US7064426B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor multi-package module having wire bond interconnect between stacked packages
Assignee: Stats Chippac Pte Ltd
•
Filing: 2003-08-02
•
Granted: 2006-06-20
•
Expires: 2023-08-02
Abstract
Abstract A semiconductor multi-package module having stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
Inventors
- 👤 Marcos Karnezos
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:55
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/114; H10W74/117; H10W90/00; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/688; H10W72/00; H10W72/01; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W74/15; H10W90/20; H10W90/22; H10W90/288; H10W90/401; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/752; H10W90/754
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
141 words
A multi-package module comprising stacked lower and upper packages, the upper said package comprising an upper package die attached to and electrically interconnected to a die attach side of an upper package substrate and the lower said package comprising a lower package die attached to and electrically interconnected to a die attach side of a lower package substrate, each package substrate including at least one metal layer and at least one dielectric layer, and each package substrate being configured to provide electrical contact with said metal layer at the side of the substrate opposite the die attach side, the module further comprising second-level interconnection solder ball pads at the lower side of the lower package substrate, wherein the electrical interconnections between each said die and said substrate is protected, and wherein the upper and lower substrates are interconnected by wire bonding.
Claim 2
Dependent Claim
141 words
A multi-package module comprising stacked lower and upper packages, the upper said package comprising an upper package die attached to and electrically interconnected to a die attach side of an upper package substrate and the lower said package comprising a lower package die attached to and electrically interconnected to a die attach side of a lower package substrate, each package substrate including at least one metal layer and at least one dielectric layer, and each package substrate being configured to provide electrical contact with said metal layer at the side of the substrate opposite the die attach side, the module further comprising second-level interconnection solder ball pads at the lower side of the lower package substrate, wherein the electrical interconnections between each said die and said substrate is protected, and wherein the upper and lower substrates are interconnected by wire bonding.
Claim 3
Dependent Claim
32 words
The multipackage module of claim 1 wherein at least one said package has wire bond interconnect of the die with the substrate and wherein said wire bond interconnect is protected by encapsulation.
Claim 4
Dependent Claim
14 words
The multi package module of claim 2 wherein the said package is fully encapsulated.
Claim 5
Dependent Claim
28 words
The multipackage module of claim 2 wherein the said package is encapsulated only to an extent sufficient to protect the wire bonds between the die and the substrate.
Claim 6
Dependent Claim
18 words
The multipackage module of claim 1 wherein at least one said package is a ball grid array package.
Claim 7
Dependent Claim
18 words
The multipackage module of claim 1 wherein at least one said package is a land grid array package.
Claim 8
Dependent Claim
33 words
The multipackage module of claim 1 wherein at least one said package has flip chip interconnect of the die with the substrate, and wherein the flip chip interconnect is protected by an underfill.
Claim 9
Dependent Claim
12 words
The multipackage module of claim 1 , further comprising a heat spreader.
Claim 10
Dependent Claim
19 words
The multipackagc module of claim 1 , further comprising an electromagnetic shield for at least one of the packages.
Claim 11
Dependent Claim
11 words
The multipackage module of claim 1 comprising a third stacked package.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2009-06-19 | 2009-12-19 | 2010-06-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2013-06-19 | 2013-12-19 | 2014-06-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2017-06-19 | 2017-12-19 | 2018-06-20 | $7700.00 | Window Closed / Lapsed |