US5527740A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities
Assignee: Mitsui High Tec Inc
•
Filing: 1994-06-28
•
Granted: 1996-06-18
•
Expires: 2014-06-28
Abstract
Abstract A method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto each side of the die pad while the leadframe is supported with support blocks having cavities that accept the integrated circuit dies and that support each lead finger and that provide clearance for stitch bonds of the previously formed wire bonds. Thereafter, a one step plastic mold is formed around each assembly comprising the dual integrated circuit dies, the die pads, and the wire bonds.
Inventors
- 👤 Suresh V. Golwalkar
- 👤 Richard Foehringer
- 👤 Michael Wentling
- 👤 Ryo Takatsuki
- 👤 Shigeo Kawashima
- 👤 Keiichi Tsujimoto
- 👤 Nobuaki Sato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 16:42
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/811; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/0711; H10W72/07178; H10W72/073; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; H10W99/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
199 words
A method for constructing a dual-sided chip package, comprising the steps of: forming a leadframe having at least one die pad and a set of lead fingers corresponding to the die pad, the leadframe having a first side and a second side; disposing a side one integrated circuit die onto the first side of the die pad; disposing a side two integrated circuit die onto the second side of the die pad while supporting the leadframe with a support block having a cavity that accepts the side one integrated circuit die; wire bonding the side one integrated circuit die to the first side of the corresponding lead fingers while supporting the leadframe with a support block having a cavity that accepts the side two integrated circuit die and that supports an end of each lead finger; wire bonding the side two integrated circuit die to the second side of the corresponding lead fingers while supporting the leadframe with a support block having a cavity that accepts the side one integrated circuit die and corresponding wire bonds and that supports each lead finger while providing clearance for a stitch bond of each wire bond on side one of the leadflame.
Claim 2
Independent Claim
199 words
A method for constructing a dual-sided chip package, comprising the steps of: forming a leadframe having at least one die pad and a set of lead fingers corresponding to the die pad, the leadframe having a first side and a second side; disposing a side one integrated circuit die onto the first side of the die pad; disposing a side two integrated circuit die onto the second side of the die pad while supporting the leadframe with a support block having a cavity that accepts the side one integrated circuit die; wire bonding the side one integrated circuit die to the first side of the corresponding lead fingers while supporting the leadframe with a support block having a cavity that accepts the side two integrated circuit die and that supports an end of each lead finger; wire bonding the side two integrated circuit die to the second side of the corresponding lead fingers while supporting the leadframe with a support block having a cavity that accepts the side one integrated circuit die and corresponding wire bonds and that supports each lead finger while providing clearance for a stitch bond of each wire bond on side one of the leadflame.
Claim 3
Dependent Claim
76 words
The method of claim 1, wherein the step of forming a leadframe having at least one die pad and a set of lead fingers corresponding to the die pad comprises the step of forming the leadframe having the die pad and the set of lead fingers corresponding to the die pad wherein the die pad includes a set of extension areas located peripherally beyond die attach areas for the side one and two integrated circuit dies.
Claim 4
Dependent Claim
137 words
The method of claim 2, wherein the step of wire bonding the side one integrated circuit die to the first side the corresponding lead fingers while supporting the leadframe with a support block having a cavity that accepts the side two integrated circuit die and that supports an end of each lead finger comprises the steps of: providing the support block having the cavity that accepts the side two integrated circuit die and that supports an end of each lead finger and that holds the leadframe with a vacuum force; placing the leadframe on the support block having the cavity that accepts the side two integrated circuit die; clamping the leadframe onto the support block with at least one clamping block; wire bonding the side one integrated circuit die to the first side the corresponding lead fingers.
Claim 5
Dependent Claim
37 words
The method of claim 3, wherein the step of clamping the leadframe onto the support block with at least one clamping block further comprising the step of stretching the die pad to reduce vibration during write bonding.
Claim 6
Dependent Claim
168 words
The method of claim 2, wherein the step of wire bonding the side two integrated circuit die to the second side the corresponding lead fingers while supporting the leadframe with a support block having a cavity that accepts the side one integrated circuit die and corresponding wire bonds and that supports each lead finger while providing clearance for a stitch bond of each wire bond on side one of the leadframe comprises the steps of: providing the support block having the cavity that accepts the side two integrated circuit die and corresponding wire bonds and that supports each lead finger while providing clearance for a stitch bond of each wire bond on side one of the leadframe; placing the leadframe on the support block having the cavity that accepts the side two integrated circuit die and corresponding wire bonds; clamping the leadframe onto the support block with at least one clamping block; wire bonding the side two integrated circuit die to the second side the corresponding lead fingers.
Claim 7
Dependent Claim
37 words
The method of claim 5, wherein the step of clamping the leadframe onto the support block with at least one clamping block further comprises the step of stretching the die pad to reduce vibration during wire bonding.
Claim 8
Dependent Claim
76 words
The method of claim 1, wherein the step of forming a leadframe having at least one die pad and a set of lead fingers corresponding to the die pad further comprises the step of forming a set of guide pin holes in the die pad such that the guide pin holes are located on peripheral areas on opposite ends of the die pad beyond die attach areas for the side one and two integrated circuit dies.
Claim 9
Dependent Claim
161 words
The method of claim 7, wherein the step of wire bonding the side one integrated circuit die to the first side the corresponding lead fingers while supporting the leadframe with a support block having a cavity that accepts the side two integrated circuit die and that supports an end of each lead finger comprises the steps of: providing the support block having the cavity that accepts the side two integrated circuit die and that supports an end of each lead finger and that includes a guide pin corresponding to each guide pin hole of the die pad; placing the leadflame on the support block having the cavity that accepts the side two integrated circuit die such that the guide pin holes accept the guide pins; clamping the leadframe onto the support block with at least one clamping block having holes for accepting the guide pins; wire bonding the side one integrated circuit die to the first side the corresponding lead fingers.
Claim 10
Dependent Claim
48 words
The method of claim 8, wherein the step of clamping the leadframe onto the support block with at least one clamping block having holes for accepting the guide pins further comprising the step of stretching the die pad between the guide pins to reduce vibration during write bonding.
Claim 11
Dependent Claim
201 words
The method of claim 7, wherein the step of wire bonding the side two integrated circuit die to the second side the corresponding lead fingers while supporting the leadframe with a support block having a cavity that accepts the side one integrated circuit die and corresponding wire bonds and that supports each lead finger while providing clearance for a stitch bond of each wire bond on side one of the leadframe comprises the steps of: providing the support block having the cavity that accepts the side two integrated circuit die and corresponding wire bonds and that supports each lead finger while providing clearance for a stitch bond of each wire bond on side one of the leadframe and that includes a guide pin corresponding to each guide pin hole of the die pad; placing the leadframe on the support block having the cavity that accepts the side two integrated circuit die and corresponding wire bonds such that the guide pin holes accept the guide pins; clamping the leadframe onto the support block with at least one clamping block having holes for accepting the guide pins; wire bonding the side two integrated circuit die to the second side the corresponding lead fingers.
Claim 12
Dependent Claim
48 words
The method of claim 10, wherein the step of clamping the leadframe onto the support block with at least one clamping block having holes for accepting the guide pins further comprises the step of stretching the die pad between the guide pins to reduce vibration during wire bonding.
Claim 13
Independent Claim
207 words
A method for constructing a dual-sided chip package, comprising the steps of: forming a leadframe having at least one die pad and a set of lead fingers corresponding to the die pad, the leadframe having a first side and a second side; disposing a side one integrated circuit die onto the first side of the die pad; wire bonding the side one integrated circuit die to the first side of the corresponding lead fingers while supporting the leadframe with a first support block; disposing a side two integrated circuit die onto the second side of the die pad while supporting the leadframe with a support block having a cavity that accepts the side one integrated circuit die and corresponding wire bonds and that supports each lead finger while providing clearance for a stitch bond of each wire bond on side one of the leadframe; wire bonding the side two integrated circuit die to the second side of the corresponding lead fingers while supporting the leadframe with the support block having the cavity that accepts the side one integrated circuit die and corresponding wire bonds and that supports each lead finger while providing clearance for the stitch bond of each wire bond on side one of the leadframe.
Claim 14
Independent Claim
207 words
A method for constructing a dual-sided chip package, comprising the steps of: forming a leadframe having at least one die pad and a set of lead fingers corresponding to the die pad, the leadframe having a first side and a second side; disposing a side one integrated circuit die onto the first side of the die pad; wire bonding the side one integrated circuit die to the first side of the corresponding lead fingers while supporting the leadframe with a first support block; disposing a side two integrated circuit die onto the second side of the die pad while supporting the leadframe with a support block having a cavity that accepts the side one integrated circuit die and corresponding wire bonds and that supports each lead finger while providing clearance for a stitch bond of each wire bond on side one of the leadframe; wire bonding the side two integrated circuit die to the second side of the corresponding lead fingers while supporting the leadframe with the support block having the cavity that accepts the side one integrated circuit die and corresponding wire bonds and that supports each lead finger while providing clearance for the stitch bond of each wire bond on side one of the leadframe.
Claim 15
Dependent Claim
36 words
The method of claim 12, wherein the step of disposing a side one integrated circuit die onto the first side of the die pad includes the step of supporting the leadframe with the first support block.
Claim 16
Dependent Claim
71 words
The method of claim 12, wherein the step of wire bonding the side one integrated circuit die to the first side the corresponding lead fingers while supporting the leadframe with a first support block comprises the step of wire bonding the side one integrated circuit die to the first side the corresponding lead fingers while supporting the leadframe with a support block having a cavity and that supports the lead fingers.
Claim 17
Dependent Claim
73 words
The method of claim 12, wherein the step of wire bonding the side one integrated circuit die to the first side the corresponding lead fingers while supporting the leadframe with a first support block comprises the step of wire bonding the side one integrated circuit die to the first side the corresponding lead fingers while supporting the leadframe with a flat support block that supports the die pad and the corresponding lead fingers.
Claim 18
Dependent Claim
74 words
The method of claim 12, wherein the step of forming a leadframe having at least one die pad and a set of lead fingers corresponding to the die pad comprises the step of forming the leadframe having the die pad and the lead fingers corresponding to the die pad wherein the die pad includes a set of extension areas located peripherally beyond die attach areas for the side one and two integrated circuit dies.
Claim 19
Dependent Claim
101 words
The method of claim 16, wherein the step of wire bonding the side one integrated circuit die to the first side the corresponding lead fingers while supporting the leadframe with a first support block comprises the steps of: providing the first support block having a cavity that supports an end of each lead finger; placing the leadframe on the support block having the cavity that supports the end of each lead finger; clamping the leadframe onto the support block with at least one clamping block; wire bonding the side one integrated circuit die to the first side the corresponding lead fingers.
Claim 20
Dependent Claim
37 words
The method of claim 17, wherein the step of clamping the leadframe onto the support block with at least one clamping block further comprising the step of stretching the die pad to reduce vibration during write bonding.
Claim 21
Dependent Claim
168 words
The method of claim 16, wherein the step of wire bonding the side two integrated circuit die to the second side the corresponding lead fingers while supporting the leadframe with the support block having the cavity that accepts the side one integrated circuit die and corresponding wire bonds and that supports each lead finger while providing clearance for the stitch bond of each wire bond on side one of the leadframe comprises the steps of: providing the support block having the cavity that accepts the side one integrated circuit die and corresponding wire bonds and that supports each lead finger while providing clearance for the stitch bond of each wire bond on side one of the leadframe; placing the leadframe on the support block having the cavity that accepts the side one integrated circuit die and corresponding wire bonds; clamping the leadframe onto the support block with at least one clamping blocks; wire bonding the side two integrated circuit die to the second side the corresponding lead fingers.
Claim 22
Dependent Claim
37 words
The method of claim 19, wherein the step of clamping the leadframe onto the support block with at least one clamping block further comprises the step of stretching the die pad to reduce vibration during write bonding.
Claim 23
Dependent Claim
76 words
The method of claim 12, wherein the step of forming a leadframe having at least one die pad and a set of lead fingers corresponding to the die pad further comprises the step of forming a set of guide pin holes in the die pad such that the guide pin holes are located on peripheral areas on opposite ends of the die pad beyond die attach areas for the side one and two integrated circuit dies.
Claim 24
Dependent Claim
134 words
The method of claim 21, wherein the step of wire bonding the side one integrated circuit die to the first side the corresponding lead fingers while supporting the leadframe with a first support block comprises the steps of: providing the first support block having a cavity that supports an end of each lead finger and that includes a guide pin corresponding to each guide pin hole of the die pad; placing the leadframe on the support block having the cavity that supports the end of each lead finger such that the guide pin holes accept the guide pins; clamping the leadframe onto the support block with at least one clamping block having holes for accepting the guide pins; wire bonding the side one integrated circuit die to the first side the corresponding lead fingers.
Claim 25
Dependent Claim
48 words
The method of claim 22, wherein the step of clamping the leadframe onto the support block with at least one clamping block having holes for accepting the guide pins further comprising the step of stretching the die pad between the guide pins to reduce vibration during write bonding.
Claim 26
Dependent Claim
201 words
The method of claim 21, wherein the step of wire bonding the side two integrated circuit die to the second side the corresponding lead fingers while supporting the leadframe with the support block having the cavity that accepts the side one integrated circuit die and corresponding wire bonds and that supports each lead finger while providing clearance for the stitch bond of each wire bond on side one of the leadframe comprises the steps of: providing the support block having the cavity that accepts the side one integrated circuit die and corresponding wire bonds and that supports each lead finger while providing clearance for the stitch bond of each wire bond on side one of the leadframe and that includes a guide pin corresponding to each guide pin hole of the die pad; placing the leadframe on the support block having the cavity that accepts the side one integrated circuit die and corresponding wire bonds such that the guide pin holes accept the guide pins; clamping the leadframe onto the support block with at least one clamping block having holes for accepting the guide pins; wire bonding the side two integrated circuit die to the second side the corresponding lead fingers.
Claim 27
Dependent Claim
48 words
The method of claim 24, wherein the step of clamping the leadframe onto the support block with at least one clamping block having holes for accepting the guide pins further comprises the step of stretching the die pad between the guide pins to reduce vibration during write bonding.
References Cited (Backward Citations)
US3533896A
Cited
US4224101A
Cited
JPS58130553A
Cited
JPS58155749A
Cited
US4725561A
Cited
JPS6292456A
Cited
US5082802A
Cited
US4904617A
Cited
US5034350A
Cited
US4929300A
Cited
US4984358A
Cited
US5024970A
Cited
US5227995A
Cited
US5017512A
Cited
US5273938A
Cited
US5012323A
Cited
JPH03277927A
Cited
US5227338A
Cited
US5147815A
Cited
US5202288A
Cited
JPH05121462A
Cited
JPH05343608A
Cited
US5366933A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-06-18 | 1999-12-18 | 2000-06-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-06-18 | 2003-12-18 | 2004-06-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-06-18 | 2007-12-18 | 2008-06-18 | $7700.00 | Window Closed / Lapsed |