US5202288A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing an electronic circuit component incorporating a heat sink
Assignee: Robert Bosch GmbH
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Filing: 1992-08-13
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Granted: 1993-04-13
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Expires: 2012-08-13
Abstract
Abstract A standard lead-frame has an aperture pierced to produce an opening sufficiently large to make room therein for the mounting of a semiconductor circuit chip. A heat sink for the semiconductor circuit chip is fastened into position in or just below the opening. The semiconductor circuit chip is then affixed directly to the heat sink. After wires have been bonded to connect contact areas of the chip to respective parts of the lead frame the unit is encapsulate such a fashion that a major surface of the heat sink protrudes from the encapsulation.
Inventors
- 👤 Anton Doering
- 👤 Ludger Olbrich
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 19:08
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/02; H10W70/023; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
233 words
A method of producing an electric circuit component containing at least one semiconductor chip, incorporating a heat conducting body in contact with said at least one chip and mounted on a single lead frame, said method comprising the steps of: piercing an opening (20) in a mounting surface member (13) of said single lead frame (10), which member is connected to the remainder of said lead frame only by several elongate support strips (14) of said lead frame (10), said opening being sufficient to surround an adjacent mounting surface (25) of a heat conducting body (21) and said opening being also sufficient to leave only peripheral elongate portions (13') of said lead frame mounting surface member (13) which peripheral elongate portions define said opening (20) and are attached to said lead frame by said elongate support strips (14); inserting at least said mounting surface (25) of said heat conducting body (21) in said opening (20) and attaching said heat conducting body for support thereof, to said peripheral elongate portions of said mounting surface member (13) defining said opening (20) which are attached to said lead frame (10) by said elongate support strips (14); affixing said at least one chip on said mounting surface (25) of said heat conducting body (21), and thereafter connecting contact areas of said at least one chip to respective tongues (41) of said same lead frame by bonding wires.
Claim 2
Independent Claim
233 words
A method of producing an electric circuit component containing at least one semiconductor chip, incorporating a heat conducting body in contact with said at least one chip and mounted on a single lead frame, said method comprising the steps of: piercing an opening (20) in a mounting surface member (13) of said single lead frame (10), which member is connected to the remainder of said lead frame only by several elongate support strips (14) of said lead frame (10), said opening being sufficient to surround an adjacent mounting surface (25) of a heat conducting body (21) and said opening being also sufficient to leave only peripheral elongate portions (13') of said lead frame mounting surface member (13) which peripheral elongate portions define said opening (20) and are attached to said lead frame by said elongate support strips (14); inserting at least said mounting surface (25) of said heat conducting body (21) in said opening (20) and attaching said heat conducting body for support thereof, to said peripheral elongate portions of said mounting surface member (13) defining said opening (20) which are attached to said lead frame (10) by said elongate support strips (14); affixing said at least one chip on said mounting surface (25) of said heat conducting body (21), and thereafter connecting contact areas of said at least one chip to respective tongues (41) of said same lead frame by bonding wires.
Claim 3
Dependent Claim
29 words
The method of claim 1, wherein said piercing step performed by a process selected from the group consisting of stamping out, etching through, or eroding through the lead frame.
Claim 4
Dependent Claim
70 words
The method of claim 1, wherein said opening (20) and said heat conducting body (21) are so dimensioned that the contour of the heat conducting body lines up precisely in said opening (20) defined by said peripheral elongate portions (13') which remain of said mounting surface member (13) after said piercing step, and wherein the heat conducting body has a thickness substantially greater than that of the lead frame (10).
Claim 5
Dependent Claim
76 words
The method of claim 1, wherein said peripheral elongate portions (13') of said lead frame mounting surface member (13) remaining after the piercing step are in the form of a frame of rod-like strips (13') and wherein the step of attaching said heat conducting body (21) to said remaining peripheral elongate portions (13') of said mounting surface member (13) is performed by a process selected from the group consisting of squeezing, cold-welding, adhesive bonding and soldering.
Claim 6
Dependent Claim
66 words
The method of claim 3, wherein an additional step is performed by applying at least one metallic layer, consisting essentially of a metal selected from the group consisting of nickel, silver and gold, by deposition on said mounting surface (25) of said heat conducting body (21) prior to the step of affixing said at least one chip on said mounting surface of said heat conducting body.
Claim 7
Dependent Claim
36 words
The method of claim 5, wherein said step of providing said at least one metallic layer is performed by applying at least one additional of said metallic layers on the outside of a first metallic layer.
Claim 8
Dependent Claim
37 words
The method of claim 1, wherein the step of affixing said at least one chip on said heat conducting body is performed by a process selected from the group consisting of adhesive bonding, soldering and eutectic bonding.
Claim 9
Dependent Claim
27 words
The method of claim 1 wherein after the connecting of said bonding wires a step of coating said at least one chip with an electrically non-conducting material.
Claim 10
Dependent Claim
63 words
The method of claim 8, wherein said coating of said at least one chip is performed by pressing on a synthetic resin coating so that said at least one chip and at least said peripheral portions (13') of said mounting surface member (13) of said lead frame, said elongate support strips (14) of said lead frame and said bonding wires are embedded therein.
Claim 11
Dependent Claim
24 words
The method of claim 1, wherein said head conducting body is composed a substance selected from the group consisting of copper alloys and aluminum.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-04-12 | 1996-10-12 | 1997-04-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-04-12 | 2000-10-12 | 2001-04-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-04-12 | 2004-10-12 | 2005-04-13 | $7700.00 | Window Closed / Lapsed |