Patent US7163842B2 successfully refreshed from Google Patents.
US7163842B2
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Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA)
Assignee: Stats Chippac Pte Ltd
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Filing: 2006-03-13
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Granted: 2007-01-16
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Expires: 2026-03-13
Abstract
Abstract A semiconductor multi-package module has stacked first and second packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the first and second substrates are interconnected by wire bonding, and in which the first package includes a flip-chip ball grid array package having a flip-chip in a die-up configuration. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a flip-chip in a die-up configuration, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
Inventors
- 👤 Marcos Karnezos
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:52
CPC Classifications
H; H10; H10W; H10W90/00; H10W40/00; H10W40/10; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W40/70; H10W40/77; H10W40/778; H10W42/00; H10W42/20; H10W70/00; H10W70/60; H10W70/611; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W74/121; H10W74/15; H10W90/401; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5438; H10W72/551; H10W72/851; H10W72/853; H10W72/856; H10W72/865; H10W72/874; H10W72/877; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W74/127; H10W90/20; H10W90/22; H10W90/231; H10W90/288; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/752; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
67 words
A method for making a multi-package module, comprising providing a die-up flip chip first package including a first package substrate, providing a second package including a die and a second package substrate, inverting the second package and stacking the inverted second package over the first package, and electrically interconnecting the first and second packages by wire bonds connecting the first package substrate and the second package substrate.
Claim 2
Independent Claim
67 words
A method for making a multi-package module, comprising providing a die-up flip chip first package including a first package substrate, providing a second package including a die and a second package substrate, inverting the second package and stacking the inverted second package over the first package, and electrically interconnecting the first and second packages by wire bonds connecting the first package substrate and the second package substrate.
Claim 3
Dependent Claim
24 words
The method of claim 1 wherein providing a die-up flip chip first package comprises providing an unsingulated strip of die-up flip chip first packages.
Claim 4
Dependent Claim
15 words
The method of claim 2 , further comprising singulating the completed module from the strip.
Claim 5
Dependent Claim
38 words
The method of claim 1 wherein providing a die-up flip chip first package comprises testing die-up flip chip packages for a performance and reliability requirement, and selecting a package meeting the said requirement as a said first package.
Claim 6
Dependent Claim
16 words
The method of claim 3 , further comprising providing the first package with an electromagnetic shield.
Claim 7
Dependent Claim
32 words
The method of claim 1 wherein providing a second package comprises testing packages for a performance and reliability requirement, and selecting a package meeting the said requirement as a said second package.
Claim 8
Dependent Claim
17 words
The method of claim 1 wherein providing a second package comprises providing a land grid array package.
Claim 9
Dependent Claim
17 words
The method of claim 1 wherein providing a second package comprises providing a bump chip carrier package.
Claim 10
Dependent Claim
28 words
The method of claim 1 wherein stacking the second package over the first package comprises affixing the inverted second package onto a surface of the first package substrate.
Claim 11
Dependent Claim
42 words
The method of claim 9 wherein affixing the second package onto a surface of the first package substrate comprises applying an adhesive onto a die attach area of the first package surface substrate and contacting the inverted second package with the adhesive.
Claim 12
Dependent Claim
20 words
The method of claim 10 wherein applying the adhesive comprises applying a curable adhesive, and further comprising curing the adhesive.
Claim 13
Dependent Claim
16 words
The method of claim 1 , further comprising attaching second-level interconnect balls onto the first substrate.
Claim 14
Dependent Claim
18 words
The method of claim 1 , further comprising encapsulating features over the first substrate with a molding compound.
Claim 15
Dependent Claim
15 words
The method of claim 1 , further comprising providing the module with a heat spreader.
Claim 16
Dependent Claim
19 words
The method of claim 14 wherein providing the module with a heat spreader comprises performing a drop-in molding operation.
Claim 17
Dependent Claim
30 words
The method of claim 14 wherein providing the module with a heat spreader comprises affixing a generally planar heat spreader onto an upward facing surface of the inverted second package.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2010-01-15 | 2010-07-17 | 2011-01-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2014-01-15 | 2014-07-17 | 2015-01-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2018-01-15 | 2018-07-17 | 2019-01-16 | $7700.00 | Window Closed / Lapsed |