US3778685A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit package with lead structure and method of preparing the same
Assignee: National Aeronautics and Space Administration
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Filing: 1972-03-27
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Granted: 1973-12-11
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Expires: 1992-03-27
Abstract
Abstract A beam-lead integrated circuit package assembly including a beam-lead integrated circuit chip, a lead frame array bonded to projecting fingers of the chip, a rubber potting compound disposed around the chip and an encapsulating molded plastic. The lead frame array is prepared by photographic printing of a lead pattern on a base metal sheet, selectively etching to remove metal between leads and plating with gold. Joining of the chip to the lead frame array is carried out by thermocompression bonding of mating gold-plated surfaces. A small amount of silicone rubber is then applied to cover the chip and bonded joints, and the package is encapsulated with epoxy resin, applied by molding.
Inventors
- 👤 B Kennedy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 17:37
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/464; H10W70/466; H10W72/00; H10W72/60; H10W74/00; H10W74/10; H10W74/111; H10W74/121
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
14 words
The assembly of claim 1 wherein said rubbery potting compound is a silicone polymer.
Claim 2
Dependent Claim
13 words
The assembly of claim 2 wherein said molded plastic is an epoxy resin.
Claim 3
Dependent Claim
14 words
The assembly of claim 3 wherein said base metal sheet is a Kovar alloy.
Claim 4
Dependent Claim
15 words
The assembly of claim 4 wherein said base metal sheet is about 5 mils thick.
Claim 5
Dependent Claim
19 words
The assembly of claim 5 wherein the gold plating on said base metal sheet is about 5 microns thick.
References Cited (Backward Citations)
US3440027A
Cited
US3544857A
Cited
US3441813A
Cited
US3475814A
Cited
US3594619A
Cited
US3559285A
Cited
US3659035A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-12-10 | 1977-06-11 | 1977-12-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-12-10 | 1981-06-11 | 1981-12-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-12-10 | 1985-06-11 | 1985-12-11 | $7700.00 | Window Closed / Lapsed |