Resin-packaged semiconductor device with flow prevention dimples

Claim 1

A resin-packaged semiconductor device comprising: a semiconductor element having opposed first and second surfaces; a mounting pad having a first surface on which the second surface of said semiconductor element is mounted; inner leads extending across part of and spaced from the first surface of said semiconductor element and electrically connected to said semiconductor element; conduction means electrically connecting said semiconductor element and said inner leads to each other; a molding material encapsulating said semiconductor element, said mounting pad, said inner leads, and said conduction means; and outer leads continuing from said inner leads and extending outside of said molding material wherein said mounting pad has an edge encapsulated in a frame-shaped portion of said molding material, and wherein a second surface of said mounting pad opposite the first surface has a central portion not part of said edge of said mounting pad and not covered by said molding material, said central portion of said second surface being exposed as an outside surface of said device, said mounting pad having flow prevention dimples on said second surfacer said flow prevention dimples being located at first and second locations of said second surface, said first location being included in said edge of said mounting pad covered by said frame-shaped portion of said molding material and said second location being adjacent to said first location and not covered by said molding material.