EP0279769A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material
Assignee: Rogers Corp
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Filing: 1988-02-17
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Granted: —
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Expires: 2008-02-17
Abstract
Abstract The electrical substrate material preferably comprises polytetrafluoroethylene filled with silica along with a small amount of microfiberglass. In an important feature of this invention, the ceramic filler (silica) is coated with a silane coating material.
Inventors
- 👤 David J. Arthur
- 👤 John C. Mosko
- 👤 Connie S. Jackson
- 👤 Robert G. Traut
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 18:05
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; C; C08; C08K; C08K9/00; C08K9/04; C08K9/06; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/44; H01B3/443; H01B3/445; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H05K1/032; H05K1/034; H05K1/0366; H05K1/05; H05K1/056; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/015; H05K2201/0183; H05K2201/0195; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0239; H05K2201/0242; H05K2201/0251; H05K2201/06; H05K2201/068; H05K3/00; H05K3/38; H05K3/389; H05K3/46; H05K3/4611; H05K3/4626; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/25; Y10T428/252; Y10T428/259; Y10T428/29; Y10T428/2982; Y10T428/2991; Y10T428/2993; Y10T428/2995; Y10T428/31504; Y10T428/3154; Y10T428/31544; Y10T428/31678; Y10T428/31692
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
52 words
An electrical substrate material comprising fluoropolymeric material; ceramic filler material having a low dielectric constant, low loss and low coefficiant of thermal expansion, said filler material being in an amount of at least about 55 weight percent of the total substrate material, and said ceramic filler being coated with a silane coating.
Claim 2
Dependent Claim
52 words
An electrical substrate material comprising fluoropolymeric material; ceramic filler material having a low dielectric constant, low loss and low coefficiant of thermal expansion, said filler material being in an amount of at least about 55 weight percent of the total substrate material, and said ceramic filler being coated with a silane coating.
Claim 3
Dependent Claim
11 words
A material as claimed in claim 1, including fiber reinforcement material.
Claim 4
Dependent Claim
24 words
A material as claimed in claim 2, wherein said fiber reinforcement material has a weight percent of equal to or less than 2 %.
Claim 5
Dependent Claim
17 words
A material as claimed in claim 2 or 3 wherein said fiber reinforcement material is glass fiber.
Claim 6
Dependent Claim
14 words
A material as claimed in claim 4, wherein said glass fiber is microglass fiber.
Claim 7
Dependent Claim
26 words
A material as claimed in claim 1, wherein said fluoropolymeric material is selected from the group comprising polytetrafluoroethylene, hexa fluoropropene, tetrafluoroethylene or perfluoro alkyl vinyl ether.
Claim 8
Dependent Claim
13 words
A material as claimed in claim 1, wherein said ceramic filler comprises silica.
Claim 9
Dependent Claim
15 words
A material as claimed in claim 7, wherein said silica comprises amorphous fused silica powder.
Claim 10
Dependent Claim
39 words
A material as claimed in claim 1, wherein said silane coating is selected from the group comprising p-chloromethyl phenyl trimethoxy silane, amino ethyl amino trimethoxy silane, a mixture of phenyl trimethoxy silane and amino ethyl amino propyl trimethoxy silane.
Claim 11
Dependent Claim
29 words
A material as claimed in claim 1, wherein said silane coating is in an amount of at least 1 weight percent relative to the weight of the ceramic filler.
Claim 12
Dependent Claim
26 words
A material as claimed in claim 1, wherein said ceramic filler comprises particles and wherein the mean particle size varies from about 10 to 15 µm.
Claim 13
Dependent Claim
26 words
A material as claimed in claim 1, including at least one layer of conductive material disposed on at least a portion of said electrical substrate material.
Claim 14
Dependent Claim
43 words
Multilayer circuit including at least a first circuit layer and a second circuit layer, the improvement comprising an adhesive layer sandwiched between the first and second circuit layers, said adhesive layer comprising a material in accordance with anyone of claims 1 to 12.
Claim 15
Dependent Claim
15 words
A multilayer circuit as claimed in claim 13, including at least one plated through hole.
Claim 16
Dependent Claim
19 words
Integrated circuit chip carrier package comprising a material in accordance with any one of the claims 1 to 12.
References Cited (Backward Citations)
No citation records indexed.
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