US6210992B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Controlling packaging encapsulant leakage
Assignee: Micron Technology Inc
•
Filing: 1999-08-31
•
Granted: 2001-04-03
•
Expires: 2019-08-31
Abstract
Abstract An integrated circuit package may be formed in part with an encapsulated region. Outflow of the encapsulant across critical electrical elements can be prevented by providing a cavity which collects encapsulant outflow between the region of encapsulation and the region where the critical components are situated. In one embodiment of the present invention, a surface may include a first portion covered by solder resist, having an area populated by bond pads, and a second portion which is encapsulated. Encapsulant flow over the bond pads is prevented by forming an opening in the solder resist proximate to the second portion to collect the encapsulant before it reaches the bond pads.
Inventors
- 👤 Patrick W. Tandy
- 👤 Joseph M. Brand
- 👤 Brad D. Rumsey
- 👤 Steven R. Stephenson
- 👤 David J. Corisis
- 👤 Todd O. Bolken
- 👤 Edward A. Schrock
- 👤 Brenton L. Dickey
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:18
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H10W74/01; H10W74/016; H10W74/131; H10W70/62; H10W70/63; H10W72/00; H10W72/071; H10W72/075; H10W72/90; H10W72/951; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
39 words
A process for encapsulating integrated circuits comprising: defining an encapsulation chamber about an integrated circuit die; filling said chamber with an encapsulant; and controlling outflow of encapsulant from said chamber by providing a collection cavity proximate to said chamber.
Claim 2
Dependent Claim
39 words
A process for encapsulating integrated circuits comprising: defining an encapsulation chamber about an integrated circuit die; filling said chamber with an encapsulant; and controlling outflow of encapsulant from said chamber by providing a collection cavity proximate to said chamber.
Claim 3
Dependent Claim
38 words
The method of claim 1 further including connecting a die to a first side of a support structure and making electrical connections from said die through an opening in said structure to a second side of said structure.
Claim 4
Dependent Claim
26 words
The method of claim 2 including covering the second side of said structure with a solder resist and leaving bond pad openings in said solder resist.
Claim 5
Dependent Claim
22 words
The method of claim 3 further including defining a solder resist free region to define said collection cavity proximate to said chamber.
Claim 6
Dependent Claim
29 words
The method of claim 4 including defining a plurality of ball pads on said structure adjacent said opening and positioning said cavity between said opening and said ball pads.
Claim 7
Dependent Claim
17 words
The method of claim 5 further including securing a plurality of solder balls to said ball pads.
Claim 8
Dependent Claim
16 words
The method of claim 1 wherein said cavity is formed in packaging associated with said die.
Claim 9
Dependent Claim
33 words
The method of claim 1 including physically coupling said die to a structure, electrically coupling said die to said structure, providing bond pads on said structure, and positioning said cavity on said structure.
Claim 10
Dependent Claim
37 words
The method of claim 8 including providing a passage through said structure for wires to couple said die to said structure, filling said passage with encapsulant, and positioning said cavity between said bond pads and said passage.
Claim 11
Independent Claim
45 words
A method for encapsulating an electronic device comprising: encapsulating at least a portion of said electronic device; and preventing outflow of encapsulation material from said encapsulated portion to a non-encapsulated portion by providing an encapsulation receiving cavity between said encapsulated portion and said non-encapsulated portion.
Claim 12
Independent Claim
45 words
A method for encapsulating an electronic device comprising: encapsulating at least a portion of said electronic device; and preventing outflow of encapsulation material from said encapsulated portion to a non-encapsulated portion by providing an encapsulation receiving cavity between said encapsulated portion and said non-encapsulated portion.
Claim 13
Dependent Claim
43 words
The method of claim 10 including covering said non-encapsulated portion with a solder resist material, forming at least one opening in said solder resist material for a bond pad, and forming said cavity by forming a second opening in said solder resist material.
Claim 14
Dependent Claim
17 words
The method of claim 11 including defining said cavity between a bond pad and said encapsulated region.
Claim 15
Dependent Claim
28 words
The method of claim 12 including patterning said solder mask material to form an opening for said bond pad and to form an opening to create said cavity.
Claim 16
Independent Claim
73 words
A method for packaging integrated circuit devices comprising: defining an encapsulated region on a support structure; defining bond pads on an unencapsulated region of said support structure; depositing a solder resist material on said unencapsulated portion of said support structure; and defining openings in said solder resist material for said bond pads and defining an additional opening between said bond pads and said encapsulated region to collect encapsulation overflow from said encapsulated region.
Claim 17
Independent Claim
73 words
A method for packaging integrated circuit devices comprising: defining an encapsulated region on a support structure; defining bond pads on an unencapsulated region of said support structure; depositing a solder resist material on said unencapsulated portion of said support structure; and defining openings in said solder resist material for said bond pads and defining an additional opening between said bond pads and said encapsulated region to collect encapsulation overflow from said encapsulated region.
Claim 18
Dependent Claim
13 words
The method of claim 14 including attaching a die to said support structure.
Claim 19
Dependent Claim
36 words
The method of claim 15 including forming an opening through said support structure and wire bonding a die attached to one side of said support structure to contacts on said second side of said support structure.
Claim 20
Dependent Claim
14 words
The method of claim 16 including encapsulating said opening to form said encapsulated region.
Claim 21
Dependent Claim
23 words
The method of claim 14 including defining the openings for said bond pads and for said cavity by patterning said solder resist layer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-04-02 | 2004-10-02 | 2005-04-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-04-02 | 2008-10-02 | 2009-04-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-04-02 | 2012-10-02 | 2013-04-03 | $7700.00 | Window Closed / Lapsed |