US5334804A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wire interconnect structures for connecting an integrated circuit to a substrate
Assignee: Fujitsu Ltd
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Filing: 1992-11-17
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Granted: 1994-08-02
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Expires: 2012-11-17
Abstract
Abstract An interconnect structure for connecting an integrated circuit (IC) chip to a supporting substrate is described. The supporting substrate serves to communicate signals between the IC chip and the "outside world," such as other IC chips. In one embodiment, the interconnect structure comprises an interconnect substrate having a first post disposed on one of its surfaces and a second post disposed on another of its surfaces. One post is for contacting the IC chip and the other is for contacting the major substrate. Each post comprises an elongated body having top and bottom ends, with the bottom end being mounted to one of the substrate surfaces and the top end having a substantially flat surface which is substantially co-planer with the substrate surface. The interconnect substrate further comprises a device for de-concentrating the mechanical stain present at one or both of the top and bottom ends of each post. The first and second posts are electrically coupled to one anther so that an electrical signal may pass from IC chip to the supporting substrate, and vice-versa.
Inventors
- 👤 David G. Love
- 👤 Larry L. Moresco
- 👤 William T. Chou
- 👤 David A. Horine
- 👤 Connie M. Wong
- 👤 Solomon I. Beilin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 03:50
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W72/00; H10W72/01; H10W72/019; H10W72/20; H10W90/00; H10W90/701; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0364; H05K2201/0367; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/20; H05K2201/2081; H05K2203/00; H05K2203/03; H05K2203/0315; H05K2203/07; H05K2203/0703; H05K2203/072; H05K3/22; H05K3/24; H05K3/243; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/3465; H05K3/3473; H10W72/012; H10W72/01251; H10W72/01255; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/221; H10W72/231; H10W72/234; H10W72/251; H10W72/252; H10W72/281; H10W72/283; H10W72/29; H10W72/90; H10W72/951; H10W95/00
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
129 words
A wire interconnect structure for electrically coupling a substrate to an integrated circuit chip, comprising: an electrically conductive post disposed on a surface of said substrate for making contact to the integrated circuit, said post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted on the surface of the substrate and the top end for connecting to the integrated circuit chip by an electrical-conductive, reflowable material, said post comprising a material having a higher melting point than the reflowable material such that when the post is connected to the integrated circuit the shape of said post does not substantially change; a peripheral edge formed around said bottom end next to said surface; and a solder fillet disposed along said peripheral edge.
Claim 2
Dependent Claim
129 words
A wire interconnect structure for electrically coupling a substrate to an integrated circuit chip, comprising: an electrically conductive post disposed on a surface of said substrate for making contact to the integrated circuit, said post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted on the surface of the substrate and the top end for connecting to the integrated circuit chip by an electrical-conductive, reflowable material, said post comprising a material having a higher melting point than the reflowable material such that when the post is connected to the integrated circuit the shape of said post does not substantially change; a peripheral edge formed around said bottom end next to said surface; and a solder fillet disposed along said peripheral edge.
Claim 3
Dependent Claim
29 words
The wire interconnect structure of claim 1 wherein the top end of said post has a substantially flat surface which is substantially co-planer with the surface of the substrate.
Claim 4
Dependent Claim
24 words
The wire interconnect structure of claim 1 wherein said post body is tapered such that the bottom end is smaller than the top end.
Claim 5
Dependent Claim
44 words
The wire interconnect structure of claim 1 wherein said structure further comprises a base pad disposed between the substrate surface and the bottom end of said post, and wherein said solder fillet is disposed next to said base pad and along said peripheral edge.
Claim 6
Dependent Claim
81 words
The wire interconnect structure of claim 1 wherein the body of said post is substantially circular in a cross-section plane co-planer with its top end surface, the cross-section of said body being substantially circular throughout the body's direction of elongation, each of the top and bottom ends of said post being substantially circular, and wherein the ratio of the post's length in the direction of elongation to the diameter of circular cross-section at its bottom end is greater than approximately 3.5.
Claim 7
Dependent Claim
15 words
The wire interconnect structure of claim 5 wherein said ratio is at least substantially 6.0.
Claim 8
Dependent Claim
35 words
The wire interconnect structure of claim 1 wherein said post comprises an inner portion of a first electrically conductive material and an outer coating layer of a second conductive material disposed on said inner portion.
Claim 9
Dependent Claim
22 words
The wire interconnect structure of claim 7 wherein said first conductive material comprises copper and wherein said second conductive material comprises nickel.
Claim 10
Dependent Claim
44 words
The wire interconnect structure of claim 1 further comprising an oxide layer on the body of said post extending in the direction of elongation from the bottom end of said post to a point intermediate between the bottom and top ends of said post.
Claim 11
Dependent Claim
34 words
The wire interconnect structure of claim 1 wherein said structure is physically coupled and electrically coupled to a corresponding pad on an integrated circuit chip by a bump comprising an electrically conductive polymer material.
Claim 12
Dependent Claim
47 words
The wire interconnect structure of claim 10 wherein said electrically conductive polymer material comprises one of a conductive elastomer, a metal-filled thermoplastic, a metal-filled epoxy resin, a silver-filled epoxy resin, a metal-filled polyimide, a metal filled epoxy-polyimide, a conductive silicone material, and a metal-coated compliant plastic sphere.
Claim 13
Dependent Claim
259 words
A wire interconnect structure for electrically coupling a major substrate to an integrated circuit chip, comprising: an interconnect substrate having a first surface and a second surface; a first electrically conductive post disposed on the first surface of said interconnect substrate for making contact to one of the integrated circuit and the major substrate, said first post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted to the first surface of said interconnect substrate, the top end for connecting to one of the chip and major substrate by an electrically-conductive, reflowable material, said time post comprising a material having a higher melting point than the reflowable material such that the shape of said first post does not substantially change when the first post is connected; a second electrically conductive post disposed on the second surface of said interconnect substrate for making contact to the other of the integrated circuit and the major substrate, said second post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted to the second surface of said interconnect substrate, the top end for coupling to the other of the chip and major substrate by an electrically conductive, reflowable material said second post comprising a material having a higher melting point than the reflowable material such that the shape of said second post does not substantially change when the second post is connected; and coupling means on said interconnect substrate for electrically coupling said first post to said second post.
Claim 14
Dependent Claim
259 words
A wire interconnect structure for electrically coupling a major substrate to an integrated circuit chip, comprising: an interconnect substrate having a first surface and a second surface; a first electrically conductive post disposed on the first surface of said interconnect substrate for making contact to one of the integrated circuit and the major substrate, said first post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted to the first surface of said interconnect substrate, the top end for connecting to one of the chip and major substrate by an electrically-conductive, reflowable material, said time post comprising a material having a higher melting point than the reflowable material such that the shape of said first post does not substantially change when the first post is connected; a second electrically conductive post disposed on the second surface of said interconnect substrate for making contact to the other of the integrated circuit and the major substrate, said second post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted to the second surface of said interconnect substrate, the top end for coupling to the other of the chip and major substrate by an electrically conductive, reflowable material said second post comprising a material having a higher melting point than the reflowable material such that the shape of said second post does not substantially change when the second post is connected; and coupling means on said interconnect substrate for electrically coupling said first post to said second post.
Claim 15
Dependent Claim
60 words
The wire interconnect structure of claim 12 wherein the top end of said conductive first post has a substantially flat surface which is substantially co-planer with the first surface of said interconnect substrate, and wherein the top end of said second conductive post has a substantially fiat surface which is substantially co-planer with the second surface of said interconnect substrate.
Claim 16
Dependent Claim
20 words
The wire interconnect structure of claim 12 wherein said first and second posts are disposed substantially opposite to one another.
Claim 17
Dependent Claim
42 words
The wire interconnect structure of claim 12 wherein said interconnect substrate further comprises a through hole between the first and second surfaces of said interconnect substrate and wherein said coupling means comprises a plug of conductive material disposed in said through hole.
Claim 18
Dependent Claim
48 words
The wire interconnect structure of claim 15 wherein said through hole has two opposite ends, each at a respective one of said first and second surfaces, and wherein said first and second posts are disposed substantially opposite to one another at respective opposite ends of said through hole.
Claim 19
Dependent Claim
83 words
The wire interconnect structure of claim 12 wherein the body of each said post is substantially circular in a cross-section plane co-planer with its top end surface, the cross-section of said body being substantially circular throughout the body's direction of elongation, each of the top and bottom ends of each said post being substantially circular, and wherein the ratio of each post's length in the direction of elongation to the diameter of circular cross-section at its bottom end is greater than approximately 3.5.
Claim 20
Dependent Claim
15 words
The wire interconnect structure of claim 17 wherein said ratio is at least substantially 6.0.
Claim 21
Dependent Claim
57 words
The wire interconnect structure of claim 12 wherein the bottom end of said first post is mounted to the first surface of said interconnect layer such that a peripheral edge is formed around said bottom end next to said first surface, and wherein said wire interconnect structure further comprises a solder fillet disposed along said peripheral edge.
Claim 22
Dependent Claim
49 words
The wire interconnect structure of claim 19, wherein said structure further comprises a base pad disposed between the first surface of said interconnect substrate and the bottom end of said first post, and wherein said solder fillet is disposed next to said base pad and along said peripheral edge.
Claim 23
Dependent Claim
47 words
The wire interconnect structure of claim 13 further comprising an oxide layer on the body of said first post extending in the direction of elongation from the bottom end of said first post to a point intermediate between the bottom and top ends of said first post.
Claim 24
Dependent Claim
27 words
The wire interconnect structure of claim 12 wherein the body of said first post is tapered such that the bottom end is smaller than the top end.
Claim 25
Dependent Claim
67 words
The wire interconnect structure of claim 12 further comprising a plurality of said first electrically conductive posts disposed on the first surface of said interconnect substrate, a plurality of said second electrically conductive posts disposed on the second surface of said interconnect substrate, and coupling means on said interconnect substrate for electrically coupling at least two of said first posts to corresponding ones of said second posts.
Claim 26
Dependent Claim
37 words
The wire interconnect structure of claim 12 wherein said first post is physically coupled and electrically coupled to said one of the integrated circuit and the major substrate by a bump comprising an electrically conductive polymer material.
Claim 27
Dependent Claim
47 words
The wire interconnect structure of claim 24 wherein said electrically conductive polymer material comprises one of a conductive elastomer, a metal-filled thermoplastic, a metal-filled epoxy resin, a silver-filled epoxy resin, a metal-filled polyimide, a metal filled epoxy-polyimide, a conductive silicone material, and a metal-coated compliant plastic sphere.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-08-01 | 1998-01-31 | 1998-08-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-08-01 | 2002-01-31 | 2002-08-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-08-01 | 2006-01-31 | 2006-08-02 | $7700.00 | Window Closed / Lapsed |