US5316803A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for forming electrical interconnections in laminated vias
Assignee: International Business Machines Corp
•
Filing: 1992-12-10
•
Granted: 1994-05-31
•
Expires: 2012-12-10
Abstract
Abstract A method for forming electrical interconnections in vias is provided by laser drilling vias in a composite that contains at least two circuitized organic polymeric substrates superimposed upon each other. The laser drilling causes metallic circuit lines contained within each substrate to melt and form a fused mass protruding a short distance out of the side of the drilled vias. Next, the drilled vias are plated with a conductive metal to thereby provide the interconnections.
Inventors
- 👤 Russell T. White, Jr.
- 👤 Robert E. Ruane
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 08:56
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/429; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0032; H05K3/0038; H05K2203/00; H05K2203/11; H05K2203/1105; H05K2203/1184; H05K2203/12; H05K2203/128; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49204; Y10T29/49224
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
105 words
A method for forming electrical interconnections in vias connecting at least two circuitized organic polymeric substrates which comprises: (a) providing a composite containing at least two circuitized organic polymeric substrates superimposed upon each other; wherein said organic polymeric substrates contain dielectric material selected from the group consisting of thermoplastic resins and thermosetting resins; (b) laser drilling vias into said substrates to thereby cause metallic circuit lines contained within each substrate to melt and form a fused mass protruding a short distance out of the side of the drilled vias; and (c) then plating said drilled vias with a conductive metal to thereby provide said interconnections.
Claim 2
Independent Claim
105 words
A method for forming electrical interconnections in vias connecting at least two circuitized organic polymeric substrates which comprises: (a) providing a composite containing at least two circuitized organic polymeric substrates superimposed upon each other; wherein said organic polymeric substrates contain dielectric material selected from the group consisting of thermoplastic resins and thermosetting resins; (b) laser drilling vias into said substrates to thereby cause metallic circuit lines contained within each substrate to melt and form a fused mass protruding a short distance out of the side of the drilled vias; and (c) then plating said drilled vias with a conductive metal to thereby provide said interconnections.
Claim 3
Dependent Claim
21 words
The method of claim 1 wherein said composite includes at least one power core sandwiched between at least two signal planes.
Claim 4
Dependent Claim
16 words
The method of claim 1 wherein the dielectric material of the composite is a fluorocarbon polymer.
Claim 5
Dependent Claim
15 words
The method of claim 1 wherein the dielectric material of the composite is a polytetrafluoroethylene.
Claim 6
Dependent Claim
14 words
The method of claim 1 wherein the laser drilling employs a carbon dioxide laser.
Claim 7
Dependent Claim
15 words
The method of claim 1 which includes laser drilling from both sides of the composite.
Claim 8
Dependent Claim
24 words
The method of claim 1 wherein the fused mass protrudes about 0.0005 to about 0.002 inches out of the sides of the drilled vias.
Claim 9
Dependent Claim
22 words
The method of claim 1 wherein said circuit lines neck down at locations where the laser is to impinge during the drilling.
Claim 10
Dependent Claim
11 words
The method of claim 1 wherein said plating is electroless plating.
Claim 11
Dependent Claim
12 words
The method of claim 1 wherein said laser is an excimer laser.
Claim 12
Dependent Claim
13 words
The method claimed in claim 1 wherein said laser is a YAG laser.
Claim 13
Dependent Claim
18 words
The method of claim 1 wherein the dielectric material has a dielectric constant of about 3.2 or less.
Claim 14
Dependent Claim
14 words
The method of claim 1 wherein said dielectric material is a thermosetting polymeric material.
Claim 15
Dependent Claim
24 words
The method of claim 13 wherein said thermosetting polymeric material is selected from the group consisting of epoxy, phenolic based materials, polyimides and polyamides.
Claim 16
Dependent Claim
14 words
The method of claim 1 wherein said dielectric material is a thermoplastic polymeric material.
Claim 17
Dependent Claim
27 words
The method of claim 15 wherein said thermoplastic polymeric material is selected from the group consisting of polyolefins, polysulfones, polycarbonates, nitrile rubbers, ABS polymers and fluorocarbon polymers.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-30 | 1997-11-29 | 1998-05-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-30 | 2001-11-29 | 2002-05-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-30 | 2005-11-29 | 2006-05-31 | $7700.00 | Window Closed / Lapsed |