US20040100772A1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaged microelectronic component assemblies
Assignee: Micron Technology Inc
•
Filing: 2002-12-18
•
Granted: —
•
Expires: 2022-12-18
Abstract
Abstract Various aspects of the invention provide microelectronic component assemblies, memory modules, computer systems, and methods of assembling microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a non-leaded first package, a second package, and a plurality of electrical junctions. The first package has a confronting surface that includes an exposed back surface of a microelectronic component and exposed contact surfaces. The second package has a confronting surface that includes an exposed back surface of a microelectronic component and exposed contact surfaces of a number of leads. Each of the junctions couples one of the contacts to the contact surface of one of the leads. The electrical junctions may also physically support the packages with their respective confronting surfaces juxtaposed with but spaced from one another, defining a peripherally open fluid passage and enhancing thermal performance.
Inventors
- 👤 Lim Chye
- 👤 Setho Fee
- 👤 Eric Swee Seng
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:50
CPC Classifications
H; H10; H10W; H10W90/00; H10W70/00; H10W70/40; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/075; H10W72/07502; H10W72/07504; H10W72/50; H10W72/541; H10W72/5449; H10W72/851; H10W72/853; H10W72/865; H10W74/00; H10W74/10; H10W74/131; H10W74/142; H10W90/701; H10W90/721; H10W90/722; H10W90/731; H10W90/732; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49204; Y10T29/49208
Claims Analysis
Total Claims: 42
Claim 1
Independent Claim
239 words
1 . A microelectronic component assembly comprising: a first microelectronic component package comprising: a first microelectronic component having a back surface; a first mold compound formed about the first microelectronic component, the first mold compound having a back surface; a plurality of first package contacts, each of which is exposed on the back surface of the first mold compound, at least some of the first package contacts being electrically coupled to the first microelectronic component; and a plurality of electrical connectors adapted for connection to another microelectronic component, the electrical connectors being accessible from a location spaced from the back surface of the first mold compound; and a second microelectronic component package comprising: a second microelectronic component having a back surface; a second mold compound formed about the second microelectronic component, the second mold compound having a back surface, the back surfaces of the first and second mold compounds being juxtaposed with but spaced from one another to define a peripherally open interpackage gap, the back surface of the first microelectronic component and the back surface of the second microelectronic component each being thermally exposed to the interpackage gap; and a plurality of second package contacts electrically coupled to the second microelectronic component, each second package contact being exposed on the back surface of the second mold compound and at least one of the second package contacts being electrically coupled to at least one of the first package contacts.
Claim 2
Dependent Claim
239 words
1 . A microelectronic component assembly comprising: a first microelectronic component package comprising: a first microelectronic component having a back surface; a first mold compound formed about the first microelectronic component, the first mold compound having a back surface; a plurality of first package contacts, each of which is exposed on the back surface of the first mold compound, at least some of the first package contacts being electrically coupled to the first microelectronic component; and a plurality of electrical connectors adapted for connection to another microelectronic component, the electrical connectors being accessible from a location spaced from the back surface of the first mold compound; and a second microelectronic component package comprising: a second microelectronic component having a back surface; a second mold compound formed about the second microelectronic component, the second mold compound having a back surface, the back surfaces of the first and second mold compounds being juxtaposed with but spaced from one another to define a peripherally open interpackage gap, the back surface of the first microelectronic component and the back surface of the second microelectronic component each being thermally exposed to the interpackage gap; and a plurality of second package contacts electrically coupled to the second microelectronic component, each second package contact being exposed on the back surface of the second mold compound and at least one of the second package contacts being electrically coupled to at least one of the first package contacts.
Claim 3
Dependent Claim
19 words
2 . The microelectronic component assembly of claim 1 wherein the second microelectronic component package is a non-leaded package.
Claim 4
Dependent Claim
27 words
3 . The microelectronic component assembly of claim 1 wherein the interpackage gap comprises an air-filled gap between the first confronting surface and the second confronting surface.
Claim 5
Dependent Claim
25 words
4 . The microelectronic component assembly of claim 1 wherein the back surface of the first microelectronic component is exposed directly to the interpackage gap.
Claim 6
Dependent Claim
25 words
5 . The microelectronic component assembly of claim 1 wherein the back surface of the second microelectronic component is exposed directly to the interpackage gap.
Claim 7
Dependent Claim
44 words
6 . The microelectronic component assembly of claim 1 wherein the back surface of the first microelectronic component and the back surface of the second microelectronic component are each exposed directly to the interpackage gap and juxtaposed with one another across the interpackage gap.
Claim 8
Dependent Claim
34 words
7 . The microelectronic component assembly of claim 1 further comprising a heat sink thermally coupled to the back surface of the first microelectronic component, the heat sink being exposed to the interpackage gap.
Claim 9
Dependent Claim
34 words
8 . The microelectronic component assembly of claim 1 further comprising a heat sink thermally coupled to the back surface of the second microelectronic component, the heat sink being exposed to the interpackage gap.
Claim 10
Dependent Claim
63 words
9 . The microelectronic component assembly of claim 1 further comprising a first heat sink thermally coupled to the back surface of the first microelectronic component and a second heat sink thermally coupled to the back surface of the second microelectronic component, the first and second heat sinks being exposed to the interpackage gap and juxtaposed with one another across the interpackage gap.
Claim 11
Dependent Claim
42 words
10 . The microelectronic component assembly of claim 1 further comprising a heat sink thermally coupled to the back surface of the first microelectronic component, the heat sink extending into the interpackage gap beyond the back surface of the first mold compound.
Claim 12
Dependent Claim
27 words
11 . The microelectronic component assembly of claim 1 wherein each of the electrical connectors comprises a length of a lead extending outwardly from the mold compound.
Claim 13
Dependent Claim
24 words
12 . The microelectronic component assembly of claim 1 wherein the first package contacts are carried adjacent a periphery of the first mold compound.
Claim 14
Dependent Claim
39 words
13 . The microelectronic component assembly of claim 1 wherein the first package contacts are carried adjacent a periphery of the first mold compound and the second package contacts are carried adjacent a periphery of the second mold compound.
Claim 15
Dependent Claim
38 words
14 . The microelectronic component assembly of claim 1 wherein each of the first package contacts comprises an exposed surface of a lead and an exposed length of each of the leads defines one of the electrical connectors.
Claim 16
Dependent Claim
218 words
15 . A microelectronic component assembly comprising: a non-leaded first package including a first microelectronic die, a dielectric first mold compound, and a plurality of contacts, the first package having a first confronting surface including a back surface of the first mold compound, an exposed back surface of the first microelectronic die, and exposed surfaces of the contacts; a second package including a second microelectronic die, a dielectric second mold compound having a periphery, and a plurality of leads having outer lengths extending outwardly beyond the periphery of the second mold compound and adapted for electrical connection to another microelectronic component, the second package having a second confronting surface including a back surface of the second mold compound, an exposed back surface of the second microelectronic die, and exposed contact surfaces of the leads arranged within the periphery of the second mold compound; and a plurality of electrical junctions, each of the electrical junctions electrically coupling one of the contacts to the contact surface of one of the leads and physically supporting the first package with respect to the second package with the first and second confronting surfaces juxtaposed with but spaced from one another to define a fluid passage between the back surface of the first microelectronic die and the back surface of the second microelectronic die.
Claim 17
Dependent Claim
218 words
15 . A microelectronic component assembly comprising: a non-leaded first package including a first microelectronic die, a dielectric first mold compound, and a plurality of contacts, the first package having a first confronting surface including a back surface of the first mold compound, an exposed back surface of the first microelectronic die, and exposed surfaces of the contacts; a second package including a second microelectronic die, a dielectric second mold compound having a periphery, and a plurality of leads having outer lengths extending outwardly beyond the periphery of the second mold compound and adapted for electrical connection to another microelectronic component, the second package having a second confronting surface including a back surface of the second mold compound, an exposed back surface of the second microelectronic die, and exposed contact surfaces of the leads arranged within the periphery of the second mold compound; and a plurality of electrical junctions, each of the electrical junctions electrically coupling one of the contacts to the contact surface of one of the leads and physically supporting the first package with respect to the second package with the first and second confronting surfaces juxtaposed with but spaced from one another to define a fluid passage between the back surface of the first microelectronic die and the back surface of the second microelectronic die.
Claim 18
Dependent Claim
26 words
16 . The microelectronic component assembly of claim 15 wherein the fluid passage is peripherally open to facilitate cooling of the first and second microelectronic dies.
Claim 19
Dependent Claim
27 words
17 . The microelectronic component assembly of claim 15 wherein the fluid passage comprises an air-filled gap between the first confronting surface and the second confronting surface.
Claim 20
Dependent Claim
27 words
18 . The microelectronic component assembly of claim 15 wherein the back surface of the first microelectronic die is exposed directly to fluid in the fluid passage.
Claim 21
Dependent Claim
27 words
19 . The microelectronic component assembly of claim 15 wherein the back surface of the second microelectronic die is exposed directly to fluid in the fluid passage.
Claim 22
Dependent Claim
46 words
20 . The microelectronic component assembly of claim 15 wherein the back surface of the first microelectronic die and the back surface of the second microelectronic die are each exposed directly to fluid in the fluid passage and juxtaposed with one another across the fluid passage.
Claim 23
Dependent Claim
36 words
21 . The microelectronic component assembly of claim 15 further comprising a heat sink thermally coupled to the back surface of the first microelectronic die, the heat sink being exposed to fluid in the fluid passage.
Claim 24
Dependent Claim
36 words
22 . The microelectronic component assembly of claim 15 further comprising a heat sink thermally coupled to the back surface of the second microelectronic die, the heat sink being exposed to fluid in the fluid passage.
Claim 25
Dependent Claim
65 words
23 . The microelectronic component assembly of claim 15 further comprising a first heat sink thermally coupled to the back surface of the first microelectronic die and a second heat sink thermally coupled to the back surface of the second microelectronic die, the first and second heat sinks being exposed to fluid in the fluid passage and juxtaposed with one another across the fluid passage.
Claim 26
Dependent Claim
42 words
24 . The microelectronic component assembly of claim 15 further comprising a heat sink thermally coupled to the back surface of the first microelectronic die, the heat sink extending into the fluid passage beyond the back surface of the first mold compound.
Claim 27
Dependent Claim
42 words
25 . The microelectronic component assembly of claim 15 wherein the exposed surfaces of the first leads are carried adjacent a periphery of the first mold compound and the second package contacts are carried adjacent a periphery of the second mold compound.
Claim 28
Dependent Claim
21 words
26 . The microelectronic component assembly of claim 15 wherein the first confronting surface is parallel to the second confronting surface.
Claim 29
Dependent Claim
19 words
27 . The microelectronic component assembly of claim 15 wherein each of the electrical junctions comprises a reflowed solder.
Claim 30
Dependent Claim
251 words
28 . A memory module comprising: a module board configured to be electrically coupled with a higher-level microelectronic device; a first microelectronic component package comprising: a first microelectronic component having a back surface; a first mold compound formed about the first microelectronic component, the first mold compound having a back surface; a plurality of first package contacts, each of which is exposed on the back surface of the first mold compound, at least some of the first package contacts being electrically coupled to the first microelectronic component; and a plurality of electrical connectors adapted for connection to another microelectronic component, the electrical connectors being accessible from a location spaced from the back surface of the first mold compound; and a second microelectronic component package comprising: a second microelectronic component having a back surface; a second mold compound formed about the second microelectronic component, the second mold compound having a back surface, the back surfaces of the first and second mold compounds being juxtaposed with but spaced from one another to define a peripherally open interpackage gap, the back surface of the first microelectronic component and the back surface of the second microelectronic component each being thermally exposed to the interpackage gap; and a plurality of second package contacts electrically coupled to the second microelectronic component, each second package contact being exposed on the back surface of the second mold compound and at least one of the second package contacts being electrically coupled to at least one of the first package contacts.
Claim 31
Dependent Claim
251 words
28 . A memory module comprising: a module board configured to be electrically coupled with a higher-level microelectronic device; a first microelectronic component package comprising: a first microelectronic component having a back surface; a first mold compound formed about the first microelectronic component, the first mold compound having a back surface; a plurality of first package contacts, each of which is exposed on the back surface of the first mold compound, at least some of the first package contacts being electrically coupled to the first microelectronic component; and a plurality of electrical connectors adapted for connection to another microelectronic component, the electrical connectors being accessible from a location spaced from the back surface of the first mold compound; and a second microelectronic component package comprising: a second microelectronic component having a back surface; a second mold compound formed about the second microelectronic component, the second mold compound having a back surface, the back surfaces of the first and second mold compounds being juxtaposed with but spaced from one another to define a peripherally open interpackage gap, the back surface of the first microelectronic component and the back surface of the second microelectronic component each being thermally exposed to the interpackage gap; and a plurality of second package contacts electrically coupled to the second microelectronic component, each second package contact being exposed on the back surface of the second mold compound and at least one of the second package contacts being electrically coupled to at least one of the first package contacts.
Claim 32
Dependent Claim
18 words
29 . The memory module of claim 28 wherein the first microelectronic component package is a non-leaded package.
Claim 33
Dependent Claim
43 words
30 . The memory module of claim 28 wherein the back surface of the first microelectronic component and the back surface of the second microelectronic component are each exposed directly to the interpackage gap and juxtaposed with one another across the interpackage gap.
Claim 34
Dependent Claim
62 words
31 . The memory module of claim 28 further comprising a first heat sink thermally coupled to the back surface of the first microelectronic component and a second heat sink thermally coupled to the back surface of the second microelectronic component, the first and second heat sinks being exposed to the interpackage gap and juxtaposed with one another across the interpackage gap.
Claim 35
Dependent Claim
41 words
32 . The memory module of claim 28 further comprising a heat sink thermally coupled to the back surface of the first microelectronic component, the heat sink extending into the interpackage gap beyond the back surface of the first mold compound.
Claim 36
Dependent Claim
45 words
33 . The memory module of claim 28 wherein the first package contacts are carried in an array adjacent a periphery of the first mold compound and the second package contacts are carried in a mating array adjacent a periphery of the second mold compound.
Claim 37
Dependent Claim
37 words
34 . The memory module of claim 28 wherein each of the first package contacts comprises an exposed surface of a lead and an exposed length of each of the leads defines one of the electrical connectors.
Claim 38
Dependent Claim
282 words
35 . A computer system comprising: an input device; an output device; a processor in communication with the input device and the output device; and a memory module in communication with the processor, the memory module comprising: a module board configured to be electrically coupled with a higher-level microelectronic device; a first microelectronic component package comprising: a first microelectronic component having a back surface; a first mold compound formed about the first microelectronic component, the first mold compound having a back surface; a plurality of first package contacts, each of which is exposed on the back surface of the first mold compound, at least some of the first package contacts being electrically coupled to the first microelectronic component; and a plurality of electrical connectors adapted for connection to another microelectronic component, the electrical connectors being accessible from a location spaced from the back surface of the first mold compound; and a second microelectronic component package comprising: a second microelectronic component having a back surface; a second mold compound formed about the second microelectronic component, the second mold compound having a back surface, the back surfaces of the first and second mold compounds being juxtaposed with but spaced from one another to define a peripherally open interpackage gap, the back surface of the first microelectronic component and the back surface of the second microelectronic component each being thermally exposed to the interpackage gap; and a plurality of second package contacts electrically coupled to the second microelectronic component, each second package contact being exposed on the back surface of the second mold compound and at least one of the second package contacts being electrically coupled to at least one of the first package contacts.
Claim 39
Dependent Claim
282 words
35 . A computer system comprising: an input device; an output device; a processor in communication with the input device and the output device; and a memory module in communication with the processor, the memory module comprising: a module board configured to be electrically coupled with a higher-level microelectronic device; a first microelectronic component package comprising: a first microelectronic component having a back surface; a first mold compound formed about the first microelectronic component, the first mold compound having a back surface; a plurality of first package contacts, each of which is exposed on the back surface of the first mold compound, at least some of the first package contacts being electrically coupled to the first microelectronic component; and a plurality of electrical connectors adapted for connection to another microelectronic component, the electrical connectors being accessible from a location spaced from the back surface of the first mold compound; and a second microelectronic component package comprising: a second microelectronic component having a back surface; a second mold compound formed about the second microelectronic component, the second mold compound having a back surface, the back surfaces of the first and second mold compounds being juxtaposed with but spaced from one another to define a peripherally open interpackage gap, the back surface of the first microelectronic component and the back surface of the second microelectronic component each being thermally exposed to the interpackage gap; and a plurality of second package contacts electrically coupled to the second microelectronic component, each second package contact being exposed on the back surface of the second mold compound and at least one of the second package contacts being electrically coupled to at least one of the first package contacts.
Claim 40
Dependent Claim
169 words
36 . A method of assembling a microelectronic component assembly, comprising: juxtaposing a first confronting surface of a first microelectronic component package with a second confronting surface of a second microelectronic component package and, in so doing, aligning an array of exposed first contacts on the first confronting surface with a mating array of exposed second contacts on the second confronting surface and juxtaposing an exposed back surface of a first microelectronic component included in the first microelectronic component package with an exposed back surface of a second microelectronic component included in the second microelectronic component package; and electrically coupling the first microelectronic component package to the second microelectronic component package with a plurality of electrical junctions, each electrical junction electrically coupling one of the first contacts to one of the second contacts, the electrical junctions supporting the first microelectronic component package with respect to the second microelectronic component package with the first confronting surface spaced from the second confronting surface to define a peripherally open air gap therebetween.
Claim 41
Dependent Claim
169 words
36 . A method of assembling a microelectronic component assembly, comprising: juxtaposing a first confronting surface of a first microelectronic component package with a second confronting surface of a second microelectronic component package and, in so doing, aligning an array of exposed first contacts on the first confronting surface with a mating array of exposed second contacts on the second confronting surface and juxtaposing an exposed back surface of a first microelectronic component included in the first microelectronic component package with an exposed back surface of a second microelectronic component included in the second microelectronic component package; and electrically coupling the first microelectronic component package to the second microelectronic component package with a plurality of electrical junctions, each electrical junction electrically coupling one of the first contacts to one of the second contacts, the electrical junctions supporting the first microelectronic component package with respect to the second microelectronic component package with the first confronting surface spaced from the second confronting surface to define a peripherally open air gap therebetween.
Claim 42
Dependent Claim
25 words
37 . The method of claim 36 wherein the electrical junctions are arranged in an open array permitting air to flow into the air gap.
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