Patent US7064426B2 successfully refreshed from Google Patents.
US7064426B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor multi-package module having wire bond interconnect between stacked packages
Assignee: Stats Chippac Pte Ltd
•
Filing: 2003-08-02
•
Granted: 2006-06-20
•
Expires: 2023-08-02
Abstract
Abstract A semiconductor multi-package module having stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
Inventors
- 👤 Marcos Karnezos
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:12
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/114; H10W74/117; H10W90/00; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/688; H10W72/00; H10W72/01; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W74/15; H10W90/20; H10W90/22; H10W90/288; H10W90/401; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/752; H10W90/754
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
141 words
A multi-package module comprising stacked lower and upper packages, the upper said package comprising an upper package die attached to and electrically interconnected to a die attach side of an upper package substrate and the lower said package comprising a lower package die attached to and electrically interconnected to a die attach side of a lower package substrate, each package substrate including at least one metal layer and at least one dielectric layer, and each package substrate being configured to provide electrical contact with said metal layer at the side of the substrate opposite the die attach side, the module further comprising second-level interconnection solder ball pads at the lower side of the lower package substrate, wherein the electrical interconnections between each said die and said substrate is protected, and wherein the upper and lower substrates are interconnected by wire bonding.
Claim 2
Dependent Claim
141 words
A multi-package module comprising stacked lower and upper packages, the upper said package comprising an upper package die attached to and electrically interconnected to a die attach side of an upper package substrate and the lower said package comprising a lower package die attached to and electrically interconnected to a die attach side of a lower package substrate, each package substrate including at least one metal layer and at least one dielectric layer, and each package substrate being configured to provide electrical contact with said metal layer at the side of the substrate opposite the die attach side, the module further comprising second-level interconnection solder ball pads at the lower side of the lower package substrate, wherein the electrical interconnections between each said die and said substrate is protected, and wherein the upper and lower substrates are interconnected by wire bonding.
Claim 3
Dependent Claim
32 words
The multipackage module of claim 1 wherein at least one said package has wire bond interconnect of the die with the substrate and wherein said wire bond interconnect is protected by encapsulation.
Claim 4
Dependent Claim
14 words
The multi package module of claim 2 wherein the said package is fully encapsulated.
Claim 5
Dependent Claim
28 words
The multipackage module of claim 2 wherein the said package is encapsulated only to an extent sufficient to protect the wire bonds between the die and the substrate.
Claim 6
Dependent Claim
18 words
The multipackage module of claim 1 wherein at least one said package is a ball grid array package.
Claim 7
Dependent Claim
18 words
The multipackage module of claim 1 wherein at least one said package is a land grid array package.
Claim 8
Dependent Claim
33 words
The multipackage module of claim 1 wherein at least one said package has flip chip interconnect of the die with the substrate, and wherein the flip chip interconnect is protected by an underfill.
Claim 9
Dependent Claim
12 words
The multipackage module of claim 1 , further comprising a heat spreader.
Claim 10
Dependent Claim
19 words
The multipackagc module of claim 1 , further comprising an electromagnetic shield for at least one of the packages.
Claim 11
Dependent Claim
11 words
The multipackage module of claim 1 comprising a third stacked package.
References Cited (Backward Citations)
US5550711A
Cited
JPH05152505A
Cited
US5222014A
Cited
US5495398A
Cited
US5373189A
Cited
US5340771A
Cited
US5436203A
Cited
US6075289A
Cited
US20020125558A1
Cited
US5898219A
Cited
US6025648A
Cited
US6538319B2
Cited
US5903049A
Cited
US6034875A
Cited
US5977640A
Cited
US6333552B1
Cited
US6201302B1
Cited
US6414381B1
Cited
US6890798B2
Cited
US6201266B1
Cited
US6274930B1
Cited
US20020004258A1
Cited
US6611063B1
Cited
US6424050B1
Cited
US6472732B1
Cited
US6316838B1
Cited
US6376904B1
Cited
JP2001223326A
Cited
US6545365B2
Cited
US20020014689A1
Cited
US6621169B2
Cited
US6777799B2
Cited
US6492726B1
Cited
US6489676B2
Cited
US6340846B1
Cited
US6388313B1
Cited
US6787915B2
Cited
US20020125557A1
Cited
US20020130404A1
Cited
US6400007B1
Cited
US6593647B2
Cited
US6472741B1
Cited
US6787916B2
Cited
US6599779B2
Cited
US6737750B1
Cited
US6570249B1
Cited
US6762488B2
Cited
US20040016939A1
Cited
US20040061213A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2009-06-19 | 2009-12-19 | 2010-06-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2013-06-19 | 2013-12-19 | 2014-06-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2017-06-19 | 2017-12-19 | 2018-06-20 | $7700.00 | Window Closed / Lapsed |