US5294038A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of and apparatus for manufacturing semiconductor device
Assignee: NEC Electronics Corp
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Filing: 1992-11-10
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Granted: 1994-03-15
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Expires: 2012-11-10
Abstract
Abstract This invention relates to an apparatus for manufacturing a semiconductor device, which has an auxiliary bonding stage in the vicinity of a wafer stage so that when a wire is disconnected during a bonding operation of a ball bump by wire bonding, the wire can be easily restored to the normal state without using an IC chip on a wafer, and a method of manufacturing a semiconductor device, which comprises the steps of moving a capillary above the auxiliary bonding stage after wire disconnection occurs, pulling out the wire from the capillary above the auxiliary bonding stage, forming a ball at a distal cut end of the wire which is pulled out, and performing ball bump bonding on an electrode of an IC chip placed on the wafer stage with the wire formed with the ball at its distal cut end.
Inventors
- 👤 Tosei Nakano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 23:19
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/002; B23K20/004; B23K20/005; B23K20/007; B23K2101/00; B23K2101/36; B23K2101/40; H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/075; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
178 words
A method of manufacturing a semiconductor device for forming a ball bump on an electrode on a semiconductor chip by using a ball bump bonding technique, comprising the steps of: when a ball is to be formed on a distal end of a wire in order to form a ball bump, moving a bonding arm away from a wafer stage and above an auxiliary bonding stage near the wafer stage; urging the wire against an upper surface of said auxiliary bonding stage by lowering a capillary in order to contact the wire onto said upper surface of said auxiliary bonding stage; sequentially, removing said capillary from said auxiliary bonding stage and thereafter cutting the wire based on a position of said wire when urged against said auxiliary bonding stage; forming a ball on a distal cut end of the wire by electric discharge; and returning said bonding arm to a position relative to said wafer stage and performing a ball bump bonding on an electrode of a semiconductor chip formed on a wafer placed on a wafer stage.
Claim 2
Independent Claim
178 words
A method of manufacturing a semiconductor device for forming a ball bump on an electrode on a semiconductor chip by using a ball bump bonding technique, comprising the steps of: when a ball is to be formed on a distal end of a wire in order to form a ball bump, moving a bonding arm away from a wafer stage and above an auxiliary bonding stage near the wafer stage; urging the wire against an upper surface of said auxiliary bonding stage by lowering a capillary in order to contact the wire onto said upper surface of said auxiliary bonding stage; sequentially, removing said capillary from said auxiliary bonding stage and thereafter cutting the wire based on a position of said wire when urged against said auxiliary bonding stage; forming a ball on a distal cut end of the wire by electric discharge; and returning said bonding arm to a position relative to said wafer stage and performing a ball bump bonding on an electrode of a semiconductor chip formed on a wafer placed on a wafer stage.
Claim 3
Independent Claim
108 words
An apparatus for forming a semiconductor device in which a ball bump is formed on an electrode on a semiconductor chip by using a ball bump bonding technique, said apparatus comprising a wafer stage on which an electrode is bonded, an auxiliary bonding stage in the vicinity of said wafer stage for receiving a wafer thereon, so that when a wire is disconnected during a bonding operation of a ball bump by wire bonding and the disconnected wire is retracted in a capillary, the wire can be easily pulled out again from said capillary and a ball can be easily formed at a distal end of the wire.
Claim 4
Independent Claim
108 words
An apparatus for forming a semiconductor device in which a ball bump is formed on an electrode on a semiconductor chip by using a ball bump bonding technique, said apparatus comprising a wafer stage on which an electrode is bonded, an auxiliary bonding stage in the vicinity of said wafer stage for receiving a wafer thereon, so that when a wire is disconnected during a bonding operation of a ball bump by wire bonding and the disconnected wire is retracted in a capillary, the wire can be easily pulled out again from said capillary and a ball can be easily formed at a distal end of the wire.
Claim 5
Dependent Claim
30 words
An apparatus according to claim 2, wherein said auxiliary bonding stage has a metal layer on an upper surface thereof to be able to be connected to a bonding wire.
Claim 6
Dependent Claim
16 words
An apparatus according to claim 3, wherein said metal layer is made of Al or Au.
References Cited (Backward Citations)
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US4434347A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-03-14 | 1997-09-13 | 1998-03-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-03-14 | 2001-09-13 | 2002-03-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-03-14 | 2005-09-13 | 2006-03-15 | $7700.00 | Window Closed / Lapsed |