Polymer stud grid array

Abstract

Abstract The new structure comprises: an injection moulded three-dimensional substrate (S) made from an electrically insulating polymer; two-dimensionally configured polymer bumps (PS) formed during the injection-moulding process on the underside of the substrate (S); external connections (AA) formed on the polymer bumps (PS) by solderable end surfaces; conducting paths (LZ) at least on the underside of the substrate (S) to connect the external connections (AA) to inner connections (IA1); and at least one chip (C1) mounted on the substrate (S) with connections (CA1) which are electro-conductively linked to the inner connections. The novel structure, which is suitable for single-, few- or multi-chip modules, combines the advantages of a Ball Grid Array with those of MID (<u>M</u>oulded <u>I</u>nterconnection <u>D</u>evices) technology, and the manufacture and metallization of the polymer bumps (PS) can be done within the framework of the process steps needed for MID technology and at minimal additional cost.

Inventors

• 👤 Marcel Heerman
• 👤 Joost Wille
• 👤 Jozef Van Puymbroeck
• 👤 Jean Roggen
• 👤 Eric Beyne
• 👤 Rita Van Hoof

Bibliographic Details