Method of making constant bonding wire tail lengths

Claim 1

The method of forming an exact predetermined shape and length of fine wire under the face of a bonding wedge after making a second wire bond with an automatic wedge bonding machine of the type having a bonding wedge and a non-articulating wire clamp comprising the steps of: making a second wire bond at a second bonding point on a semiconductor device to connect the second of two bonding points with a length of fine wire, providing an open wire clamp adjacent the rear of said bonding wedge, raising said bonding wedge relative to said second bonding point substantially vertically a small predetermined distance to pay out wire below said bonding wedge without permanently deforming the wire, moving said bonding wedge laterally relative to said second bonding point to pay out an exact predetermined straight axial length of fine wire under the center of the working face of said bonding wedge without permanently deforming the wire, ceasing movement of said bonding wedge relative to said second bonding point long enough to stop movement of said bonding wedge and damp out harmful vibrations, closing said wire clamp on said fine wire to fix the length of fine wire extended under the face of said bonding wedge, moving said bonding wedge relative to said second bonding point in a predetermined inclined angle direction aligned with the axial direction of said fine wire which maintains said fixed length of straight fine wire under the face of said bonding wedge while simultaneously moving said bonding wedge substantially vertically relative to said second bonding point, thereby breaking said straight fine wire at a point adjacent said second wire bond, and leaving a predetermined length of said straight fine wire inclined under the working face of said bonding wedge which is formed at a predetermined angle between the working face of said bonding wedge.

Claim 2

The method of forming an exact predetermined shape and length of fine wire under the face of a bonding wedge after making a second wire bond with an automatic wedge bonding machine of the type having a bonding wedge and a non-articulating wire clamp comprising the steps of: making a second wire bond at a second bonding point on a semiconductor device to connect the second of two bonding points with a length of fine wire, providing an open wire clamp adjacent the rear of said bonding wedge, raising said bonding wedge relative to said second bonding point substantially vertically a small predetermined distance to pay out wire below said bonding wedge without permanently deforming the wire, moving said bonding wedge laterally relative to said second bonding point to pay out an exact predetermined straight axial length of fine wire under the center of the working face of said bonding wedge without permanently deforming the wire, ceasing movement of said bonding wedge relative to said second bonding point long enough to stop movement of said bonding wedge and damp out harmful vibrations, closing said wire clamp on said fine wire to fix the length of fine wire extended under the face of said bonding wedge, moving said bonding wedge relative to said second bonding point in a predetermined inclined angle direction aligned with the axial direction of said fine wire which maintains said fixed length of straight fine wire under the face of said bonding wedge while simultaneously moving said bonding wedge substantially vertically relative to said second bonding point, thereby breaking said straight fine wire at a point adjacent said second wire bond, and leaving a predetermined length of said straight fine wire inclined under the working face of said bonding wedge which is formed at a predetermined angle between the working face of said bonding wedge.