US6545365B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin-sealed chip stack type semiconductor device
Assignee: Renesas Electronics Corp
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Filing: 2001-02-13
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Granted: 2003-04-08
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Expires: 2021-02-13
Abstract
Abstract A resin-sealed chip stack type semiconductor device comprises a substrate placed on many balls, a bottom chip to which wires are connected, a top chip to which wires are connected and mounted above the bottom chip, a non-conductive bonding layer which functions to bond and fix the two chips to each other, and a sealing resin which covers and protects all the components mounted on the substrate. The non-conductive bonding layer is provided by die bonding in such a manner that is at least covers the portion of the bottom chip where the corresponding wires are connected and does not allow generation of a gap between the two chips.
Inventors
- 👤 Takashi Kondo
- 👤 Koji Bando
- 👤 Jun Shibata
- 👤 Kazuko Narutaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:19
CPC Classifications
H; H10; H10W; H10W90/00; H10W70/00; H10W70/60; H10W74/00; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/20; H10W90/231; H10W90/291; H10W90/701; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
99 words
A resin-sealed chip stack type semiconductor device which is obtained by placing a substrate on balls, mounting a plurality of stacked chips on said substrate, covering the whole with a sealing resin, wherein a bonding layer, that covers at least around a contact part of a wire connected to a lower chip and does not allow a gap between the lower chip and an upper chip, is coated, and providing an insulating film between said bonding layer and said upper chip, said insulating film extends away from said upper chip and covers the wire connected to the lower chip.
Claim 2
Dependent Claim
99 words
A resin-sealed chip stack type semiconductor device which is obtained by placing a substrate on balls, mounting a plurality of stacked chips on said substrate, covering the whole with a sealing resin, wherein a bonding layer, that covers at least around a contact part of a wire connected to a lower chip and does not allow a gap between the lower chip and an upper chip, is coated, and providing an insulating film between said bonding layer and said upper chip, said insulating film extends away from said upper chip and covers the wire connected to the lower chip.
Claim 3
Dependent Claim
125 words
A resin-sealed chip stack type semiconductor device comprising: balls; a substrate placed on said balls, a bottom chip to which wires are connected; a top chip to which wires are connected and mounted above said bottom chip; a non-conductive bonding layer which functions to bond said two chips to each other; an insulating film between said bonding layer and said top chip, said insulating film extends away from said top chip and covers the wire connected to the bottom chip; and a sealing resin which covers and protects components mounted on said substrate, wherein said non-conductive bonding layer at least covers the portion of said bottom chip where the corresponding wires are connected and does not allow generation of a gap between said two chips.
Claim 4
Dependent Claim
125 words
A resin-sealed chip stack type semiconductor device comprising: balls; a substrate placed on said balls, a bottom chip to which wires are connected; a top chip to which wires are connected and mounted above said bottom chip; a non-conductive bonding layer which functions to bond said two chips to each other; an insulating film between said bonding layer and said top chip, said insulating film extends away from said top chip and covers the wire connected to the bottom chip; and a sealing resin which covers and protects components mounted on said substrate, wherein said non-conductive bonding layer at least covers the portion of said bottom chip where the corresponding wires are connected and does not allow generation of a gap between said two chips.
Claim 5
Dependent Claim
30 words
A resin-sealed chip stack type semiconductor device according to claim 1 , wherein a size of the upper chip and a size of the lower chip are approximately the same.
Claim 6
Dependent Claim
30 words
A resin-sealed chip stack type semiconductor device according to claim 2 , wherein a size of the upper chip and a size of the lower chip are approximately the same.
References Cited (Backward Citations)
US4947234A
Cited
JPH05226565A
Cited
JPH08107178A
Cited
JPH08288455A
Cited
US6133637A
Cited
US6157074A
Cited
JPH11251512A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-04-07 | 2006-10-07 | 2007-04-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-04-07 | 2010-10-07 | 2011-04-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-04-07 | 2014-10-07 | 2015-04-08 | $7700.00 | Window Closed / Lapsed |