US4238641A
Expired / Lapsed
US
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Composite epoxy glass-microsphere-dielectrics for electronic coaxial structures
Assignee: Amphenol Corp
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Filing: 1979-09-26
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Granted: 1980-12-09
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Expires: 1999-09-26
Abstract
Abstract A composite epoxy/glass-microsphere-dielectric for hermetic R.F. connectors and coaxial cables is provided. A material which is a composition of moisture resistant epoxy resin, curing agent, glass microspheres, and silane coupling agent provide a low dielectric constant material to be molded into the various geometrics required for hermetic R.F. connectors and coaxial cables.
Inventors
- 👤 Peter J. Planting
- 👤 Patricia A. Fritzen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 18:08
CPC Classifications
H; H01; H01R; H01R24/00; H01R24/38; H01R24/40; H01R2103/00; H01R43/00; H01R43/20; H01R43/24
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
71 words
A structure for conveying electrical signals manufactured by performing the steps comprising: preparing a dielectric material by combining an epoxy resin, an epoxy resin curing agent, a silane coupling agent and a plurality of glass-microspheres; forming an interim structure including a hollow outer electrical conductor containing disposed therein said dielectric material and at least one inner electrical conductor; and curing said dielectric material to produce said structure for conveying electrical signals.
Claim 2
Dependent Claim
71 words
A structure for conveying electrical signals manufactured by performing the steps comprising: preparing a dielectric material by combining an epoxy resin, an epoxy resin curing agent, a silane coupling agent and a plurality of glass-microspheres; forming an interim structure including a hollow outer electrical conductor containing disposed therein said dielectric material and at least one inner electrical conductor; and curing said dielectric material to produce said structure for conveying electrical signals.
Claim 3
Dependent Claim
32 words
A structure as in claim 1 wherein said epoxy resin is 50% Diglycidyl Ether of Bisphenol A 25% Epoxy Novolac 25% Vinyl Cyclohexene Dioxide; and said epoxy curing agent is 2-Ethyl-4-Methyl Imidazole.
Claim 4
Dependent Claim
14 words
A structure as in claim 1 wherein said silane coupling agent is 3-(2-aminoethylamino) propyltrimethoxysilane.
Claim 5
Dependent Claim
19 words
A structure as in claim 1 wherein said glass-microspheres are of treated sodium borosilicate to give low surface alkalinity.
Claim 6
Dependent Claim
21 words
A structure as in claim 4 wherein the size of said glass-microspheres is in the range 10 mμ to 63 mμ.
Claim 7
Dependent Claim
34 words
A structure as in claim 5, wherein the glass-microspheres are present in a weight ratio to the mixture of the epoxy, the curing agent and the silane of from 33 to 40 weight percent.
Claim 8
Dependent Claim
22 words
A structure as in claim 1 wherein said epoxy resin and said curing agent are present in a weight ratio of 96.153/3.85.
Claim 9
Dependent Claim
31 words
A structure as in claim 1 wherein the weight ratio of said silane coupling agent to the mixture of epoxy resin and curing agent is in the range 1.1/100 to 0.9/100.
Claim 10
Dependent Claim
20 words
A structure as in claim 1 wherein the weight ratio of silane to epoxy resin and curing agent is 1.00/99.0.
Claim 11
Dependent Claim
29 words
A structure as in claim 1 wherein the weight ratio of glass-microspheres to the mixture of epoxy resin, curing agent and silane is in the range 33/67 to 40/60.
Claim 12
Dependent Claim
20 words
A structure as in claim 1 wherein the weight ratio of microspheres to epoxy resin and curing agent is 38.0/62.0.
Claim 13
Independent Claim
89 words
A method for manufacturing a coaxial structure comprising: mixing an epoxy resin with a curing agent to produce an epoxy resin base; mixing a silane coupling agent into said epoxy base to produce an epoxy-silane matrix; mixing a plurality of glass-microspheres into said epoxy-silane matrix to produce a dielectric material; inserting said dielectric material into a hollow outer conductor; positioning an inner conductor in said dielectric material, said inner conductor being centrally disposed with respect to said outer conductor; and curing said dielectric material to produce said coaxial structure.
Claim 14
Independent Claim
89 words
A method for manufacturing a coaxial structure comprising: mixing an epoxy resin with a curing agent to produce an epoxy resin base; mixing a silane coupling agent into said epoxy base to produce an epoxy-silane matrix; mixing a plurality of glass-microspheres into said epoxy-silane matrix to produce a dielectric material; inserting said dielectric material into a hollow outer conductor; positioning an inner conductor in said dielectric material, said inner conductor being centrally disposed with respect to said outer conductor; and curing said dielectric material to produce said coaxial structure.
Claim 15
Dependent Claim
21 words
The method of claim 12 wherein the glass-microspheres are mixed into the epoxy base prior to adding the silane coupling agent.
Claim 16
Dependent Claim
28 words
The method of claim 12 wherein the inner conductor is positioned in the hollow outer metal conductor prior to inserting the dielectric material into said hollow outer conductor.
Claim 17
Dependent Claim
25 words
A structure as in claim 1 wherein an interim structure includes a hollow outer electrical conductor containing coaxially disposed therein a single inner electrical conductor.
Claim 18
Dependent Claim
17 words
A structure as in claim 1 wherein said dielectric material has a dielectric constant of about 2.06±2%.
Claim 19
Dependent Claim
29 words
A structure as in claim 1 wherein said dielectric material has a coefficient of thermal expansion over the range of -50° to 25° C. of about 25±5×10 -6 cm/cm/°C.
Claim 20
Dependent Claim
14 words
A structure as in claim 1 wherein said structure is a radio frequency connector.
Claim 21
Dependent Claim
28 words
A structure as in claim 18 wherein said radio frequency connector has an insertion loss over the range of 15-26.5 GHz of from 0.70 to 1.60 dB inch.
Claim 22
Dependent Claim
38 words
A structure as in claim 18 wherein said radio frequency connector has a dielectric length greater than or equal to 0.100 inches and said connector has a leak rate of 10 -7 to 10 -8 cc of He/second.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-12-09 | 1984-06-09 | 1984-12-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-12-09 | 1988-06-09 | 1988-12-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-12-09 | 1992-06-09 | 1992-12-09 | $7700.00 | Window Closed / Lapsed |