US6159770A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for fabricating semiconductor device
Assignee: Socionext Inc
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Filing: 1998-11-16
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Granted: 2000-12-12
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Expires: 2018-11-16
Abstract
Abstract There is provided a method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections. The semiconductor elements are mounted to a lead frame having recess portions located in positions corresponding to positions of the resin projections, metallic film parts being provided in the recess portions. The semiconductor elements are electrically connected to the metallic film parts. The resin packages that seal the semiconductor elements and gate portions are integrally formed with the resin packages. The lead frame is etched so that the resin packages are separated from the lead frame together with the metallic layer parts. The resin packages are attached to an adhesive tape provided to a frame and being used as a carrier.
Inventors
- 👤 Masafumi Tetaka
- 👤 Shinichiro Maki
- 👤 Nobuo Ohyama
- 👤 Seiichi Orimo
- 👤 Hideharu Sakoda
- 👤 Yoshiyuki Yoneda
- 👤 Akihiro Shigeno
- 👤 Ryoichi Yokoyama
- 👤 Fumitoshi Fujisaki
- 👤 Masao Fukunaga
- 👤 Kazuto Tsuji
- 👤 Terumi Kamifukumoto
- 👤 Kenji Itasaka
- 👤 Masanori Onodera
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 22:29
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/042; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H10D; H10D62/00; H10D62/10; H10D62/117; H10W74/00; H10W74/01; H10W74/014; H10W74/016; H10W74/10; H10W74/111; H10W90/00; H05K1/00; H05K1/18; H05K1/181; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09045; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K2201/10954; H05K2201/10977; H05K3/3436; H10W70/60; H10W72/00; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/0198; H10W72/071; H10W72/0711; H10W72/07141; H10W72/07173; H10W72/072; H10W72/07251; H10W72/073; H10W72/075; H10W72/07502; H10W72/07504; H10W72/07511; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/20; H10W72/251; H10W72/50; H10W72/521; H10W72/522; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5434; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W72/951; H10W72/952; H10W74/131; H10W74/142; H10W90/20; H10W90/288; H10W90/701; H10W90/721; H10W90/726; H10W90/751; H10W90/754; H10W90/756; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
155 words
A method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections, said method comprising the steps of: (a) mounting the semiconductor elements to a lead frame having recess portions located in positions corresponding to positions of the resin projections, metallic film parts being provided in the recess portions; (b) electrically connecting the semiconductor elements to the metallic film parts; (c) forming the resin packages that seal the semiconductor elements and gate portions integrally formed with the resin packages; (d) etching the lead frame so that the resin packages are separated from the lead frame together with the metallic film parts; and (e) removing the gate portions from the resin packages, the resin packages being attached to an adhesive tape provided to a frame and being used as a carrier in the step (d).
Claim 2
Independent Claim
155 words
A method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections, said method comprising the steps of: (a) mounting the semiconductor elements to a lead frame having recess portions located in positions corresponding to positions of the resin projections, metallic film parts being provided in the recess portions; (b) electrically connecting the semiconductor elements to the metallic film parts; (c) forming the resin packages that seal the semiconductor elements and gate portions integrally formed with the resin packages; (d) etching the lead frame so that the resin packages are separated from the lead frame together with the metallic film parts; and (e) removing the gate portions from the resin packages, the resin packages being attached to an adhesive tape provided to a frame and being used as a carrier in the step (d).
Claim 3
Dependent Claim
29 words
The method as claimed in claim 1, wherein only the resin packages are attached to the adhesive tape, and the gate portions are spaced apart from the adhesive tape.
Claim 4
Dependent Claim
33 words
The method as claimed in claim 1, wherein two sides of the adhesive tape are fixed to the frame and two remaining sides of the adhesive tape are spaced apart from the frame.
Claim 5
Dependent Claim
19 words
The method as claimed in claim 1, wherein the frame is titanium, resin or a metal coated with resin.
Claim 6
Dependent Claim
23 words
The method as claimed in claim 1, wherein the adhesive tape comprises a substance which loses adhesive force when the substance is wetted.
Claim 7
Dependent Claim
59 words
The method as claimed in claim 2, wherein the step (d) comprises the steps of: (d-1) positioning the adhesive tape above the resin packages; and (d-2) pressing portions of the adhesive tape corresponding to the resin packages toward the resin packages by means of a pressing mechanism, so that the adhesive tape can adhere to the resin packages only.
Claim 8
Dependent Claim
32 words
The method as claimed in claim 6, wherein the step (d-2) comprises the step of pressing the portions of the adhesive tape by a spot of air generated by the pressing mechanism.
Claim 9
Dependent Claim
54 words
The method as claimed in claim 2, wherein the step (d) comprises the steps of: (d-1) positioning the adhesive tape below the resin packages; and (d-2) pressing surfaces of the resin packages toward the adhesive tape by means of a pressing mechanism, so that the adhesive tape can adhere to the resin packages only.
Claim 10
Independent Claim
150 words
A method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively having resin projections formed on the resin packages and metallic film parts provided to the resin projections, said method comprising the steps of: (a) mounting the semiconductor elements to a lead frame having recess portions located in positions corresponding to positions of the resin projections, metallic film parts being provided in the recess portions; (b) electrically connecting the semiconductor elements with the metallic film parts; (c) forming the resin packages that seal the semiconductor elements and gate portions being integrally formed with the resin packages; (d) etching the lead frame so that the resin packages are separated from the lead frame together with the metallic film parts; and (e) removing the gate portions from the resin packages by cutting interface portions between the gate portions and the resin packages by a cutting apparatus.
Claim 11
Independent Claim
150 words
A method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively having resin projections formed on the resin packages and metallic film parts provided to the resin projections, said method comprising the steps of: (a) mounting the semiconductor elements to a lead frame having recess portions located in positions corresponding to positions of the resin projections, metallic film parts being provided in the recess portions; (b) electrically connecting the semiconductor elements with the metallic film parts; (c) forming the resin packages that seal the semiconductor elements and gate portions being integrally formed with the resin packages; (d) etching the lead frame so that the resin packages are separated from the lead frame together with the metallic film parts; and (e) removing the gate portions from the resin packages by cutting interface portions between the gate portions and the resin packages by a cutting apparatus.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-12-12 | 2004-06-12 | 2004-12-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-12-12 | 2008-06-12 | 2008-12-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-12-12 | 2012-06-12 | 2012-12-12 | $7700.00 | Window Closed / Lapsed |