US5055342A
Expired / Lapsed
US
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Fluorinated polymeric composition, fabrication thereof and use thereof
Assignee: International Business Machines Corp
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Filing: 1990-02-16
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Granted: 1991-10-08
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Expires: 2010-02-16
Abstract
Abstract Fluorinated polymeric composition exhibiting low dielectric constant and a low coefficient of thermal expansion containing a fluorinated polymeric material and a silica and/or quartz filler having a mean particle size of no greater than 7 microns, and use thereof to form a substrate having vias therein. Layers of the above composition are obtained by applying the composition to a substrate and then heating the composition to a temperature sufficient to cause the composition to fuse.
Inventors
- 👤 Voya Markovich
- 👤 Ashit Mehta
- 👤 Jae M. Park
- 👤 Eugene Skarvinko
- 👤 David W. Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 17:10
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; C; C08; C08K; C08K3/00; C08K3/34; C08K3/36; C08K7/00; C08K7/22; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/44; H01B3/443; H01B3/445; H05K1/032; H05K1/034; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0242; H05K2201/0254; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0032; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10S525/00; Y10S525/935; Y10S525/936; Y10T; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24802; Y10T428/24917; Y10T428/25; Y10T428/31504; Y10T428/3154; Y10T428/31544
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
119 words
A circuitized substrate free from fibrous fillers and containing I. a substrate exhibiting a low dielectric constant and a low coefficient of thermal expansion, which contains: A. fluorinated polymeric material; and B. a filler having a mean particle size of no greater than about 7 μm and being selected from the group of silica, quartz, hollow microspheres and mixtures thereof; and wherein the amount of A is about 50 to 90 weight percent, and the amount of B is about 50 to about 10 weight percent; based upon the total of A and B in the substrate; and II. metallic layer being disposed on at least a portion of at least one of the major surfaces of said substrate.
Claim 2
Dependent Claim
119 words
A circuitized substrate free from fibrous fillers and containing I. a substrate exhibiting a low dielectric constant and a low coefficient of thermal expansion, which contains: A. fluorinated polymeric material; and B. a filler having a mean particle size of no greater than about 7 μm and being selected from the group of silica, quartz, hollow microspheres and mixtures thereof; and wherein the amount of A is about 50 to 90 weight percent, and the amount of B is about 50 to about 10 weight percent; based upon the total of A and B in the substrate; and II. metallic layer being disposed on at least a portion of at least one of the major surfaces of said substrate.
Claim 3
Dependent Claim
12 words
The substrate of claim 1 being at least about 0.5 mils thick.
Claim 4
Dependent Claim
8 words
The substrate of claim 1 having vias therein.
Claim 5
Dependent Claim
10 words
The substrate of claim 1 having laser drilled vias therein.
Claim 6
Dependent Claim
40 words
The substrate of claim 1 wherein the fluorinated polymeric material is selected from the group of polymers of tetrafluoroethylene, copolymers of tetrafluoroethylene and perfluoro-2,2-dimethyl-1,3-dioxide, copolymer of tetrafluoroethylene and hexafluoropropylene, copolymer of tetrafluoroethylene and perfluoroalkoxy, fluorinated ethylene-propylene copolymers and mixtures thereof.
Claim 7
Dependent Claim
14 words
The substrate of claim 1 having a dielectric constant of less than about 3.2.
Claim 8
Dependent Claim
94 words
A composition free from fibrous fillers and possessing a low dielectric constant and a low coefficient of thermal expansion which comprises: A. fluorinated polymeric material; and B. a filler having a mean particle size of no greater than about 7 μm and being selected from the group of silica, quartz particles, hollow microspheres and mixtures thereof; and wherein the amount of A is about 50 to about 90 weight %, and the amount of B is about 50 to about 10 weight %, based upon the total of A and B in the composition.
Claim 9
Dependent Claim
94 words
A composition free from fibrous fillers and possessing a low dielectric constant and a low coefficient of thermal expansion which comprises: A. fluorinated polymeric material; and B. a filler having a mean particle size of no greater than about 7 μm and being selected from the group of silica, quartz particles, hollow microspheres and mixtures thereof; and wherein the amount of A is about 50 to about 90 weight %, and the amount of B is about 50 to about 10 weight %, based upon the total of A and B in the composition.
Claim 10
Dependent Claim
18 words
The composition of claim 7 being in the form of a layer of at least about 0.5 mils.
Claim 11
Dependent Claim
13 words
The composition claim 7 having a dielectric constant of less than about 3.2.
Claim 12
Dependent Claim
13 words
The composition of claim 2 wherein said layer has laser drilled vias therein.
Claim 13
Dependent Claim
40 words
The composition of claim 7 wherein said fluorinated polymeric material is selected from the group of polymers of tetrafluoroethylene, copolymers of tetrafluoroethylene and perfluoro-2,2-dimethyl-1,3-dioxide, copolymer of tetrafluoroethylene and hexafluoropropylene, copolymer of tetrafluoroethylene and perfluoroalkoxy, fluorinated ethylene-propylene copolymers and mixtures thereof.
Claim 14
Dependent Claim
10 words
The composition of claim 1 being fee from flocculating agents.
Claim 15
Dependent Claim
12 words
The composition of claim 1 wherein said fluorinated polymer material is polytetrafluoroethylene.
Claim 16
Dependent Claim
20 words
The composition of claim 1 wherein the particle size distribution of the filler is about 0.1 to about 40 microns.
Claim 17
Dependent Claim
20 words
The composition of claim 1 wherein the particle size distribution of the filler is about 2 to about 5 microns.
Claim 18
Dependent Claim
26 words
The composition of claim 1 wherein said filler is coated with a silane in amount of about 0.2 to about 2% by weight of the filler.
Claim 19
Dependent Claim
28 words
The composition of claim 1 wherein the amount of filler is about 50 to about 30% by weight based upon the total of the filler and polymeric material.
Claim 20
Dependent Claim
27 words
The composition of claim 1 which further includes a surfactant or antisettling agent in an amount of about 0.1 to about 10% by weight of the composition.
Claim 21
Dependent Claim
132 words
A process for fabricating a layer free from fibrous fillers and containing fluorinated polymeric material wherein said layer possesses low dielectric constant and low coefficient of thermal expansion; which comprises: A. obtaining a composition containing a (1) fluorinated polymeric material; and (2) a filler having a mean particle size of no greater than about 7 μm and being selected from the group of silica, quartz particles, hollow microspheres and mixtures thereof; and wherein the amount of (1) is about 50 to about 90 weight percent; and the amount of (2) is about 50 to about 10 weight %, based upon the total of (1) and (2) in the composition; B. applying said composition to a substrate; and then C. heating the composition to a temperature of about 350° to about 400° C.
Claim 22
Dependent Claim
132 words
A process for fabricating a layer free from fibrous fillers and containing fluorinated polymeric material wherein said layer possesses low dielectric constant and low coefficient of thermal expansion; which comprises: A. obtaining a composition containing a (1) fluorinated polymeric material; and (2) a filler having a mean particle size of no greater than about 7 μm and being selected from the group of silica, quartz particles, hollow microspheres and mixtures thereof; and wherein the amount of (1) is about 50 to about 90 weight percent; and the amount of (2) is about 50 to about 10 weight %, based upon the total of (1) and (2) in the composition; B. applying said composition to a substrate; and then C. heating the composition to a temperature of about 350° to about 400° C.
Claim 23
Dependent Claim
17 words
The process of claim 19 wherein said heating is carried out under pressure of about 1000-2000 psi.
Claim 24
Dependent Claim
17 words
The process of claim 19 which further includes forming vias in the layer by drilling or punching.
Claim 25
Dependent Claim
16 words
The process of claim 19 which further includes forming vias in the layer by laser drilling.
Claim 26
Dependent Claim
15 words
The process of claim 19 wherein said layer is at least about 0.5 mils thick.
Claim 27
Dependent Claim
42 words
The process of claim 19 which further includes prior to heating to fuse said composition, heating to remove water followed by heating to about 260° to about 320° C. for about 1 to 2 hours to remove surfactant present in the composition.
Claim 28
Dependent Claim
40 words
The process of claim 19 wherein the fluorinated polymeric material is selected from the group of polymers of tetrafluoroethylene, copolymers of tetrafluoroethylene and perfluoro-2,2-dimethyl-1,3-dioxide, copolymer of tetrafluoroethylene and hexafluoropropylene, copolymer of tetrafluoroethylene and perfluoroalkoxy, fluorinated ethylene-propylene copolymers and mixtures thereof.
Claim 29
Dependent Claim
17 words
The process of claim 19 wherein the dielectric constant of the layer is less than about 3.2.
Claim 30
Dependent Claim
20 words
The process of claim 6 wherein the pH of the composition during said process is about 8 to about 11.
Claim 31
Dependent Claim
14 words
The process of claim 27 wherein said pH is about 9 to about 9.5.
References Cited (Backward Citations)
US3787281A
Cited
US4134848A
Cited
US4241132A
Cited
US4268337A
Cited
US4335180A
Cited
US4405543A
Cited
US4238641A
Cited
US4447565A
Cited
US4431698A
Cited
US4640866A
Cited
GB2162124A
Cited
US4680220A
Cited
US4610495A
Cited
US4634631A
Cited
US4661301A
Cited
US4788230A
Cited
US4818619A
Cited
GB2195269A
Cited
EP0279769A2
Cited
US4849284A
Cited
US4886699A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-10-07 | 1995-04-08 | 1995-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-10-07 | 1999-04-08 | 1999-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-10-07 | 2003-04-08 | 2003-10-08 | $7700.00 | Window Closed / Lapsed |