Patent US1356742A successfully refreshed from Google Patents.
Patent US2305200A successfully refreshed from Google Patents.
US5583372A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Adhesion enhanced semiconductor die for mold compound packaging
Assignee: Micron Technology Inc
•
Filing: 1994-09-14
•
Granted: 1996-12-10
•
Expires: 2014-09-14
Abstract
Abstract A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with a layer or layers of copper (Cu) and/or palladium (Pd) by electroplating or electroless coating techniques. The metal layer provides a uniform wetting surface for better adhesion of the die with the mold compound during encapsulation. The increased adhesion reduces delamination potential of the die from the package.
Inventors
- 👤 Jerrold L. King
- 👤 J. Mike Brooks
- 👤 Walter L. Moden
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 06:10
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W74/00; H10W74/10; H10W74/111; H10W74/127; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/853; H10W72/865; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
70 words
A semiconductor die in a semiconductor package having no lead frame paddle for supporting the die, the die comprising a frontside and a backside, the frontside having integrated circuitry disposed thereon, and the backside having a plurality of metal layers deposited thereon for enhancing adhesion to the semiconductor package, and wherein each of the plurality of metal layers is selected from the group consisting of palladium (Pd) and copper (Cu).
Claim 2
Dependent Claim
70 words
A semiconductor die in a semiconductor package having no lead frame paddle for supporting the die, the die comprising a frontside and a backside, the frontside having integrated circuitry disposed thereon, and the backside having a plurality of metal layers deposited thereon for enhancing adhesion to the semiconductor package, and wherein each of the plurality of metal layers is selected from the group consisting of palladium (Pd) and copper (Cu).
Claim 3
Dependent Claim
19 words
The semiconductor die of claim 1 wherein any one of the plurality of metal layers is an electroplated layer.
Claim 4
Dependent Claim
20 words
The semiconductor die of claim 1 wherein any one of the plurality of metal layers is an electroless coating layer.
Claim 5
Dependent Claim
28 words
The semiconductor die of claim 1 wherein an exposed surface of the plurality of metal layers provides a uniform wetting surface for enhancing adhesion to the semiconductor package.
Claim 6
Dependent Claim
23 words
The semiconductor die of claim 1 wherein at least an exposed surface layer of the plurality of metal layers is substantially oxide free.
Claim 7
Dependent Claim
44 words
The semiconductor die of claim 1 wherein the plurality of metal layer comprises approximately 50 micro inches of a Cu layer deposited over the backside of the die and approximately 2 to 3 micro inches of a Pd layer deposited over the Cu layer.
Claim 8
Dependent Claim
14 words
The semiconductor die of claim 1 wherein the semiconductor package includes a mold compound.
Claim 9
Dependent Claim
83 words
A semiconductor die in a semiconductor package having no lead frame paddle for supporting the die, the die comprising a plurality of metal layers deposited thereon wherein at least an exposed surface layer of the plurality of metal layers is substantially oxide-free and provides a uniform wetting surface for increased adhesion between the die and a mold compound of the semiconductor package, and wherein each of the plurality of metal layers is selected from the group consisting of palladium (Pd) and copper (Cu).
Claim 10
Dependent Claim
83 words
A semiconductor die in a semiconductor package having no lead frame paddle for supporting the die, the die comprising a plurality of metal layers deposited thereon wherein at least an exposed surface layer of the plurality of metal layers is substantially oxide-free and provides a uniform wetting surface for increased adhesion between the die and a mold compound of the semiconductor package, and wherein each of the plurality of metal layers is selected from the group consisting of palladium (Pd) and copper (Cu).
Claim 11
Dependent Claim
19 words
The semiconductor die of claim 8 wherein any one of the plurality of metal layers is an electroplated layer.
Claim 12
Dependent Claim
20 words
The semiconductor die of claim 8 wherein any one of the plurality of metal layers is an electroless coating layer.
Claim 13
Dependent Claim
37 words
The semiconductor die of claim 8 wherein the plurality of metal layers comprises approximately 50 micro inches of a Cu layer and approximately 2 to 3 micro inches of a Pd layer deposited over the Cu layer.
References Cited (Backward Citations)
US3686539A
Cited
US3902148A
Cited
US4024570A
Cited
US5313102A
Cited
JPH0499362A
Cited
US5227661A
Cited
JPH04162551A
Cited
US5360991A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-10 | 2000-06-10 | 2000-12-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-10 | 2004-06-10 | 2004-12-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-10 | 2008-06-10 | 2008-12-10 | $7700.00 | Window Closed / Lapsed |