater than 100 microns; b) laser drilling the substrate through the sacrificial coating to form a via through-hole; and c) removing the at least one sacrificial coating(s); d) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Claim 67
Independent Claim
86 words
A method for forming a via through-hole, the method comprising the steps of: a) applying a sacrificial coating to at least one surface of a substrate having a thickness of approximately greater than 100 microns; b) laser drilling the substrate through the sacrificial coating to form a via through-hole; and c) removing the at least one sacrificial coating(s); d) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Claim 68
Dependent Claim
34 words
The method as recited in claim 61 wherein the step of applying a sacrificial coating to at least one surface of the substrate comprises applying a sacrificial coating to two surfaces of the substrate.
Claim 69
Dependent Claim
19 words
The method as recited in claim 61 wherein the step of applying a sacrificial coating comprises applying a polymer.
Claim 70
Dependent Claim
19 words
The method as recited in claim 63 wherein the polymer has a melting temperature lower than approximately 400° C.
Claim 71
Dependent Claim
19 words
The method as recited in claim 61 wherein the step of applying a sacrificial coating comprises applying a polymide.
Claim 72
Dependent Claim
19 words
The method as recited in claim 61 wherein the step of applying a sacrificial coating comprises applying a polymide.
Claim 73
Dependent Claim
37 words
The method as recited in claim 61 wherein the step of applying a sacrificial coating to at least one surface of a substrate comprises applying a sacrificial coating to at least one surface of a ceramic substrate.
Claim 74
Dependent Claim
31 words
The method as recited in claim 61 wherein the step of laser drilling the substrate comprises laser drilling the substrate with at least one of an eximer laser and YAG laser.
Claim 75
Dependent Claim
36 words
The method as recited in claim 61 wherein the step of laser drilling the substrate comprises laser drilling the substrate so as to form a via through-hole having an aspect ratio of greater than approximately 2.
References Cited (Backward Citations)
US3956052A
Cited
US4304624A
Cited
US4354107A
Cited
US4168992A
Cited
US4170490A
Cited
US4646128A
Cited
US4551629A
Cited
US4403238A
Cited
JPS5933091A
Cited
US4792672A
Cited
US4703170A
Cited
US4618763A
Cited
US4870031A
Cited
JPS6293091A
Cited
US4706166A
Cited
US4857477A
Cited
US4764846A
Cited
US4794092A
Cited
US4956694A
Cited
US4948941A
Cited
US4992393A
Cited
US5100501A
Cited
US4992908A
Cited
US5013687A
Cited
US5315147A
Cited
US4978420A
Cited
US5213876A
Cited
US5451291A
Cited
US5316803A
Cited
US5360491A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-02-19 | 1999-08-21 | 2000-02-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-02-19 | 2003-08-21 | 2004-02-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-02-19 | 2007-08-21 | 2008-02-20 | $7700.00 | Window Closed / Lapsed |