Manufacture of electronic part mount substrate

Abstract

Abstract PURPOSE:To provide an electronic part mount substrate solderable without causing damages by putting a cap on the electronic part mount substrate and bonding it to a substrate, by fitting and soldering a conductor pin to a through- hole, and by cutting and removing a bottom plate of the cap. CONSTITUTION:A cap 1 is put and bonded to an electronic part mount section 24 of a work 2 having a plurality of substrates to be formed to a discrete piece. The work 2 is provided with a through-hole section 23 which is provided with a plated layer 231 and a land 232, and a copper foil layer 25. The cap 1 is a square shallow box body composed of a bottom plate 12 and a frame body 11 and the frame body 11 is a section to form a dam. The cap 1 is manufactured integrally by a glass epoxy material. The work 2 is a glass epoxy resin. The work 2 is formed to a discrete piece in a state of a substrate 21, and a head section 922 of a conductor pin 92 is inserted to the through-hole 23. Then, the substrate 21 is immersed in a melted solder bath to solder 98, and the bottom plate 12 is cut and removed.

Inventors

• 👤 Kozo Kodama
• 👤 児玉　幸三
• 👤 Takakazu Ishikawa
• 👤 石川　隆和

Bibliographic Details