Semiconductor chip for mounting on a semiconductor package substrate by a flip-clip process

Claim 1

A semiconductor chip for mounting on a package substrate by a flip-chip process, comprising: a plurality of electrode pads of a first group provided on a major surface of said semiconductor chip for external electrical connection, each of said electrode pads of said first group having a first size and connected electrically to an active part of said semiconductor chip, said electrode pads of said first group being provided in rows and columns on said major surface of said semiconductor chip; and a plurality of electrode pads of a second group each having a second size substantially larger than said first size and provided on said major surface of said semiconductor chip in electrical connection with an active part of said semiconductor chip that is used for a burn-in process; each of said electrode pads of said first group being covered by a solder bump that projects from said major surface of said semiconductor chip a first distance; each of said electrode pads of said second group being formed of a conductor material having a melting point higher than said solder bump and projecting from said major surface of said semiconductor chip a second distance that is substantially smaller than said first distance; each of said electrode pads of said second group being connected electrically to a corresponding electrode pad of said first group; and each of said solder bumps having a center at a level closer than a level of said electrode pads of said second group, to said major surface of said semiconductor chip.