US6157074A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead frame adapted for variable sized devices, semiconductor package with such lead frame and method for using same
Assignee: MagnaChip Semiconductor Ltd
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Filing: 1998-06-15
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Granted: 2000-12-05
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Expires: 2018-06-15
Abstract
Abstract A lead frame and a semiconductor package using the lead frame are disclosed in which one lead frame can be used to perform the package process regardless of the size of a chip. The size of the chip can be varied within the limit that the number of bonding pads of the chip does not exceed the number of corresponding inner leads. The lead frame includes a plurality of tie bars extended toward the center from edges of a lead frame body, a die pad supported by the tie bars on which a semiconductor chip can be bonded and a plurality of inner leads disposed around the die pad. The tie bars, the die pad and the inner leads are preferably in the same plane. The inner leads are electrically coupled with bonding pads of the chip. A plurality of outer leads respectively coupled with the inner leads and exposed outside a molded package.
Inventors
- 👤 Hyeon Il Lee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:12
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/421; H10W70/435; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
144 words
A lead frame, comprising: a plurality of tie bars extending toward a center from edges of a lead frame body; a die pad supported by the tie bars; a plurality of inner leads disposed around the die pad, wherein the die pad and the inner leads are in a single plane; an insulating member on the inner leads, wherein the insulating member includes a bond layer attached to inner leads, and an insulating film attached on the bond layer; a bonding member on the die pad, wherein a first height from a bottom surface of the die pad to a top surface of the bonding member is substantially equal to a second height from a bottom surface of each of the inner leads to a top surface of a corresponding insulating member; and a plurality of outer leads respectively connected with the inner leads.
Claim 2
Dependent Claim
144 words
A lead frame, comprising: a plurality of tie bars extending toward a center from edges of a lead frame body; a die pad supported by the tie bars; a plurality of inner leads disposed around the die pad, wherein the die pad and the inner leads are in a single plane; an insulating member on the inner leads, wherein the insulating member includes a bond layer attached to inner leads, and an insulating film attached on the bond layer; a bonding member on the die pad, wherein a first height from a bottom surface of the die pad to a top surface of the bonding member is substantially equal to a second height from a bottom surface of each of the inner leads to a top surface of a corresponding insulating member; and a plurality of outer leads respectively connected with the inner leads.
Claim 3
Dependent Claim
24 words
The lead frame of claim 1, wherein the plurality of inner leads are disposed at prescribed intervals surrounding four sides of the die pad.
Claim 4
Dependent Claim
51 words
The lead frame of claim 1, further comprising a dam bar formed between the inner leads and the outer leads, wherein front ends of the inner leads are coined to form a flattened step, and wherein a coined surface of the respective inner leads is plated with a metal thin film.
Claim 5
Dependent Claim
42 words
The lead frame of claim 1, wherein the inner leads are down-set to be disposed lower than the outer leads, and wherein the die pad is down-set so that the inner leads and the die pad are disposed on the same plane.
Claim 6
Dependent Claim
108 words
The lead frame of claim 1, further comprising: a semiconductor chip bonded on the die pad, wherein the inner leads are electrically coupled to bonding pads of the chip by wires, wherein the lead frame is adapted to mount the chip being each of a first chip type mounted on the bonding member that does not overlap the inner leads and a second chip type mounted on the bonding member and the insulating members that does overlap the inner leads; and a molded body packaging the die pad, the chip, the wires, the inner leads and the outer leads, wherein the outer leads extend outside the molded body.
Claim 7
Dependent Claim
146 words
A semiconductor package, comprising: a plurality of outer leads; a plurality of inner leads internally extended from the outer leads; a die pad disposed within a prescribed area defined by front ends of the inner leads, wherein the inner leads and the die pad are in a plane; a semiconductor chip bonded to the die pad, wherein the chip has a plurality of bonding pads; connecting members that electrically couple the bonding pads of the chip with the inner leads; and a mold body that packages the die pad, the chip, the inner leads, the connecting members and the outer leads, wherein the outer leads extend outside the mold body, wherein the inner leads are down-set to be disposed lower than the outer leads, and wherein the die pad is down-set so that the inner leads and the die pad are disposed in the same plane.
Claim 8
Dependent Claim
146 words
A semiconductor package, comprising: a plurality of outer leads; a plurality of inner leads internally extended from the outer leads; a die pad disposed within a prescribed area defined by front ends of the inner leads, wherein the inner leads and the die pad are in a plane; a semiconductor chip bonded to the die pad, wherein the chip has a plurality of bonding pads; connecting members that electrically couple the bonding pads of the chip with the inner leads; and a mold body that packages the die pad, the chip, the inner leads, the connecting members and the outer leads, wherein the outer leads extend outside the mold body, wherein the inner leads are down-set to be disposed lower than the outer leads, and wherein the die pad is down-set so that the inner leads and the die pad are disposed in the same plane.
Claim 9
Dependent Claim
104 words
The semiconductor package of claim 6, wherein semiconductor package mounts the chip being selectively both of a first chip type bonded on the die pad that is smaller than the prescribed area defined by front ends of the inner leads and a second chip type bonded on the die pad and the inner leads that is larger than the prescribed area defined by the front ends of the inner leads so that chip edges overlap the inner leads, wherein the first chip type is mounted on the die pad and the second chip type is mounted on the die pad and the inner leads.
Claim 10
Dependent Claim
37 words
The semiconductor package of claim 6, wherein the semiconductor chip bonded on the die pad is larger than the prescribed area defined by the front ends of the inner leads so that edges overlap the inner leads.
Claim 11
Dependent Claim
32 words
The semiconductor package as claimed in claim 8, wherein on a coined surface of the inner leads, an insulating member is attached to prevent the chip from electrically contacting the inner leads.
Claim 12
Dependent Claim
41 words
The semiconductor package of claim 9, further comprising a bonding member that bonds the chip to the die pad, wherein the top surface of the insulating member is disposed on the same plane as the top surface of the bonding member.
Claim 13
Dependent Claim
12 words
The semiconductor package of claim 10, wherein the bonding member is Agepoxy.
Claim 14
Dependent Claim
37 words
The semiconductor package of claim 6, wherein front portions of the inner leads are coined to form a flattened step, and wherein a coined surface of the respective inner leads is plated with a metal thin film.
Claim 15
Dependent Claim
14 words
The semiconductor package of claim 6, wherein the die pad has a round shape.
Claim 16
Dependent Claim
40 words
The semiconductor package of claim 6, wherein a plurality of grooves are formed at the bottom of the die pad to increase a contact area between an epoxy molding compound for use in the mold body and the die pad.
Claim 17
Dependent Claim
72 words
The semiconductor package of claim 9, further comprising: an insulating member on each of the inner leads; and a bonding member on the die pad, wherein a first height from a bottom surface of the die pad to a top surface of the bonding member is substantially equal to a second height from a bottom surface of said each of the inner leads to a top surface of a corresponding insulating member.
Claim 18
Dependent Claim
165 words
A lead frame, comprising: a plurality of tie bars extending toward a center from edges of a lead frame body; a die pad supported by the tie bars; a plurality of inner leads disposed around the die pad, wherein the die pad and the inner leads are in a single plane, wherein front ends of the inner leads are coined to form a flattened step, and wherein a coined surface of the respective inner leads is plated with a thin metal; an insulated member on the inner leads; a bonding member on the die pad, wherein a first height from a bottom surface of the die pad to a top surface of the bonding member is substantially equal to a second height from a bottom surface of each of the inner leads to a top surface of a corresponding insulating member; a plurality of outer leads respectively connected with the inner leads; and a dam bar formed between the inner leads and the outer leads.
Claim 19
Dependent Claim
165 words
A lead frame, comprising: a plurality of tie bars extending toward a center from edges of a lead frame body; a die pad supported by the tie bars; a plurality of inner leads disposed around the die pad, wherein the die pad and the inner leads are in a single plane, wherein front ends of the inner leads are coined to form a flattened step, and wherein a coined surface of the respective inner leads is plated with a thin metal; an insulated member on the inner leads; a bonding member on the die pad, wherein a first height from a bottom surface of the die pad to a top surface of the bonding member is substantially equal to a second height from a bottom surface of each of the inner leads to a top surface of a corresponding insulating member; a plurality of outer leads respectively connected with the inner leads; and a dam bar formed between the inner leads and the outer leads.
Claim 20
Dependent Claim
159 words
A lead frame, comprising: a plurality of tie bars extending toward a center from edges of a lead frame body; a die pad supported by the tie bars; a plurality of inner leads disposed around the die pad, wherein the die pad and the inner leads are in a single plane; an insulating member on the inner leads; a bonding member on the die pad, wherein a first height from a bottom surface of the die pad to a top surface of the bonding member is substantially equal to a second height from a bottom surface of each of the inner leads to a top surface of a corresponding insulating member; and a plurality of outer leads receptively connected with the inner leads, wherein the inner leads are down-set to be disposed lower than the outer leads, and wherein the die pad is down-set so that the inner leads and the die pad are disposed on the same plane.
Claim 21
Dependent Claim
159 words
A lead frame, comprising: a plurality of tie bars extending toward a center from edges of a lead frame body; a die pad supported by the tie bars; a plurality of inner leads disposed around the die pad, wherein the die pad and the inner leads are in a single plane; an insulating member on the inner leads; a bonding member on the die pad, wherein a first height from a bottom surface of the die pad to a top surface of the bonding member is substantially equal to a second height from a bottom surface of each of the inner leads to a top surface of a corresponding insulating member; and a plurality of outer leads receptively connected with the inner leads, wherein the inner leads are down-set to be disposed lower than the outer leads, and wherein the die pad is down-set so that the inner leads and the die pad are disposed on the same plane.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-12-05 | 2004-06-05 | 2004-12-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-12-05 | 2008-06-05 | 2008-12-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-12-05 | 2012-06-05 | 2012-12-05 | $7700.00 | Window Closed / Lapsed |