US4948941A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of laser drilling a substrate
Assignee: Motorola Solutions Inc
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Filing: 1989-02-27
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Granted: 1990-08-14
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Expires: 2009-02-27
Abstract
Abstract A method of laser drilling a substrate includes the steps of placing a sacrificial member over the substrate, and then laser drilling through the sacrificial member. This method produces a substantially uniform hole in the substrate.
Inventors
- 👤 Leonard F. Altman
- 👤 Thomas N. Johnson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 17:06
CPC Classifications
B; B23; B23K; B23K26/00; B23K26/18; B23K26/36; B23K26/38; B23K26/382; B23K26/40; H; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0029; B23K2103/00; B23K2103/50; B23K2103/52; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2203/00; H05K2203/13; H05K2203/1377; H05K2203/1383
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
69 words
A method for forming a hole or cavity in a substrate with a coherent energy beam, comprising the steps of: selecting a first member having a thickness less than the substrate and composed of the same material as the substrate; placing the first member contiguous to the substrate; and forming a hole or cavity in the substrate by penetrating said member and said substrate with the coherent energy beam.
Claim 2
Independent Claim
69 words
A method for forming a hole or cavity in a substrate with a coherent energy beam, comprising the steps of: selecting a first member having a thickness less than the substrate and composed of the same material as the substrate; placing the first member contiguous to the substrate; and forming a hole or cavity in the substrate by penetrating said member and said substrate with the coherent energy beam.
Claim 3
Independent Claim
51 words
A method of laser drilling a substrate comprising the steps of: first selecting a sacrificial member having a thickness less than the substrate and composed of the same material as the substrate; placing a sacrificial member adjacent to the substrate, and laser drilling through both the sacrificial member and the substrate.
Claim 4
Independent Claim
51 words
A method of laser drilling a substrate comprising the steps of: first selecting a sacrificial member having a thickness less than the substrate and composed of the same material as the substrate; placing a sacrificial member adjacent to the substrate, and laser drilling through both the sacrificial member and the substrate.
Claim 5
Dependent Claim
20 words
A method of laser drilling a substrate as defined in claim 2, including the step of: selecting a ceramic substrate.
Claim 6
Independent Claim
39 words
A method of laser drilling a ceramic substrate comprising the steps of: placing a thin sacrificial ceramic member adjacent to a ceramic substrate, laser drilling the sacrificial ceramic member, and laser drilling the ceramic substrate through the sacrificial member.
Claim 7
Independent Claim
39 words
A method of laser drilling a ceramic substrate comprising the steps of: placing a thin sacrificial ceramic member adjacent to a ceramic substrate, laser drilling the sacrificial ceramic member, and laser drilling the ceramic substrate through the sacrificial member.
Claim 8
Dependent Claim
27 words
A method as defined in claim 4 including the step of fastening the sacrificial member and the ceramic substrate together prior to the steps of laser drilling.
References Cited (Backward Citations)
US3956052A
Cited
JPS5714484A
Cited
JPS5933091A
Cited
JPS6174791A
Cited
JPS61229492A
Cited
JPS6293091A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-08-13 | 1994-02-12 | 1994-08-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-08-13 | 1998-02-12 | 1998-08-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-08-13 | 2002-02-12 | 2002-08-14 | $7700.00 | Window Closed / Lapsed |