US4854038A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Modularized fabrication of high performance printed circuit boards
Assignee: International Business Machines Corp
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Filing: 1988-03-16
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Granted: 1989-08-08
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Expires: 2008-03-16
Abstract
Abstract The invention features a method of fabricating a printed circuit board using a modular technique. Sub-assemblies are first constructed, tested, and then subsequently incorporated into the final circuit board assembly which has a triplate geometry. Lamination of the modular sub-assemblies minimizes dielectric core thickness.
Inventors
- 👤 John P. Wiley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 01:07
CPC Classifications
H; H01; H01P; H01P3/00; H01P3/02; H01P3/08; H01P3/088; H05; H05K; H05K3/00; H05K3/44; H05K3/445; H05K3/46; H05K3/4611; H05K3/4623; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09327; H05K2201/095; H05K2201/09536; H05K2203/00; H05K2203/06; H05K2203/061; H05K3/40; H05K3/42; H05K3/425; H05K3/427; H05K3/4641; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
94 words
A high performance printed circuit board assembly, comprising at least two modularized circuitized power plane sub-assemblies adjacently laminated to each other and characterized by X and Y signal planes disposed about an internal power plane, each of said sub-assemblies having a dielectric between said signal and power planes to bond said signal and power planes, and vias disposed within each sub-assembly for providing electrical communication between said signal planes, and whereby a dielectric layer is located between the signal plane in one of the sub-assemblies and an adjacent signal plane in an adjacent sub-assembly.
Claim 2
Dependent Claim
94 words
A high performance printed circuit board assembly, comprising at least two modularized circuitized power plane sub-assemblies adjacently laminated to each other and characterized by X and Y signal planes disposed about an internal power plane, each of said sub-assemblies having a dielectric between said signal and power planes to bond said signal and power planes, and vias disposed within each sub-assembly for providing electrical communication between said signal planes, and whereby a dielectric layer is located between the signal plane in one of the sub-assemblies and an adjacent signal plane in an adjacent sub-assembly.
Claim 3
Dependent Claim
21 words
The high performance printed circuit board assembly of claim 1, wherein said dielectric layer between signal planes comprises a bonding film.
Claim 4
Dependent Claim
21 words
The high performance printed circuit board assembly of claim 1, wherein said dielectric layer between signal planes comprises an epoxy resin.
Claim 5
Dependent Claim
21 words
The high performance printed circuit board assembly of claim 2 wherein said bonding film is a low dielectric constant bonding material.
Claim 6
Independent Claim
111 words
A method of constructing a high performance printed circuit board assembly utilizing a modular construction technique, comprising the steps of: (a) fabricating a first circuitized power core sub-assembly having X-Y signal planes disposed about an internal plane and separated therefrom by means of a dielectric layer; and wherein said X-Y signal planes are electrically connected by plated vias; (b) repeating step (a) to form a number of sub-assemblies; (c) laminating at least two sub-assemblies together to form a composite whereby a signal plane of one sub-assembly is adjacent to a signal plane of another sub-assembly; and (d) constructing a printed circuit board assembly by building a multi-laminate structure using said composite.
Claim 7
Independent Claim
111 words
A method of constructing a high performance printed circuit board assembly utilizing a modular construction technique, comprising the steps of: (a) fabricating a first circuitized power core sub-assembly having X-Y signal planes disposed about an internal plane and separated therefrom by means of a dielectric layer; and wherein said X-Y signal planes are electrically connected by plated vias; (b) repeating step (a) to form a number of sub-assemblies; (c) laminating at least two sub-assemblies together to form a composite whereby a signal plane of one sub-assembly is adjacent to a signal plane of another sub-assembly; and (d) constructing a printed circuit board assembly by building a multi-laminate structure using said composite.
Claim 8
Dependent Claim
35 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 5, further comprising the step of: (e) testing each respective sub-assembly for electrical integrity prior to the laminating step (c).
Claim 9
Dependent Claim
129 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 5, wherein the fabrication of each sub-assembly of step (a) further comprises the steps of: (i) perforating a first conductive sheet having two outer surface with a power plane configuration; (ii) laminating by layer of dielectric a second conductive sheet on each of said outer surfaces of said first perforated conductive sheet to form a core with said dielectric separating said second conductive sheet from an outer surface of said first perforated conductive sheet; (iii) circulating said outer conductive sheets of the core to form a first sub-assembly; (iv) fabricating a second sub-assembly by repeating steps (i), (ii) and (iii); and (v) laminating said first and second sub-assemblies together to form a triplate construction.
Claim 10
Dependent Claim
32 words
The method of constructing a high performance printed circuit board assembly, in accordance with claim 7, further comprising the step of: (vi) fabricating plated vias in each of said sub-assemblies where necessary.
Claim 11
Dependent Claim
30 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 8, further comprising the step of: (vii) testing each of said sub-assemblies for electrical integrity.
Claim 12
Dependent Claim
36 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 7, wherein the laminating of the first and second sub-assemblies together in step (v) includes the use of a bonding film.
Claim 13
Dependent Claim
36 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 7, wherein the laminating of the first and second sub-assemblies together in step (v) includes the use of an epoxy resin.
Claim 14
Dependent Claim
32 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 5, wherein the laminating step (c) comprises the use of a bonding film for laminating said sub-assemblies.
Claim 15
Dependent Claim
32 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 5, wherein the laminating step (c) comprises the use of an epoxy resin for laminating said sub-assemblies.
Claim 16
Dependent Claim
15 words
The method of claim 10 wherein said bonding film is a low dielectric-strength bonding material.
Claim 17
Dependent Claim
15 words
The method of claim 12 wherein said bonding film is a low dielectric-strength bonding material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-07 | 1993-02-06 | 1993-08-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-07 | 1997-02-06 | 1997-08-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-07 | 2001-02-06 | 2001-08-08 | $7700.00 | Window Closed / Lapsed |