Semiconductor device

Abstract

Abstract PURPOSE:To realize compact and high density packages by resin sealing process by a method wherein two step semiconductor pellets are laminated on a leadframe while respective pellets and leads of the leadframe are connected to one another by bonding wires. CONSTITUTION:Two step pellets 3, 4 are laminated on a tab of lead-frame 1 and then the second step pellet 4 is bonded onto the first step pellet 3 using a conductive resin bonding agent. At this time, if the conduction between the first step pellet 3 and the second step pellet 4 is not reuired, a non-conductive resin bonding agent may be applicable. Bonding pads 8 of the first pellet 3 and leads 7 are connected to one another by bonding wires 5 while the other bonding pads 9 of the second pellet 4 and the leads 7 are connected to one another by the other bonding wires 6. Finally, after finishing the wire bonding process, element assemblies are filled in a metallic mold so that transfer molding process may be performed using resin such as epoxy resin or silicon resin etc. to manufacture DIL plastic packages.

Inventors

• 👤 Katsuhiro Tabata
• 👤 田畑　克弘

Bibliographic Details