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US20070178643A1 Expired / Lapsed US ⏱️ 0.0 years remaining

Memory utilizing oxide-conductor nanolaminates

Assignee: Micron Technology Inc
•
Filing: 2005-08-31
•
Granted: —
•
Expires: 2025-08-31
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Abstract

Abstract Structures, systems and methods for floating gate transistors utilizing oxide-conductor nanolaminates are provided. One floating gate transistor embodiment includes a first source/drain region, a second source/drain region, and a channel region therebetween. A floating gate is separated from the channel region by a first gate oxide. The floating gate includes oxide-conductor nanolaminate layers to trap charge in potential wells formed by different electron affinities of the oxide-conductor nanolaminate layers.

Inventors

  • 👤 Leonard Forbes
  • 👤 Kie Ahn

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 08:35
CPC Classifications
G; G11; G11C; G11C11/00; G11C11/56; G11C11/5671; H; H10; H10B; H10B69/00; H10D; H10D30/00; H10D30/60; H10D30/68; H10D30/681; H10D30/684; H10D30/685; H10D30/6891; H10D30/6893; G11C16/00; G11C16/02; G11C16/04; G11C16/0408; G11C16/0416

Claims Analysis

Total Claims: 31
Claim 1
Independent Claim 79 words
1 . A method for forming a floating gate transistor, comprising: forming a first source/drain region, a second source/drain region, and a channel region therebetween in a substrate; forming a floating gate opposing the channel region and separated therefrom by a first gate oxide, wherein forming the floating gate includes forming oxide-conductor nanolaminate layers including at least one metal conductor laminate layer; and forming a control gate opposing the floating gate and separated therefrom by a second gate oxide.
Claim 2
Dependent Claim 79 words
1 . A method for forming a floating gate transistor, comprising: forming a first source/drain region, a second source/drain region, and a channel region therebetween in a substrate; forming a floating gate opposing the channel region and separated therefrom by a first gate oxide, wherein forming the floating gate includes forming oxide-conductor nanolaminate layers including at least one metal conductor laminate layer; and forming a control gate opposing the floating gate and separated therefrom by a second gate oxide.
Claim 3
Dependent Claim 21 words
2 . The method of claim 1 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Tantalum Nitride (TaN).
Claim 4
Dependent Claim 21 words
3 . The method of claim 1 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Titanium Nitride (TiN).
Claim 5
Dependent Claim 21 words
4 . The method of claim 1 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Tungsten Nitride (WN).
Claim 6
Dependent Claim 21 words
5 . The method of claim 1 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Niobium Nitride (NbN).
Claim 7
Dependent Claim 21 words
6 . The method of claim 1 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Molybdenum Nitride (MoN).
Claim 8
Dependent Claim 20 words
7 . The method of claim 1 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Zinc-Oxide-Silicon (ZnOS).
Claim 9
Dependent Claim 20 words
8 . The method of claim 1 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Tungsten (W).
Claim 10
Dependent Claim 20 words
9 . The method of claim 1 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Nickel (Ni).
Claim 11
Dependent Claim 331 words
10 . A method for forming a multistate memory array, comprising: forming a number of vertical pillars in rows and columns extending outwardly from a substrate and separated by a number of trenches, wherein the number of vertical pillars serve as floating gate transistors including a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, a floating gate in the trenches along rows of pillars and separated from the channel region by a first gate oxide, and a control gate separated from the floating gate by a second gate oxide, wherein along columns of the pillars adjacent pillars include a floating gate transistor which operates as a multistate cell on one side of a trench and a floating gate transistor which operates as a reference cell having a programmed conductivity state on the opposite side of the trench, and wherein forming the floating gate includes forming oxide-conductor nanolaminate layers including at least one metal conductor laminate layer; forming a number of bit lines coupled to the second source/drain region of each floating gate transistor along rows of the memory array; forming a number of word lines coupled to the control gate of each floating gate transistor along columns of the memory array; forming a number of sourcelines formed in a bottom of the trenches between rows of the pillars and coupled to the first source/drain regions of each floating gate transistor along rows of pillars, wherein along columns of the pillars the first source/drain region of each floating gate transistor in column adjacent pillars couples to the sourceline in a shared trench such that a multistate cell floating gate transistor and a reference cell floating gate transistor share a common sourceline; and wherein the number of vertical pillars can be programmed to have a charge trapped in the floating gate by biasing a sourceline to a voltage higher than VDD, grounding a bitline, and selecting a control gate by a wordline address.
Claim 12
Dependent Claim 331 words
10 . A method for forming a multistate memory array, comprising: forming a number of vertical pillars in rows and columns extending outwardly from a substrate and separated by a number of trenches, wherein the number of vertical pillars serve as floating gate transistors including a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, a floating gate in the trenches along rows of pillars and separated from the channel region by a first gate oxide, and a control gate separated from the floating gate by a second gate oxide, wherein along columns of the pillars adjacent pillars include a floating gate transistor which operates as a multistate cell on one side of a trench and a floating gate transistor which operates as a reference cell having a programmed conductivity state on the opposite side of the trench, and wherein forming the floating gate includes forming oxide-conductor nanolaminate layers including at least one metal conductor laminate layer; forming a number of bit lines coupled to the second source/drain region of each floating gate transistor along rows of the memory array; forming a number of word lines coupled to the control gate of each floating gate transistor along columns of the memory array; forming a number of sourcelines formed in a bottom of the trenches between rows of the pillars and coupled to the first source/drain regions of each floating gate transistor along rows of pillars, wherein along columns of the pillars the first source/drain region of each floating gate transistor in column adjacent pillars couples to the sourceline in a shared trench such that a multistate cell floating gate transistor and a reference cell floating gate transistor share a common sourceline; and wherein the number of vertical pillars can be programmed to have a charge trapped in the floating gate by biasing a sourceline to a voltage higher than VDD, grounding a bitline, and selecting a control gate by a wordline address.
Claim 13
Dependent Claim 37 words
11 . The method of claim 10 , wherein forming a number of sourcelines formed in a bottom of the trenches between rows of the pillars includes implanting a doped region in the bottom of the trench.
Claim 14
Dependent Claim 21 words
12 . The method of claim 10 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Tantalum Nitride (TaN).
Claim 15
Dependent Claim 21 words
13 . The method of claim 10 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Titanium Nitride (TiN).
Claim 16
Dependent Claim 21 words
14 . The method of claim 10 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Tungsten Nitride (WN).
Claim 17
Dependent Claim 21 words
15 . The method of claim 10 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Niobium Nitride (NbN).
Claim 18
Dependent Claim 21 words
16 . The method of claim 10 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Molybdenum Nitride (MoN).
Claim 19
Dependent Claim 20 words
17 . The method of claim 10 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Zinc-Oxide-Silicon (ZnOS).
Claim 20
Dependent Claim 20 words
18 . The method of claim 10 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Tungsten (W).
Claim 21
Dependent Claim 20 words
19 . The method of claim 10 , wherein forming oxide-conductor nanolaminate layers includes forming a layer of Nickel (Ni).
Claim 22
Dependent Claim 91 words
20 . A method for forming a memory array, comprising: forming a plurality of memory cells, wherein forming at least one cell includes: forming a first source/drain region, a second source/drain region, and a channel region therebetween in a substrate; forming a floating gate opposing the channel region and separated therefrom by a first gate oxide, wherein forming the floating gate includes forming oxide-conductor nanolaminate layers including at least one metal conductor laminate layer; and forming a control gate opposing the floating gate and separated therefrom by a second gate oxide.
Claim 23
Dependent Claim 91 words
20 . A method for forming a memory array, comprising: forming a plurality of memory cells, wherein forming at least one cell includes: forming a first source/drain region, a second source/drain region, and a channel region therebetween in a substrate; forming a floating gate opposing the channel region and separated therefrom by a first gate oxide, wherein forming the floating gate includes forming oxide-conductor nanolaminate layers including at least one metal conductor laminate layer; and forming a control gate opposing the floating gate and separated therefrom by a second gate oxide.
Claim 24
Dependent Claim 37 words
21 . The method of claim 20 , further including forming programming circuitry to create a hot electron injection into the floating gate adjacent to the first source/drain region in a reverse direction of the memory cell.
Claim 25
Dependent Claim 22 words
22 . The method of claim 20 , further including forming reading circuitry to read the memory cell in a forward direction.
Claim 26
Dependent Claim 29 words
23 . The method of claim 20 , wherein forming programming circuitry includes forming circuitry to apply a grounding potential to the first source/drain of the floating gate transistor.
Claim 27
Dependent Claim 25 words
24 . The method of claim 20 , wherein forming programming circuitry includes forming circuitry to apply a VDD potential to the second source/drain region.
Claim 28
Dependent Claim 117 words
25 . A method for forming an electronic system, comprising: forming a memory array, wherein forming at least one memory cell in the array includes: forming a first source/drain region, a second source/drain region, and a channel region therebetween in a substrate; forming a floating gate opposing the channel region and separated therefrom by a first gate oxide, wherein forming the floating gate includes forming oxide-conductor nanolaminate layers including at least one metal conductor laminate layer; forming a control gate opposing the floating gate and separated therefrom by a second gate oxide; forming a number of sense amplifiers to detect a signal from memory cells in the memory array; and coupling the memory array to a processor.
Claim 29
Dependent Claim 117 words
25 . A method for forming an electronic system, comprising: forming a memory array, wherein forming at least one memory cell in the array includes: forming a first source/drain region, a second source/drain region, and a channel region therebetween in a substrate; forming a floating gate opposing the channel region and separated therefrom by a first gate oxide, wherein forming the floating gate includes forming oxide-conductor nanolaminate layers including at least one metal conductor laminate layer; forming a control gate opposing the floating gate and separated therefrom by a second gate oxide; forming a number of sense amplifiers to detect a signal from memory cells in the memory array; and coupling the memory array to a processor.
Claim 30
Dependent Claim 37 words
26 . The method of claim 25 , further including forming programming circuitry to create a hot electron injection into the floating gate adjacent to the first source/drain region in a reverse direction of the memory cell.
Claim 31
Dependent Claim 22 words
27 . The method of claim 25 , further including forming reading circuitry to read the memory cell in a forward direction.

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