US5564181A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of fabricating a laminated substrate assembly chips-first multichip module
Assignee: Charles Stark Draper Laboratory Inc
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Filing: 1995-04-18
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Granted: 1996-10-15
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Expires: 2015-04-18
Abstract
Abstract A laminated substrate assembly chip first multichip module and a method of making it includes a plurality of electronic components thinned to a predetermined thickness and mounting them on a fiat substrate in a precise position and orientation; a mechanical spacer layer including a cured film and an adhesive bonded to the flat surface of the substrate surrounding the components; the mechanical spacer layer having a thickness approximately equal to the predetermined thickness of the components and a pattern of holes in it corresponding with the precise position and orientation of the components mounted on the substrate; and a cover layer bonded over the mechanical layer and the tops of the components.
Inventors
- 👤 Andrew Dineen
- 👤 George V. Ives
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 23:11
CPC Classifications
H; H10; H10W; H10W90/00; H10W70/00; H10W70/60; H10W70/611; H10W70/614; H10W70/099; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/851; H10W72/874; H10W90/10; H10W90/701; H10W90/731; H10W90/734; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49133; Y10T29/49137; Y10T29/49146; Y10T29/49155; Y10T29/49156
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
110 words
A method of fabricating a laminated chips-first multichip module (MCM) comprising: mounting a plurality of electronic components all having a predetermined thickness to a flat substrate in a precise position and orientation; bonding on said substrate and about said components a mechanical spacer layer including a cured film and an adhesive having approximately said predetermined thickness and having a pattern of holes with the precise position and orientation of said components mounted on said substrate such that a substantially planar surface is defined by the tops of the components and the mechanical spacer layer; and bonding a cover layer over said mechanical spacer layer and the tops of said components.
Claim 2
Independent Claim
110 words
A method of fabricating a laminated chips-first multichip module (MCM) comprising: mounting a plurality of electronic components all having a predetermined thickness to a flat substrate in a precise position and orientation; bonding on said substrate and about said components a mechanical spacer layer including a cured film and an adhesive having approximately said predetermined thickness and having a pattern of holes with the precise position and orientation of said components mounted on said substrate such that a substantially planar surface is defined by the tops of the components and the mechanical spacer layer; and bonding a cover layer over said mechanical spacer layer and the tops of said components.
Claim 3
Dependent Claim
14 words
The method of claim 1 in which said components all have the same thickness.
Claim 4
Dependent Claim
14 words
The method of claim 1 in which said predetermined thickness is approximately 6 mils.
Claim 5
Dependent Claim
14 words
The method of claim 1 in which said mechanical spacer layer are polymeric materials.
Claim 6
Dependent Claim
20 words
The method of claim 1 in which the cured film and adhesive of said mechanical spacer layer are polymeric materials.
Claim 7
Dependent Claim
20 words
The method of claim 1 in which said mechanical spacer layer is equal to or greater than said predetermined thickness.
Claim 8
Dependent Claim
17 words
The method of claim 1 in which said holes are approximately the same size as said components.
Claim 9
Independent Claim
98 words
A method of fabricating a chips-first multichip module (MCM) comprising: trimming a plurality of electronic components to a predetermined thickness; mounting the bottoms of said components to a substrate; bonding on said substrate and about said components the bottom of a mechanical spacer layer having approximately said predetermined thickness and having a pattern of holes with the precise location and orientation of said components mounted on said substrate, the top of said spacer layer approximately flush with the tops of said components; and bonding a cover layer over said mechanical spacer layer and the tops of said components.
Claim 10
Independent Claim
98 words
A method of fabricating a chips-first multichip module (MCM) comprising: trimming a plurality of electronic components to a predetermined thickness; mounting the bottoms of said components to a substrate; bonding on said substrate and about said components the bottom of a mechanical spacer layer having approximately said predetermined thickness and having a pattern of holes with the precise location and orientation of said components mounted on said substrate, the top of said spacer layer approximately flush with the tops of said components; and bonding a cover layer over said mechanical spacer layer and the tops of said components.
References Cited (Backward Citations)
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Cited
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US4668314A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-10-15 | 2000-04-15 | 2000-10-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-10-15 | 2004-04-15 | 2004-10-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-10-15 | 2008-04-15 | 2008-10-15 | $7700.00 | Window Closed / Lapsed |