US5834831A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device with improved heat dissipation efficiency
Assignee: Socionext Inc
•
Filing: 1996-03-01
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Granted: 1998-11-10
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Expires: 2016-03-01
Abstract
Abstract A thin semiconductor device in which a strength of a lead frame and a heat dissipation efficiency can be improved. The semiconductor device has a semiconductor chip, a lead having an inner lead and an a outer lead continuing to the inner lead, said inner lead having a thin plate portion thinner than the other portion therof, said thin plate portion being electrically connected to said semiconductor chip through a wire and said outer lead serving as an outer connecting terminal, and a sealing resin sealing said semiconductor chip and at least a part of said lead, wherin said inner lead of said lead is positioned on said semiconductor chip.
Inventors
- 👤 Akihiro Kubota
- 👤 Yuichi Asano
- 👤 Koichi Sibasaki
- 👤 Kazuhiro Yonetake
- 👤 Tsuyoshi Aoki
- 👤 Akira Takashima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 15:52
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W70/424; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/5366; H10W72/541; H10W72/5453; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W74/00; H10W74/10; H10W74/131; H10W74/142; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
97 words
A semiconductor device comprising: a semiconductor chip; a lead having an inner lead and an outer lead continuing to said inner lead, said inner lead having a thin plate portion thinner than the rest of the lead, said thin plate portion being electrically connected to said semiconductor chip through a wire and said outer lead serving as an outer connecting terminal; and a sealing resin sealing said semiconductor chip and at least a part of said lead; wherein said inner lead of said lead is positioned so as to directly contact a surface of said semiconductor chip.
Claim 2
Dependent Claim
97 words
A semiconductor device comprising: a semiconductor chip; a lead having an inner lead and an outer lead continuing to said inner lead, said inner lead having a thin plate portion thinner than the rest of the lead, said thin plate portion being electrically connected to said semiconductor chip through a wire and said outer lead serving as an outer connecting terminal; and a sealing resin sealing said semiconductor chip and at least a part of said lead; wherein said inner lead of said lead is positioned so as to directly contact a surface of said semiconductor chip.
Claim 3
Dependent Claim
31 words
The semiconductor device according to claim 1, wherein said wire has a looped shape whose height is lower than that of said lead except where said thin plate portion is formed.
Claim 4
Dependent Claim
24 words
The semiconductor device according to claim 1, wherein said lead except where said thin plate portion is formed is exposed from said sealing resin.
Claim 5
Dependent Claim
24 words
The semiconductor device according to claim 2, wherein said lead except where said thin plate portion is formed is exposed from said sealing resin.
Claim 6
Dependent Claim
25 words
The semiconductor device according to claim 1, wherein said thin plate portion is reduced in thickness intermittently toward a tip end of said inner lead.
Claim 7
Dependent Claim
25 words
The semiconductor device according to claim 2, wherein said thin plate portion is reduced in thickness intermittently toward a tip end of said inner lead.
Claim 8
Dependent Claim
25 words
The semiconductor device according to claim 3, wherein said thin plate portion is reduced in thickness intermittently toward a tip end of said inner lead.
Claim 9
Dependent Claim
25 words
The semiconductor device according to claim 4, wherein said thin plate portion is reduced in thickness intermittently toward a tip end of said inner lead.
Claim 10
Dependent Claim
30 words
The semiconductor device according to claim 1, wherein said thin plate portion has a tapered shape which is reduced in thickness gradually toward a tip end of said inner lead.
Claim 11
Dependent Claim
30 words
The semiconductor device according to claim 2, wherein said thin plate portion has a tapered shape which is reduced in thickness gradually toward a tip end of said inner lead.
Claim 12
Dependent Claim
30 words
The semiconductor device according to claim 3, wherein said thin plate portion has a tapered shape which is reduced in thickness gradually toward a tip end of said inner lead.
Claim 13
Dependent Claim
30 words
The semiconductor device according to claim 4, wherein said thin plate portion has a tapered shape which is reduced in thickness gradually toward a tip end of said inner lead.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-09 | 2002-05-11 | 2002-11-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-09 | 2006-05-11 | 2006-11-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-09 | 2010-05-11 | 2010-11-10 | $7700.00 | Window Closed / Lapsed |