US6890798B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stacked chip packaging
Assignee: Intel Corp
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Filing: 2001-01-23
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Granted: 2005-05-10
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Expires: 2021-01-23
Abstract
Abstract A multi-chip package and a method of manufacturing the same. The multi-chip package of the present invention has a plurality of shelves. A first semiconductor is electrically coupled to at least one of the package's shelves. A second semiconductor die is electrically coupled to at least one of the package's shelves, wherein the second semiconductor die is above said first semiconductor die.
Inventors
- 👤 John F. McMahon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:02
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/401; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/90; H10W72/951; H10W90/20; H10W90/291; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/732; H10W90/751; H10W90/752; H10W90/754
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
103 words
A method of constructing a multi-chip package, comprising: attaching a semiconductor die to a slug; attaching the slug to a base of a package; electrically connecting said semiconductor die to at least one of a plurality of shelves of the package; electrically connecting a flip-chip to a substrate; attaching said substrate to one of said plurality of shelves; and disposing a seal between a base of said substrate and the one of said plurality of shelves to which said substrate is attached, wherein a cavity is formed between said substrate and said base of said package, the cavity comprising only said semiconductor die.
Claim 2
Independent Claim
103 words
A method of constructing a multi-chip package, comprising: attaching a semiconductor die to a slug; attaching the slug to a base of a package; electrically connecting said semiconductor die to at least one of a plurality of shelves of the package; electrically connecting a flip-chip to a substrate; attaching said substrate to one of said plurality of shelves; and disposing a seal between a base of said substrate and the one of said plurality of shelves to which said substrate is attached, wherein a cavity is formed between said substrate and said base of said package, the cavity comprising only said semiconductor die.
Claim 3
Dependent Claim
21 words
The method of claim 1 , further comprising electrically connecting said substrate to at least one of said plurality of shelves.
Claim 4
Dependent Claim
40 words
The method of claim 2 , wherein electrically connecting said substrate to at least one of said plurality of shelves comprises electrically connecting said substrate to at least one of said plurality of shelves with at least one bond wire.
Claim 5
Dependent Claim
24 words
The method of claim 1 , wherein attaching said substrate to one of said plurality of shelves provides a lid above said semiconductor die.
Claim 6
Dependent Claim
27 words
The method of claim 1 , further comprising electrically testing said electrically connected flip-chip before attaching of said substrate to said one of said plurality of shelves.
Claim 7
Dependent Claim
25 words
The method of claim 1 , wherein electrically connecting said flip-chip to said substrate comprises electrically connecting said flip-chip to said substrate with solder balls.
Claim 8
Dependent Claim
14 words
The method of claim 1 , further comprising covering said flip-chip with an encapsulant.
Claim 9
Dependent Claim
38 words
The method of claim 1 , wherein electrically connecting said semiconductor die to said at least one of a plurality of shelves comprises electrically connecting a CPU chip to said at least one of said plurality of shelves.
Claim 10
Dependent Claim
24 words
The method of claim 1 , wherein electrically connecting said flip-chip to said substrate comprises electrically connecting a memory cache flip-chip to said substrate.
Claim 11
Dependent Claim
43 words
The method of claim 1 , wherein electrically connecting said semiconductor die to at least one of said plurality of shelves comprises electrically connecting said semiconductor die to said at least one of a plurality of shelves with at least one bond wire.
Claim 12
Dependent Claim
23 words
The method of claim 1 wherein attaching said semiconductor die to a slug comprises attaching said semiconductor die to a slug comprising copper.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-05-09 | 2008-11-08 | 2009-05-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-05-09 | 2012-11-08 | 2013-05-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-05-09 | 2016-11-08 | 2017-05-10 | $7700.00 | Window Closed / Lapsed |