US5567984A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for fabricating an electronic circuit package
Assignee: International Business Machines Corp
•
Filing: 1995-06-06
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Granted: 1996-10-22
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Expires: 2015-06-06
Abstract
Abstract An electronic circuit package is fabricated by providing a substrate having attached to at least one of its major surfaces, at least one integrated circuit chip; and providing a carrier that comprises a polymeric composition. The carrier holds a desired array of conductive pins, which protrude from both major surfaces of the carrier. The substrate is placed in contact with the pins to provide a subassembly.
Inventors
- 👤 Jerzy M. Zalesinski
- 👤 Alan J. Emerick
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 04:07
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/479; H05; H05K; H05K3/00; H05K3/30; H05K3/306
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
62 words
A carrier which comprises a main body portion that contains stand-off portions and holds a desired array of electrically conductive pins protruding from major surfaces thereof; and being fabricated from a polymeric composition; and wherein electrically conductive pins of said array each contain a bump located on an intermediate portion of a pin held within said main body portion of said carrier.
Claim 2
Dependent Claim
62 words
A carrier which comprises a main body portion that contains stand-off portions and holds a desired array of electrically conductive pins protruding from major surfaces thereof; and being fabricated from a polymeric composition; and wherein electrically conductive pins of said array each contain a bump located on an intermediate portion of a pin held within said main body portion of said carrier.
Claim 3
Dependent Claim
21 words
The carrier of claim 1 wherein said array of pins has a pin to pin spacing of 0.070 inch or less.
Claim 4
Dependent Claim
17 words
The carrier of claim 1 wherein the height of said stand-offs is at least about 10 mils.
Claim 5
Dependent Claim
20 words
The carrier of claim 1 which further comprises at least 4 stand-offs located within the vicinity of the perimeter thereof.
Claim 6
Dependent Claim
11 words
The carrier of claim 1 wherein said pins contain solder thereon.
Claim 7
Dependent Claim
11 words
The carrier of claim 1 wherein said polymeric composition is thermoplastic.
Claim 8
Dependent Claim
22 words
The carrier of claim 1 wherein said array of electrically conductive pins comprises pins of a diameter of 0.020 inches or less.
Claim 9
Dependent Claim
22 words
The carrier of claim 2 wherein said array of electrically conductive pins comprises pins of a diameter of 0.020 inches or less.
Claim 10
Dependent Claim
58 words
The carrier of claim 1 which further comprises at least 4 stand-offs located within the vicinity of the perimeter thereof; the height of said stand-offs is at least about 10 mils; said array of electrically conductive pins comprises pins of a diameter of 0.020 inches or less, and the pin to pin spacing is 0.070 inches or less.
Claim 11
Dependent Claim
16 words
The carrier of claim 1 wherein the pin to pin spacing is 0.050 inches or less.
Claim 12
Dependent Claim
17 words
The carrier of claim 1 wherein the height of said standoffs is up to about 5 mils.
Claim 13
Dependent Claim
15 words
The carrier of claim 1 wherein the height of said standoffs is about 2-3 mils.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-10-22 | 2000-04-22 | 2000-10-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-10-22 | 2004-04-22 | 2004-10-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-10-22 | 2008-04-22 | 2008-10-22 | $7700.00 | Window Closed / Lapsed |