Stacked multi-chip modules and method of manufacturing

Claim 1

A circuit assembly, comprising: a first semiconductor die having substantially parallel opposing first and second surfaces and at least one electrical contact disposed at the first semiconductor die first surface; a second semiconductor die having substantially parallel opposing first and second surfaces and at least one electrical contact disposed at the second semiconductor die first surface, the second semiconductor die being positioned so that its first surface is substantially coplanar with the first semiconductor die first surface; a third semiconductor die having substantially parallel opposing first and second surfaces and at least one electrical contact disposed at the third semiconductor die first surface, the third semiconductor die being mounted on and supported at its second surface by the first and second semiconductor die first surfaces, the third semiconductor die being positioned so that the first and second semiconductor die electrical contacts are exposed; and a fine wire conductor having first-and second ends, the first end being connected to the third semiconductor die electrical contact.