Thermally enhanced semiconductor package

Claim 2

A packaged semiconductor device, comprising: a substrate having a first and a second surface and an opening extending from said first to said second; a die having a first surface directly connected to said second surface of said substrate; a heat sink having a first surface affixed to a second surface of said die which is opposite to said first die surface; and a first molding material encapsulating said die and said heat sink, said first molding material leaving exposed a substantial portion of a second surface of said heat sink.

Claim 3

The device of claim 1 , wherein said second surface of said heat sink is a substantially entire upper surface of said heat sink.

Claim 4

The device of claim 2 , further comprising first contacts on said die connected through said opening with respective second contacts on said substrate by conductors.

Claim 5

The device of claim 3 , further comprising a second molding material encapsulating said first contacts and at least a portion of said wiring.

Claim 6

The device of claim 1 , further comprising a plurality of solder balls on said first surface of said substrate.

Claim 7

The device of claim 1 , wherein said heat sink comprises a metal material.

Claim 8

The device of claim 6 , wherein said heat sink comprises a metal oxide material.

Claim 9

The device of claim 1 , wherein said heat sink comprises a polymeric material having embedded thermally conductive components.

Claim 10

The device of claim 8 , wherein said embedded components comprise metal components.

Claim 11

The device of claim 8 , wherein said embedded components comprise inorganic material components.

Claim 12

The device of claim 10 , wherein said inorganic material comprises silicon nitride.

Claim 13

The device of claim 1 , further comprising a thermally complaint material located between said heat sink and said die.

Claim 14

The device of claim 12 , wherein said thermally compliant material comprises an adhesive.

Claim 15

The device of claim 13 , wherein said adhesive is a silver-filled bismaleimide material.

Claim 16

The device of claim 12 , wherein said thermally compliant material has a thermal conductivity factor in the range of about twenty W/mK to about forty W/mK.

Claim 17

The device of claim 1 , wherein said die comprises a memory circuit.

Claim 18

The device of claim 4 , further comprising a plurality of second contacts on said first surface of said substrate.

Claim 19

A packaged semiconductor device, comprising: a die having a first surface and first contacts; a substrate having a first surface, a second surface and at least one opening, said substrate second surface being connected to said first surface of said die, said first surface of said substrate having second contacts, said first contacts being connected to respective said second contacts through said at least one opening by conductors; a heat sink having a first surface; a thermally compliant material adhering said first surface of said heat sink with a second surface of said die which is opposite to said first die surface; and a first molding material encapsulating said die, thermally compliant material, and substrate, said first molding material leaving exposed a substantial portion of a second surface of said heat sink.

Claim 20

A packaged semiconductor device, comprising: a die having a first surface and first contacts; a substrate having a first surface, a second surface and at least one opening, said substrate second surface being connected to said first surface of said die, said first surface of said substrate having second contacts, said first contacts being connected to respective said second contacts through said at least one opening by conductors; a heat sink having a first surface; a thermally compliant material adhering said first surface of said heat sink with a second surface of said die which is opposite to said first die surface; and a first molding material encapsulating said die, thermally compliant material, and substrate, said first molding material leaving exposed a substantial portion of a second surface of said heat sink.

Claim 21

The device of claim 17 , wherein said second surface of said heat sink is a substantially entire upper surface of said heat sink.

Claim 22

The device of claim 18 , further comprising a second molding material encapsulating said first contacts and said conductors.

Claim 23

The device of claim 20 , wherein said thermally compliant material has a thermal conductivity factor in the range of about twenty W/mK to about forty W/mK.

Claim 24

The device of claim 21 , wherein said thermally compliant material comprises an adhesive.

Claim 25

The device of claim 22 , wherein said adhesive is a silver-filled bismaleimide material.

Claim 26

The device of claim 18 , wherein said heat sink comprises a metal material.

Claim 27

The device of claim 24 , wherein said heat sink comprises a metal oxide material.

Claim 28

The device of claim 18 , wherein said heat sink comprises a polymeric material having embedded thermally conductive components.

Claim 29

The device of claim 26 , wherein said embedded components comprise metal components.

Claim 30

The device of claim 26 , wherein said embedded components comprise inorganic material components.

Claim 31

The device of claim 28 , wherein said inorganic material comprises silicon nitride.

Claim 32

The device of claim 20 , further comprising a plurality of second contacts on said first surface of said substrate.

Claim 33

A packaged semiconductor device, comprising: a memory die having a first surface and first contacts; a substrate having at least one opening, a first surface and a second surface opposite said first surface and connected to said first surface of said die, said first surface of said substrate having second contacts, said first contacts being connected to respective said second contacts through said at least one opening by conductors; a heat sink having a first surface; a thermally compliant material adhering said first surface of said heat sink with a second surface of said die which is opposite to said first die surface; and a first molding material encapsulating said die, thermally compliant material, and substrate, said first molding material leaving exposed a substantial portion of a second surface of said heat sink.

Claim 34

A packaged semiconductor device, comprising: a memory die having a first surface and first contacts; a substrate having at least one opening, a first surface and a second surface opposite said first surface and connected to said first surface of said die, said first surface of said substrate having second contacts, said first contacts being connected to respective said second contacts through said at least one opening by conductors; a heat sink having a first surface; a thermally compliant material adhering said first surface of said heat sink with a second surface of said die which is opposite to said first die surface; and a first molding material encapsulating said die, thermally compliant material, and substrate, said first molding material leaving exposed a substantial portion of a second surface of said heat sink.

Claim 35

The packaged semiconductor device of claim 31 , wherein said memory circuit comprises a DRAM.

Claim 36

The packaged semiconductor device of claim 31 , wherein said memory circuit comprises a SRAM.

Claim 37

The packaged semiconductor device of claim 31 , wherein said memory circuit comprises a SDRAM.

Claim 38

A ball grid array device, comprising: a die having a first surface and first contacts; a substrate having a first surface, a second surface and at least one opening, said substrate second surface being connected to said first surface of said die, said first surface of said substrate having a plurality of solder balls and second contacts, said first contacts being connected to respective said second contacts through conductors which passes through said at least one opening; a heat sink having a first surface; a thermally conductive compliant material adhering said first surface of said heat sink with a second surface of said die which is opposite to said first die surface; a first molding material encapsulating said die, thermally conductive compliant material, and substrate, said first molding material leaving exposed a substantial portion of a second surface of said heat sink; and a second molding material provided in said opening and encapsulating said first contacts and said conductors.

Claim 39

A ball grid array device, comprising: a die having a first surface and first contacts; a substrate having a first surface, a second surface and at least one opening, said substrate second surface being connected to said first surface of said die, said first surface of said substrate having a plurality of solder balls and second contacts, said first contacts being connected to respective said second contacts through conductors which passes through said at least one opening; a heat sink having a first surface; a thermally conductive compliant material adhering said first surface of said heat sink with a second surface of said die which is opposite to said first die surface; a first molding material encapsulating said die, thermally conductive compliant material, and substrate, said first molding material leaving exposed a substantial portion of a second surface of said heat sink; and a second molding material provided in said opening and encapsulating said first contacts and said conductors.

Claim 40

The device of claim 35 , further comprising a plurality of second contacts on said first surface of said substrate.