Integral dam and heat sink for semiconductor device assembly

Claim 1

A semiconductor device assembly comprising: a die attach pad having a periphery; a die having a top surface containing circuit elements and a bottom surface, mounted by its bottom surface atop the die attach pad; a plurality of leads having inner ends and extending generally radially outwardly from adjacent the die attach pad; a first, segmented plastic film layer disposed atop the leads, a portion of the first plastic film layer bridging a gap between the inner ends of the leads and the die attach pad and leaving a portion of the leads exposed; a plurality of bond wires connecting the circuit elements of the top surface of the die to the exposed portions of the inner ends of the leads; a second plastic film layer disposed beneath the leads, and beneath the periphery of the die attach pad; a ring-like frame formed of anodized aluminum disposed atop the leads; epoxy disposed atop the leads, covering the circuit elements, completely encapsulating the die and extending to the ring-like frame, thereby forming an encapsulated semiconductor device assembly; and a first heat sink structure disposed atop the die, facing the circuit element containing top surface of the die, said first heat sink structure formed integrally with the ring-like frame, said first heat sink structure having a first surface in close proximity to the circuit element containing top surface of the die and in contact with the epoxy, and having a second surface forming a flat exterior surface for the semiconductor device.